Patents by Inventor Eric J. Dickes

Eric J. Dickes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110259951
    Abstract: A method for tracing individual dies within stacked chip scale packages includes the steps of recording unique die identifiers from layers of marked dies and associating the unique identifiers with a die bonding substrate and the resulting die or stacked chip scale packages. The unique die identifiers are also associated with wafer numbers, x-y positions on a wafer, wafer lot numbers or any combination thereof.
    Type: Application
    Filed: April 26, 2010
    Publication date: October 27, 2011
    Applicant: MEDTRONIC, INC.
    Inventors: Charles M. Meyerson, Eric J. Dickes, William V. Gorton, Stephen W. Graham, Kenneth Heames, Dennis B. Johnson, Christopher D. Ohme, Steven C. Warren
  • Patent number: 4510461
    Abstract: A phase lock circuit including a phase/frequency detector, a plurality of selectable filters, and a plurality of variable frequency signal generators connected in a loop to lock an output signal to an input signal. An out-of-frequency-range condition detector is provided to facilitate automatic selection of an appropriate in-range combination of filter and signal generator to cause lock to occur.
    Type: Grant
    Filed: July 22, 1982
    Date of Patent: April 9, 1985
    Assignee: Tektronix, Inc.
    Inventors: Eric J. Dickes, Thomas C. Hill, III, Robert T. Flegal