Patents by Inventor Eric Kuerzel

Eric Kuerzel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device with semiconductor chip and adhesive film and method for producing the same
    Patent number: 7470601
    Abstract: A semiconductor device includes a semiconductor chip and an adhesive film between the back side of the semiconductor chip and a chip pad of a leadframe. The adhesive film includes a film core and adhesive layers that cover both sides of the film core. The film core includes a brittle, fragile hard material.
    Type: Grant
    Filed: October 6, 2006
    Date of Patent: December 30, 2008
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Ludwig Heitzer, Eric Kuerzel, Peter Strobel
  • Semiconductor device with semiconductor chip and adhesive film and method for producing the same
    Publication number: 20070082463
    Abstract: A semiconductor device includes a semiconductor chip and an adhesive film between the back side of the semiconductor chip and a chip pad of a leadframe. The adhesive film includes a film core and adhesive layers that cover both sides of the film core. The film core includes a brittle, fragile hard material.
    Type: Application
    Filed: October 6, 2006
    Publication date: April 12, 2007
    Inventors: Michael Bauer, Ludwig Heitzer, Eric Kuerzel, Peter Strobel