Abstract: A host networking device networking interface is automatically configured. The interface is initially configured to operate in a single-link mode in which multiple network communication lanes of the interface cooperatively provide a single communication link. If a signal is not present on any communication lane, then the interface is configured to operate in a multiple-link mode in which each lane provides a separate and different communication link, and is operated in the multiple-link mode. If a signal is present on every communication lane, and if the single communication link has been established with another networking device over all the lanes, then the interface is operated in the single-link mode. If a signal is present on every communication lane, but if the single communication link has not been established over all the lanes, then the interface is configured to operate in the multiple-link mode and is operated in the multiple-link mode.

Abstract: A high bandwidth signal probe device and a method of probing a high bandwidth signal are provided. The high bandwidth signal probe device includes a probe tip for probing a stub of a backdrilled via of a printed circuit board. The probe tip is adapted to fit in the backdrilled via. The probe tip has a length adapted to reach the stub of the backdrilled via. The probe tip is adapted to contact a plated portion of the stub of the backdrilled via. A resistive element is associated with the probe tip. The method includes inserting a probe tip of a signal probe device in the backdrilled via, placing the probe tip in contact with a plated portion of the stub of the backdrilled via, and receiving an electrical signal through a path which includes a resistive element of the probe tip of the signal probe device.

Abstract: A circuit board has a first side and a second side opposite thereto. The board includes vias extending through the substrate from the first side to the second side, and via contact pads on the second side, each of which surrounds a corresponding via. The board includes a pair of surface mount contact pads on the second side. Each surface mount contact pad has a surface area and edges, each of which can have a shape to maximize the surface area while maintaining predetermined minimum separation distances. Each edge except one or more edges that are opposite another surface mount contact pad have a curved shape, and each edge opposite another surface mount contact pad have a linear shape. Curved edges adjacently opposite corresponding via contact pads can have curved shapes can have concave shapes, and curved edges not adjacently opposite via contact pads can have convex shapes.

Abstract: Embodiments of the present invention disclose a method, computer program product, and system for imaging radio and microwave electromagnetic radiation using a two-dimensional sensor array. A computing system receives a readout signal from one or more of a plurality of frequency sensors, arranged in a two-dimensional array, that have the ability to detect an image of focused radio and microwave frequency radiation. The computing system maps the readout signal of each of the plurality of sensors to a location corresponding to the physical location of the sensor on the two-dimensional array. The computing system converts the readout signal into a computer readable image.

Abstract: Embodiments of the present invention provide for a transmission line stub that includes a via stub of a conductive via. The conductive via includes a via stub and a coupling element, wherein a first transmission line configured to transmit a signal is coupled to the conductive via at the intersection of the via stub and the coupling element. The coupling element is configured to transmit the signal from the first transmission line. A line stub electrically coupled to the via stub, wherein the length of the line stub is selected such that the transmission line stub having a length of the sum of the lengths of the via stub and the line stub is configured to suppress a preselected frequency.

Abstract: A circuit board has a first side and a second side opposite thereto. The board includes vias extending through the substrate from the first side to the second side, and via contact pads on the second side, each of which surrounds a corresponding via. The board includes a pair of surface mount contact pads on the second side. Each surface mount contact pad has a surface area and edges, each of which can have a shape to maximize the surface area while maintaining predetermined minimum separation distances. Each edge except one or more edges that are opposite another surface mount contact pad have a curved shape, and each edge opposite another surface mount contact pad have a linear shape. Curved edges adjacently opposite corresponding via contact pads can have curved shapes can have concave shapes, and curved edges not adjacently opposite via contact pads can have convex shapes.

