Abstract: A circuit board assembly may include an integrated airflow path formed with a partially closed volume to direct airflow received at a first opening of the integrated airflow path through the integrated airflow path and to a second opening of the integrated airflow path, a circuit board mechanically coupled to the integrated airflow path such that at least a portion of the circuit board resides within the partially closed volume, and a connector electrically and mechanically coupled to the circuit board and configured to electrically and mechanically couple a device received in the connector to the circuit board.

Abstract: A method may include, in response to an indication that a clean air filter has been installed in an information handling system, setting a speed of an air mover of the information handling system to a predetermined filter testing speed, determining a clean filter baseline airflow as an airflow driven within the information handling system responsive to the predetermined filter testing speed, calculating a threshold filter failure airflow based on the clean filter baseline airflow, and periodically executing filter fouling tests. Each filter fouling test may include setting the speed of the air mover to the predetermined filter testing speed, determining a resulting airflow within the information handling system responsive to the predetermined filter testing speed, comparing the resulting airflow to the threshold filter failure airflow, and communicating an alert responsive to the resulting airflow being below the threshold filter failure airflow.

Abstract: A method may include, during a filter fouling test of an air filter, determining if the air mover is operating below a first predetermined filter testing speed, in response to the air mover operating below the first predetermined filter testing speed, operating the air mover at the first predetermined filter testing speed and determining an indicator of filter degradation of the air filter responsive to the first predetermined filter testing speed, in response to the air mover operating above the first predetermined filter testing speed, operating the air mover at a second predetermined filter testing speed significantly greater than the first predetermined filter testing speed and determining the indicator of filter degradation of the air filter responsive to the second predetermined filter testing speed, and determining if the indicator of filter degradation is below a respective filter failure threshold.

Abstract: An information handling system may include an information handling resource and an air mover configured to drive a flow of air. The air mover may have one or more air mover components for driving the flow of air and a coil configured to heat the one or more air mover components.

Abstract: An information handling system includes an enclosure having a front portion and a rear portion. An exhaust duct is located in between a first central processing unit and a first set of downstream components within the rear portion. The exhaust duct directs first airflow from the first central processing unit out of the information handling system without the first airflow reaching an inlet of the first set of downstream components. A first top cover is attached to the rear portion. The first top cover includes a first hole cut above the exhaust duct. The first hole enables the first airflow to escape from the rear portion.

Abstract: An information handling system includes an enclosure having a front portion and a rear portion. An exhaust duct is located in between a first central processing unit and a first set of downstream components within the rear portion. The exhaust duct directs first airflow from the first central processing unit out of the information handling system without the first airflow reaching an inlet of the first set of downstream components. A first top cover is attached to the rear portion. The first top cover includes a first hole cut above the exhaust duct. The first hole enables the first airflow to escape from the rear portion.

Abstract: Systems and methods of adaptive thermal control are provided for information handling system platforms that may be implemented to automate and scale fan control settings by making the fan control settings relative to a reported component thermal control parameter value from a component of an information handling system platform, such as a CPU or other heat generating component. In one example, bounds for system use of vendor or component manufacturer-reported thermal control parameter values may be set for system cooling so as to confine use of these values within information handling system platform limits characterized by a manufacturer of an information handling system platform.

Abstract: A device delivery system includes a base support member having vertical force dissipation member(s) that dissipate vertical forces, and a device support member that mounts to one or more devices. A horizontal movement subsystem couples the device support member to the base support member, and operates to allow the device support member to move relative to the base support member in a substantially horizontal plane during rack transport. Resilient member(s) extend between the base support member and the device support member, and operate to damp the movement of the device support member relative to the base support member in the substantially horizontal plane. A movement limiting subsystem may be provided on the base support member and the device support member, and may be activated to resist movement of the device support member relative to the base support member in the substantially horizontal plane during rack positioning.

Abstract: Systems and methods of adaptive thermal control are provided for information handling system platforms that may be implemented to automate and scale fan control settings by making the fan control settings relative to a reported component thermal control parameter value from a component of an information handling system platform, such as a CPU or other heat generating component. In one example, bounds for system use of vendor or component manufacturer-reported thermal control parameter values may be set for system cooling so as to confine use of these values within information handling system platform limits characterized by a manufacturer of an information handling system platform.

