Abstract: A facility for performing setpoint adjustment-based duty cycling techniques by adjusting the setpoint of a device or component is described. The facility reduces energy consumption for a system, such as an HVAC system, or device by adjusting or modulating an associated setpoint or temperature setting. The facility modulates the setpoint between a base setpoint value and another setpoint value based on a mode of the system. When the system is in a cooling mode, the facility modulates the temperature between the base setpoint value and a higher setpoint value. When the system is in heating mode, the facility modulates the temperature between the base setpoint value and a lower setpoint value. The facility may modulate the setpoint between the two setpoint values based on an offset value or a fixed setpoint value.

Abstract: A facility for performing setpoint adjustment-based duty cycling techniques by adjusting the setpoint of a device or component is described. The facility reduces energy consumption for a system, such as an HVAC system, or device by adjusting or modulating an associated setpoint or temperature setting. The facility modulates the setpoint between a base setpoint value and another setpoint value based on a mode of the system. When the system is in a cooling mode, the facility modulates the temperature between the base setpoint value and a higher setpoint value. When the system is in heating mode, the facility modulates the temperature between the base setpoint value and a lower setpoint value. The facility may modulate the setpoint between the two setpoint values based on an offset value or a fixed setpoint value.

Abstract: A facility for performing setpoint adjustment-based duty cycling techniques by adjusting the setpoint of a device or component is described. The facility reduces energy consumption for a system, such as an HVAC system, or device by adjusting or modulating an associated setpoint or temperature setting. The facility modulates the setpoint between a base setpoint value and another setpoint value based on a mode of the system. When the system is in a cooling mode, the facility modulates the temperature between the base setpoint value and a higher setpoint value. When the system is in heating mode, the facility modulates the temperature between the base setpoint value and a lower setpoint value. The facility may modulate the setpoint between the two setpoint values based on an offset value or a fixed setpoint value.

Abstract: A facility for performing setpoint adjustment-based duty cycling techniques by adjusting the setpoint of a device or component is described. The facility reduces energy consumption for a system, such as an HVAC system, or device by adjusting or modulating an associated setpoint or temperature setting. The facility modulates the setpoint between a base setpoint value and another setpoint value based on a mode of the system. When the system is in a cooling mode, the facility modulates the temperature between the base setpoint value and a higher setpoint value. When the system is in heating mode, the facility modulates the temperature between the base setpoint value and a lower setpoint value. The facility may modulate the setpoint between the two setpoint values based on an offset value or a fixed setpoint value.

Abstract: A facility for performing setpoint adjustment-based duty cycling techniques by adjusting the setpoint of a device or component is described. The facility reduces energy consumption for a system, such as an HVAC system, or device by adjusting or modulating an associated setpoint or temperature setting. The facility modulates the setpoint between a base setpoint value and another setpoint value based on a mode of the system. When the system is in a cooling mode, the facility modulates the temperature between the base setpoint value and a higher setpoint value. When the system is in heating mode, the facility modulates the temperature between the base setpoint value and a lower setpoint value. The facility may modulate the setpoint between the two setpoint values based on an offset value or a fixed setpoint value.

Abstract: A facility for performing setpoint adjustment-based duty cycling techniques by adjusting the setpoint of a device or component is described. The facility reduces energy consumption for a system, such as an HVAC system, or device by adjusting or modulating an associated setpoint or temperature setting. The facility modulates the setpoint between a base setpoint value and another setpoint value based on a mode of the system. When the system is in a cooling mode, the facility modulates the temperature between the base setpoint value and a higher setpoint value. When the system is in heating mode, the facility modulates the temperature between the base setpoint value and a lower setpoint value. The facility may modulate the setpoint between the two setpoint values based on an offset value or a fixed setpoint value.

Abstract: A facility for performing setpoint adjustment-based duty cycling techniques by adjusting the setpoint of a device or component is described. The facility reduces energy consumption for a system, such as an HVAC system, or device by adjusting or modulating an associated setpoint or temperature setting. The facility modulates the setpoint between a base setpoint value and another setpoint value based on a mode of the system. When the system is in a cooling mode, the facility modulates the temperature between the base setpoint value and a higher setpoint value. When the system is in heating mode, the facility modulates the temperature between the base setpoint value and a lower setpoint value. The facility may modulate the setpoint between the two setpoint values based on an offset value or a fixed setpoint value.

Abstract: A facility for performing setpoint adjustment-based duty cycling techniques by adjusting the setpoint of a device or component is described. The facility reduces energy consumption for a system, such as an HVAC system, or device by adjusting or modulating an associated setpoint or temperature setting. The facility modulates the setpoint between a base setpoint value and another setpoint value based on a mode of the system. When the system is in a cooling mode, the facility modulates the temperature between the base setpoint value and a higher setpoint value. When the system is in heating mode, the facility modulates the temperature between the base setpoint value and a lower setpoint value. The facility may modulate the setpoint between the two setpoint values based on an offset value or a fixed setpoint value.

Abstract: The present invention can provide a method, apparatus, and system for providing energy usage information to a user. One embodiment displays, on a display interface of a display device, a virtual analog clock and receives energy usage data for a metered environment. A graphical representation of a first level of the energy usage data is displayed on the face of the virtual analog clock, with the graphical representation including at least one display element.

