Patents by Inventor Eric W. Strid
Eric W. Strid has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20030210033Abstract: An interconnect assembly for evaluating a probe measurement network includes a base, respective inner and outer probing areas in mutually coplanar relationship on the upper face of the base, a reference junction, and a high-frequency transmission structure connecting the probing areas and the reference junction so that high-frequency signals can be uniformly transferred therebetween despite, for example, variable positioning of the device-probing ends of the network on the probing areas. A preferred method for evaluating the signal channels of the network includes connecting a reference unit to the reference junction and successively positioning each device-probing end that corresponds to a signal channel of interest on the inner probing area.Type: ApplicationFiled: June 11, 2003Publication date: November 13, 2003Inventors: Eric W. Strid, Jerry B. Schappacher, Dale E. Carlton, K. Reed Gleason
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Patent number: 6608496Abstract: An interconnect assembly for evaluating a probe measurement network includes a base, respective inner and outer probing areas in mutually coplanar relationship on the upper face of the base, a reference junction, and a high-frequency transmission structure connecting the probing areas and the reference junction so that high-frequency signals can be uniformly transferred therebetween despite, for example, variable positioning of the device-probing ends of the network on the probing areas. A preferred method for evaluating the signal channels of the network includes connecting a reference unit to the reference junction and successively positioning each device-probing end that corresponds to a signal channel of interest on the inner probing area.Type: GrantFiled: July 7, 2000Date of Patent: August 19, 2003Assignee: Cascade Microtech, Inc.Inventors: Eric W. Strid, Jerry B. Schappacher, Dale E. Carlton, K. Reed Gleason
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Patent number: 6130544Abstract: An interconnect assembly for evaluating a probe measurement network includes a base, respective inner and outer probing areas in mutually coplanar relationship on the upper face of the base, a reference junction, and a high-frequency transmission structure connecting the probing areas and the reference junction so that high-frequency signals can be uniformly transferred therebetween despite, for example, variable positioning of the device-probing ends of the network on the probing areas. A preferred method for evaluating the signal channels of the network includes connecting a reference unit to the reference junction and successively positioning each device-probing end that corresponds to a signal channel of interest on the inner probing area.Type: GrantFiled: July 22, 1999Date of Patent: October 10, 2000Assignee: Cascade Microtech, Inc.Inventors: Eric W. Strid, Jerry B. Schappacher, Dale E. