Abstract: Improved thermal conductivity in printed wiring boards can be achieved without resorting to the use of dedicated thermally conductive components such as thermal vias and heat sinks. Instead, electrically functional vias, through holes, pads, and traces are modified to improve their thermal conductivity. Such modifications include thickly plating the walls of through holes or vias, possibly to the point where the via or through hole is completely filled, and also include de-planarazing the surfaces of pads and traces.

Abstract: The present invention is directed to lamination systems and methods, whereby a stack of members to be laminated is protected from the mats of the platens used to apply heat and pressure to the stack during lamination, by one or more interposer layers positioned between the stack and the platens and possibly bound to the stack.