Abstract: A computer-implemented method of verifying isolation between a plurality of modules of a circuit design to be implemented within an integrated circuit can include identifying a first module and at least a second module of the circuit design for the integrated circuit. One or more circuit attributes indicative of isolation between the first module and the second module can be identified and compared with at least one isolation criterion. An indication of whether the first module is isolated from the second module can be output according to results of the comparison.

Abstract: Method, apparatus, and computer readable medium for circuit design for a programmable device is described. In one example, a logical description of a circuit design having static logic and reconfigurable logic is imported into a graphical environment. The circuit design is processed in the graphical environment. In particular, the logical description is floorplanned to locate the static logic and the reconfigurable logic in a floorplan of the programmable device. At least one design rule check (DRC) is performed. A partial reconfiguration implementation of the circuit design is then managed for the programmable device.

Abstract: A method of implementing a circuit design can include selecting the circuit design to be implemented, wherein the circuit design comprises a plurality of partitions, and receiving a user input specifying a value of a partition property. The partition property can be associated with a selected one of the plurality of partitions of the circuit design. The method also can include performing an incremental implementation flow upon the circuit design for implementation by, at least in part, selectively modifying portions of a prior implementation of the selected partition in accordance with the value of the partition property.

Abstract: The present invention relates to integrated circuit packaging useful for programmable logic devices. The invention provides a migration path between a base integrated circuit and an extended integrated circuit that is a functional superset of the base. In the case of a programmable logic device (PLD), the pin element layout for a base integrated circuit provides for the connection of power, control, and I/O signals. Pins conducting power signals are located at the core of the base pin layout. Pins conducting control signals are located near the intersections of the horizontal and vertical axes of the layout and the perimeter of the layout. Remaining pins conduct I/O signals. The pin element layout for an extended integrated circuit subsumes the base pin element layout. Additional pins for conducting power signals are located near one or more diagonal axes of the extended pin element layout.

Abstract: A programmable input/output cell (I/O cell) for use with integrated circuits, and in particular programmable logic devices, is presented comprising input receiver circuitry, output driver circuitry and programmable elements. The input receiver and output driver circuitry each include multiple receivers/drivers that provide an interface between the signaling level of the integrated circuit and at least two other signaling standards. The programmable elements may be programmed to select a different signaling standard for each I/O cell to operate at, if desired. For instance, adjacent I/O cells may be connected to two different bus structures that utilize different signaling levels. The invention enables one I/O cell to translate between the PLD signaling level and the first bus signaling level, while the second I/O cell translates between the integrated circuit signaling level and the second bus signaling level.

Abstract: The present invention relates to integrated circuit packaging useful for programmable logic devices. The invention provides a migration path between a base integrated circuit and an extended integrated circuit that is a functional superset of the base. In the case of a programmable logic device (PLD), the pin element layout for a base integrated circuit provides for the connection of power, control, and I/O signals. Pins conducting power signals are located at the core of the base pin layout. Pins conducting control signals are located near the intersections of the horizontal and vertical axes of the layout and the perimeter of the layout. Remaining pins conduct I/O signals. The pin element layout for an extended integrated circuit subsumes the base pin element layout. Additional pins for conducting power signals are located near one or more diagonal axes of the extended pin element layout.

Abstract: The present invention relates to integrated circuit packaging useful for programmable logic devices. The invention provides a migration path between a base integrated circuit and an extended integrated circuit that is a functional superset of the base. In the case of a programmable logic device (PLD), the pin element layout for a base integrated circuit provides for the connection of power, control, and I/O signals. Pins conducting power signals are located at the core of the base pin layout. Pins conducting control signals are located near the intersections of the horizontal and vertical axes of the layout and the perimeter of the layout. Remaining pins conduct I/O signals. The pin element layout for an extended integrated circuit subsumes the base pin element layout. Additional pins for conducting power signals are located near one or more diagonal axes of the extended pin element layout.

Abstract: A programmable input/output cell (I/O cell) for use with integrated circuits, and in particular programmable logic devices, is presented comprising input receiver circuitry, output driver circuitry and programmable elements. The input receiver and output driver circuitry each include multiple receivers/drivers that provide an interface between the signaling level of the integrated circuit and at least two other signaling standards. The programmable elements may be programmed to select a different signaling standard for each I/O cell to operate at, if desired. For instance, adjacent I/O cells may be connected to two different bus structures that utilize different signaling levels. The invention enables one I/O cell to translate between the PLD signaling level and the first bus signaling level, while the second I/O cell translates between the integrated circuit signaling level and the second bus signaling level.

Abstract: A programmable input/output cell (I/O cell) for use with integrated circuits, and in particular programmable logic devices, is presented comprising input receiver circuitry, output driver circuitry and programmable elements. The input receiver and output driver circuitry each include multiple receivers/drivers that provide an interface between the signaling level of the integrated circuit and at least two other signaling standards. The programmable elements may be programmed to select a different signaling standard for each I/O cell to operate at, if desired. For instance, adjacent I/O cells may be connected to two different bus structures that utilize different signaling levels. The invention enables one I/O cell to translate between the PLD signaling level and the first bus signaling level, while the second I/O cell translates between the integrated circuit signaling level and the second bus signaling level.