Abstract: Systems and methods of adaptive thermal control are provided for information handling system platforms that may be implemented to automate and scale fan control settings by making the fan control settings relative to a reported component thermal control parameter value from a component of an information handling system platform, such as a CPU or other heat generating component. In one example, bounds for system use of vendor or component manufacturer-reported thermal control parameter values may be set for system cooling so as to confine use of these values within information handling system platform limits characterized by a manufacturer of an information handling system platform.

Abstract: A device delivery system includes a base support member having vertical force dissipation member(s) that dissipate vertical forces, and a device support member that mounts to one or more devices. A horizontal movement subsystem couples the device support member to the base support member, and operates to allow the device support member to move relative to the base support member in a substantially horizontal plane during rack transport. Resilient member(s) extend between the base support member and the device support member, and operate to damp the movement of the device support member relative to the base support member in the substantially horizontal plane. A movement limiting subsystem may be provided on the base support member and the device support member, and may be activated to resist movement of the device support member relative to the base support member in the substantially horizontal plane during rack positioning.

Abstract: Systems and methods of adaptive thermal control are provided for information handling system platforms that may be implemented to automate and scale fan control settings by making the fan control settings relative to a reported component thermal control parameter value from a component of an information handling system platform, such as a CPU or other heat generating component. In one example, bounds for system use of vendor or component manufacturer-reported thermal control parameter values may be set for system cooling so as to confine use of these values within information handling system platform limits characterized by a manufacturer of an information handling system platform.

Abstract: A method for controlling fan speed includes providing a fan that is in fluid communication with at least one heat producing component, detecting a temperature, determining a fan speed using the detected temperature and a nonlinear fan speed function, and applying a control signal to the fan such that the fan operates at the determined fan speed in order to cool the at least one heat producing component.

Abstract: A method for controlling fan speed includes providing a fan that is in fluid communication with at least one heat producing component, detecting a temperature, determining a fan speed using the detected temperature and a nonlinear fan speed curve, and applying a control signal to the fan such that the fan operates at the determined fan speed in order to cool the at least one heat producing component.

Abstract: A system for adjusting the operation of a cooling device includes a cooling device, an input sensory device, a control algorithm, and a controller that adjusts operation of the cooling device based on the control algorithm. An embodiment of the control algorithm approximates a plurality of substantially linear cooling curves to relate to portions of a non-linear cooling curve for the cooling device, the algorithm selects a selected cooling curve from the plurality of substantially linear cooling curves based on an input from the sensory device. The system and an associated method may be implemented to cool an information handling system.

Abstract: An information handling system cooling system operates according to a thermal profile selected by a thermal profile manager based upon venting detected as available through a chassis wall. Venting through the chassis is provided, in part, by vent openings formed in a blank coupled to the chassis. A first thermal profile is selected if the blank is detected coupled to the chassis. A second thermal profile is selected if the blank is replaced with a component. The thermal profile is selected based upon detection of the component by the information handling system or, alternatively, by detection of the blank coupled to the chassis.

Abstract: A heat sink is disclosed that includes a set of horizontal fins that are coupled to multiple solid vertical panels. A fan is located near the heat sink to direct air across the surface of the horizontal fins. Vertical panels may be located on the opposite ends of the heat sink to prevent air from exiting from the heat sink in a direction that is perpendicular to the axis of the fan. The presence of the vertical panels within the interior of the heat sink is advantageous because the vertical panels direct the forced air from the fan so that the air flows through the fan in the direction of the axis of the fan.

Abstract: A chassis includes a heat generating component. A base is mounted on the heat generating component. A plurality of heat pipes each have a first portion mounted in the base and a second portion extending from the base. A plurality of fins are mounted on the second portion of the heat pipes. The heat pipes are L-shaped and the first portion of each heat pipe is seated in a respective groove provided in the base.

Abstract: A chassis includes a heat generating component. A base is mounted on the heat generating component. A plurality of heat pipes each have a first portion mounted in the base and a second portion extending from the base. A plurality of fins are mounted on the second portion of the heat pipes. The heat pipes are L-shaped and the first portion of each heat pipe is seated in a respective groove provided in the base.