Abstract: A fiber-optic device package structure includes at least one, and typically several, optical stage subassemblies, and a housing in which each optical stage subassembly is received in a parallel, facing arrangement. Each optical stage subassembly has a thermnal/structural plate, an annular plurality of turns of a fiber-optic fiber supported on the thermal/structural plate, and a light connector to the fiber-optic fiber. Preferably, the annular plurality of turns is formed as a freestanding annulus of the plurality of turns of the fiber-optic fiber encapsulated within an encapsulant.

Abstract: An electronic assembly is fabricated by tinning a solder to the electrical bonding pads of a printed circuit board, and applying an adhesive, preferably a filled polyurethane adhesive, to the component that is to be bonded to the printed circuit board. The component is contacted to its bonding location on the printed circuit board, and the electrical contact on the component is contacted to the tinned bonding pads. The assembly is heated in a single solder temperature/time reflow cycle to simultaneously cure the adhesive and solder the electrical contacts to the bonding pads.