Abstract: A host networking device networking interface is automatically configured. The interface is initially configured to operate in a single-link mode in which multiple network communication lanes of the interface cooperatively provide a single communication link. If a signal is not present on any communication lane, then the interface is configured to operate in a multiple-link mode in which each lane provides a separate and different communication link, and is operated in the multiple-link mode. If a signal is present on every communication lane, and if the single communication link has been established with another networking device over all the lanes, then the interface is operated in the single-link mode. If a signal is present on every communication lane, but if the single communication link has not been established over all the lanes, then the interface is configured to operate in the multiple-link mode and is operated in the multiple-link mode.

Abstract: A host networking device networking interface is automatically configured. The interface is initially configured to operate in a single-link mode in which multiple network communication lanes of the interface cooperatively provide a single communication link. If a signal is not present on any communication lane, then the interface is configured to operate in a multiple-link mode in which each lane provides a separate and different communication link, and is operated in the multiple-link mode. If a signal is present on every communication lane, and if the single communication link has been established with another networking device over all the lanes, then the interface is operated in the single-link mode. If a signal is present on every communication lane, but if the single communication link has not been established over all the lanes, then the interface is configured to operate in the multiple-link mode and is operated in the multiple-link mode.

Abstract: Embodiments of the present invention provide for a transmission circuit that includes a transmission line and a conductive via. The transmission line is electrically coupled to a first conductive via and a second conductive via. The first conductive via includes a first via stub, wherein the transmission line is configured to transmit a signal that is coupled to the first conductive via, and wherein the first via stub extends beyond the transmission line. The second conductive via includes a second via stub, wherein the transmission line is configured to transmit a signal that is coupled to the second conductive via, and wherein the second via stub extends beyond the transmission line. A transmission line stub is electrically coupled to the transmission line or to at least one of the conductive vias, wherein the length of the transmission line stub is configured to suppress a preselected frequency.

Abstract: A differential transmission line with a common mode notch filter includes adjacently arranged, repeating differential transmission line pair sections. The sections have lengths that are each equal to half of an electric wavelength of a lowest frequency of a common mode electromagnetic wave to be suppressed during transmission of an electric signal over the differential transmission line. Each section includes a pair of conductors separated from one another by a spacing. The width of each conductor and the spacing between the conductors of each section vary over the length thereof according to a same pattern such that at every point over the length of each section a differential mode impedance of the differential transmission line is identical. A common mode impedance of the differential transmission line changes periodically in accordance with the lengths of the sections.

Abstract: Embodiments of the present invention provide for a transmission line stub that includes a via stub of a conductive via. The conductive via includes a via stub and a coupling element, wherein a first transmission line configured to transmit a signal is coupled to the conductive via at the intersection of the via stub and the coupling element. The coupling element is configured to transmit the signal from the first transmission line. A line stub electrically coupled to the via stub, wherein the length of the line stub is selected such that the transmission line stub having a length of the sum of the lengths of the via stub and the line stub is configured to suppress a preselected frequency.

Abstract: Embodiments of the present invention provide for a transmission circuit that includes a transmission line and a conductive via. The transmission line is electrically coupled to a first conductive via and a second conductive via. The first conductive via includes a first via stub, wherein the transmission line is configured to transmit a signal that is coupled to the first conductive via, and wherein the first via stub extends beyond the transmission line. The second conductive via includes a second via stub, wherein the transmission line is configured to transmit a signal that is coupled to the second conductive via, and wherein the second via stub extends beyond the transmission line. A transmission line stub is electrically coupled to the transmission line or to at least one of the conductive vias, wherein the length of the transmission line stub is configured to suppress a preselected frequency.

Abstract: The present invention proposes methods and structures for designing electronic circuit elements for frequency suppression of electromagnetic waves using a transmission line grating. The method includes determining a frequency to be suppressed. Using the electrical wavelength of the frequency to be suppressed, determine a length of a plurality of equal length sections of the differential transmission lines is determined. Using the frequency to be suppressed and the electronic circuit requirements, determine a set of properties for the plurality of equal length sections of the differential transmission lines. The transmission line grating is created using a plurality of alternating equal length sections of the differential transmission lines.

