Abstract: An axial roller bearing assembly is provided. The axial roller bearing assembly has a first axial washer including a first race surface and a second axial washer including a thrust surface. The first axial washer and the second axial washer form a housing space. The axial roller bearing assembly also has a third axial washer disposed in the housing space between the first axial washer and the second axial washer and including a second race surface. A bearing element also disposed in the housing space has a cage and a plurality of rollers in contact with the first race surface and the second race surface. A damping layer is also disposed in the housing space and is in contact with the second axial washer and the third axial washer. The damping layer inhibits vibration from transferring between the third axial washer and the second axial washer.

Abstract: A roller thrust bearing including a first ring including a first radial portion, and a second ring including a radially inner flange and a second radial portion is provided. Rolling elements each having a length are supported between the first ring and the second ring. A cage including an annular body defines a plurality of pockets, and the rolling elements are located in at least some of the pockets. The pockets each have a radial opening, and the length of the rolling elements is less than a length of the radial opening of the pockets, defining a clearance between at least one end side of each of the rolling elements and at least one radial end face of respective ones of the pockets that contain the rolling elements. The clearance provides radial play between each of the rolling elements and the respective ones of the pockets.

Abstract: The axial roller bearing cage has an inner ring, an outer ring, and a plurality of alternating cage bars and roller pockets, which are formed between the inner ring and the outer ring. The roller pockets of the axial roller bearing cage extend along the entire length of the cage bars, accommodating rollers of maximum length, which also enables a compact cage design for a given roller length. The cage enhances the friction characteristics between the ends of the rollers and the cage bars. The ends of the rollers are supported on a centerline, which reduces frictional torque by reducing the length of the frictional moment arm on each roller, allowing for a symmetric loading. The ends of the rollers are also supported by the inboard smooth surface of the formed flanges of the connecting elements, which increases oil film development and allows the bearing to operate at higher speeds.

Abstract: An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable bond pads to one of the MCM's ground pins. By applying a supply voltage to the test mode enable bond pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a ground voltage applied to the test mode enable bond pads through the ground pins so the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging.

Abstract: An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable bond pads to one of the MCM's ground pins. By applying a supply voltage to the test mode enable bond pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a ground voltage applied to the test mode enable bond pads through the ground pins so the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging.

Abstract: A gaming device that enables a player to pick at least one of a plurality of selections, wherein at least one of the selections is associated with a terminator. The gaming device determines if the picked selection is associated with a terminator. If the picked selection is not associated with a terminator, the gaming device places the picked selection to occupy a position of a selection group. The gaming device enables the player to pick another one of the selections and again determines if the picked selection is associated with a terminator. If the picked selection is associated with a terminator, the gaming device modifies the position of at least one of the picked selections. After modifying the positions of one or more of the picked selections, the gaming device determines the modified award based on the awards or values associated with the modified positions of the picked selections. The gaming device provides the determined modified award to the player and ends the game.

Abstract: An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable bond pads to one of the MCM's ground pins. By applying a supply voltage to the test mode enable bond pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a ground voltage applied to the test mode enable bond pads through the ground pins so the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging.

Abstract: The invention concerns the fixing of a bearing shaft (6) in a reception bore (1.3) of a housing, at least one end of the shaft being adapted to be swaged to the reception bore (1.3) for achieving at least one of a force locking and a positive engagement, and an outer peripheral surface of the shaft (6) having a hardness that is greater than a hardness of the ends (6.2) of the shaft. The novel shaft is carbonitrided, quenched and tempered so that at first a hardness of HV 745-950 (HRC 62-68) is realized, following which the thus treated shaft (6) is soft annealed to produce a hardness of HV 212-305 (HRB 93-HRC30), and the outer peripheral surface is then subjected to induction hardening to achieve a final hardness of HV 745-950 (HRC 62-68). The shaft of the invention has a long operating life even under high load conditions.

Abstract: An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable bond pads to one of the MCM's ground pins. By applying a supply voltage to the test mode enable bond pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a ground voltage applied to the test mode enable bond pads through the ground pins so the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging.

Abstract: An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable bond pads to one of the MCM's ground pins. By applying a supply voltage to the test mode enable bond pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a ground voltage applied to the test mode enable bond pads through the ground pins so the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging.

Abstract: An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable bond pads to one of the MCM's ground pins. By applying a supply voltage to the test mode enable bond pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a ground voltage applied to the test mode enable bond pads through the ground pins so the resistor disables the test mode in the dice and initiates an operational mode.

Abstract: The invention concerns the fixing of a bearing shaft (6) in a reception bore (1.3) of a housing, at least one end of the shaft being adapted to be swaged to the reception bore (1.3) for achieving at least one of a force locking and a positive engagement, and an outer peripheral surface of the shaft (6) having a hardness that is greater than a hardness of the ends (6.2) of the shaft The novel shaft is carbonitrided, quenched and tempered so that at first a hardness of HV 745-950 (HRC 62-68) is realized, following which the thus treated shaft (6) is soft annealed to produce a hardness of HV 212-305 (HRB 93-HRC30), and the outer peripheral surface is then subjected to induction hardening to achieve a final hardness of HV 745-950 (HRC 62-68). The shaft of the invention has a long operating life even under high load conditions.

Abstract: An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable bond pads to one of the MCM's ground pins. By applying a supply voltage to the test mode enable bond pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a ground voltage applied to the test mode enable bond pads through the ground pins so the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging.

Abstract: An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable bond pads to one of the MCM's ground pins. By applying a supply voltage to the test mode enable bond pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a ground voltage applied to the test mode enable bond pads through the ground pins so the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging.

Abstract: An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable bond pads to one of the MCM's ground pins. By applying a supply voltage to the test mode enable bond pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a ground voltage applied to the test mode enable bond pads through the ground pins so the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging.

Abstract: A fiber optic illuminated starlight scene on a headboard. By using a plurality of optical fibers (22) lighted by an illuminator (20) and the optical fiber/visible end (16) are positioned flush with front panel (12) decorative scene (14) a realistic rendition of a starlight scene is created. The optical fibers/visible ends (16) placement and dispersion in the decorative scene (14) along with the distance and angle of the optical fibers (22) to the illuminator makes each individual optical fiber/visible end (16) appear as starlight.

Abstract: An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable bond pads to one of the MCM's ground pins. By applying a supply voltage to the test mode enable bond pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a ground voltage applied to the test mode enable bond pads through the ground pins so the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging.

Abstract: An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable pads to one of the MCM's reference voltage pins. By applying a supply voltage to the test mode enable pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a reference voltage applied to the test mode enable pads through the reference voltage pins and the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging.

Abstract: A cover assembly for an air bag restraint system has a smooth outer skin with a backing layer of foam located between the outer skin cover and a retainer member. The retainer member is located above the outlet of an air bag casing and includes a plurality of flaps therein each having a pointed end located in a hidden position beneath the foam and outer skin cover and at a point generally centrally of the outlet of the casing. Each of the flaps is connected to the retainer member by integral hinge segments in the retainer member. When the air bag is inflated, it will cause the segments to pivot outwardly about the hinge segments to pierce both the foam layer and the outer skin and peel them apart so as to form a multi-sided opening through the cover assembly for deployment of the air bag.