Patents by Inventor Eric Rieder
Eric Rieder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240017294Abstract: There is provided an ultrasonic transducer having a sample-contacting portion and a back portion, the back portion being opposed to the sample contacting portion. The transducer includes a piezoelectric material configured to be in acoustic communication with a sample and a backing structure in acoustic communication with the piezoelectric material. The backing structure is configured to reflect acoustic energy towards the sample-contacting portion and away from the back portion of the ultrasonic transducer. The backing structure includes a low acoustic impedance layer and a high acoustic impedance layer. The transducer may also include a second dual layer de-matching backing. The second dual layer de-matching backing includes a second low acoustic impedance layer and a second high acoustic impedance layer.Type: ApplicationFiled: November 17, 2020Publication date: January 18, 2024Applicant: RESONANT ACOUSTICS INTERNATIONAL INC.Inventors: Nicholas Chris CHAGGARES, Varak KALIAN, Eric RIEDER
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Patent number: 11845108Abstract: The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein.Type: GrantFiled: March 23, 2020Date of Patent: December 19, 2023Assignee: FUJIFILM SonoSite, Inc.Inventors: N. Christopher Chaggares, Eric Rieder
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Publication number: 20200222941Abstract: The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein.Type: ApplicationFiled: March 23, 2020Publication date: July 16, 2020Applicant: FUJIFILM SONOSITE, INC.Inventors: N. Christopher Chaggares, Eric Rieder
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Patent number: 10596597Abstract: The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein.Type: GrantFiled: January 27, 2017Date of Patent: March 24, 2020Assignee: Fujifilm Sonosite, Inc.Inventors: N. Christopher Chaggares, Eric Rieder
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Patent number: 9907538Abstract: A high frequency ultrasound probe includes a substrate having a number of transducer elements on it and a ground plane that is electrically coupled by one or more vias to a conductive frame that supports the substrate. The conductive frame is electrically coupled to a ground plane of a printed circuit having conductors that are coupled to the transducer elements.Type: GrantFiled: February 23, 2017Date of Patent: March 6, 2018Assignee: FUJIFILM SonoSite, Inc.Inventors: Nicholas Christopher Chaggares, Eric Rieder
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Publication number: 20170224306Abstract: A high frequency ultrasound probe includes a substrate having a number of transducer elements on it and a ground plane that is electrically coupled by one or more vias to a conductive frame that supports the substrate. The conductive frame is electrically coupled to a ground plane of a printed circuit having conductors that are coupled to the transducer elements.Type: ApplicationFiled: February 23, 2017Publication date: August 10, 2017Inventors: Nicholas Christopher Chaggares, Eric Rieder
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Publication number: 20170197232Abstract: The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein.Type: ApplicationFiled: January 27, 2017Publication date: July 13, 2017Inventors: N. Christopher Chaggares, Eric Rieder
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Patent number: 9603580Abstract: A high frequency ultrasound probe includes a substrate having a number of transducer elements on it and a ground plane that is electrically coupled by one or more vias to a conductive frame that supports the substrate. The conductive frame is electrically coupled to a ground plane of a printed circuit having conductors that are coupled to the transducer elements.Type: GrantFiled: May 23, 2014Date of Patent: March 28, 2017Assignee: FUJIFILM SonoSite, Inc.Inventors: Nicholas Christopher Chaggares, Eric Rieder
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Patent number: 9555443Abstract: The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein.Type: GrantFiled: October 26, 2015Date of Patent: January 31, 2017Assignee: FUJIFILM SonoSite, Inc.Inventors: N. Christopher Chaggares, Eric Rieder
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Publication number: 20160107193Abstract: The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein.Type: ApplicationFiled: October 26, 2015Publication date: April 21, 2016Inventors: N. Christopher Chaggares, Eric Rieder
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Publication number: 20140350407Abstract: A high frequency ultrasound probe includes a substrate having a number of transducer elements on it and a ground plane that is electrically coupled by one or more vias to a conductive frame that supports the substrate. The conductive frame is electrically coupled to a ground plane of a printed circuit having conductors that are coupled to the transducer elements.Type: ApplicationFiled: May 23, 2014Publication date: November 27, 2014Applicant: FUJIFILM SONOSITE, INC.Inventors: Nicholas Christopher Chaggares, Eric Rieder