Abstract: The present invention relates to circuit boards and, more specifically, circuit boards with vias (i.e. via holes) exhibiting reduced via capacitance. In one embodiment, the present invention provides a circuit board comprising a first electrically conductive trace, a second electrically conductive trace, a via hole including electrically conductive material thereon, and a coupling element that electrically connects the first trace to the second trace. The coupling element comprises a segment of the via hole that bridges the first trace and the second trace, wherein the via hole segment is a remainder of the via hole after removal of a portion of the via hole.

Abstract: Embodiments of the present invention disclose a method, computer program product, and system for imaging radio and microwave electromagnetic radiation using a two-dimensional sensor array. A computing system receives a readout signal from one or more of a plurality of frequency sensors, arranged in a two-dimensional array, that have the ability to detect an image of focused radio and microwave frequency radiation. The computing system maps the readout signal of each of the plurality of sensors to a location corresponding to the physical location of the sensor on the two-dimensional array. The computing system converts the readout signal into a computer readable image.

Abstract: A method is used for designing a multilayered circuit substrate that generates a physical design layout. The physical design layout represents of at least one electrical circuit passing through a plurality of layers. Based on performance requirements of the electrical circuit, a maximum allowable stub length of a via in the electrical circuit is computed. The computer processor determines if a stub length of an existing via in the physical design layout of the electrical circuit is less than the maximum allowable stub length. If the computer determines that the stub length of the existing via is less than the maximum allowable stub length, the computer removes an external non-functional pad of the existing via from the physical design layout.

Abstract: The present invention relates to circuit boards and, more specifically, a process for providing electrical connections with reduced via capacitance on circuit boards. In one embodiment, the present invention provides a method for providing an electrical connection between traces disposed on different layers of a circuit board, the method comprising forming in the board a via hole that extends between the different layers and interconnects a pair of electrically conductive traces disposed on the different layers. An inner sidewall of the via hole includes electrically conductive material thereon. The method further comprises removing a first portion of the conductive material from the inner sidewall by removing a first portion of the inner sidewall. A remaining portion of the conductive material on a remaining portion of the inner sidewall interconnects the pair of traces and has a corresponding width that is substantially similar to a width of each trace.

Abstract: A high bandwidth signal probe device and a method of probing a high bandwidth signal are provided. The high bandwidth signal probe device includes a probe tip for probing a stub of a backdrilled via of a printed circuit board. The probe tip is adapted to fit in the backdrilled via. The probe tip has a length adapted to reach the stub of the backdrilled via. The probe tip is adapted to contact a plated portion of the stub of the backdrilled via. A resistive element is associated with the probe tip. The method includes inserting a probe tip of a signal probe device in the backdrilled via, placing the probe tip in contact with a plated portion of the stub of the backdrilled via, and receiving an electrical signal through a path which includes a resistive element of the probe tip of the signal probe device.

Abstract: A host networking device networking interface is automatically configured. The interface is initially configured to operate in a single-link mode in which multiple network communication lanes of the interface cooperatively provide a single communication link. If a signal is not present on any communication lane, then the interface is configured to operate in a multiple-link mode in which each lane provides a separate and different communication link, and is operated in the multiple-link mode. If a signal is present on every communication lane, and if the single communication link has been established with another networking device over all the lanes, then the interface is operated in the single-link mode. If a signal is present on every communication lane, but if the single communication link has not been established over all the lanes, then the interface is configured to operate in the multiple-link mode and is operated in the multiple-link mode.

Abstract: The present invention relates to circuit boards and, more specifically, a process for providing electrical connections with reduced via capacitance on circuit boards. In one embodiment, the present invention provides a method for providing an electrical connection between traces disposed on different layers of a circuit board, the method comprising forming in the circuit board a via hole that interconnects a first electrically conductive trace and a second electrically conductive trace. The via hole includes electrically conductive material thereon. The method further comprises removing a portion of the electrically conductive material from the via hole.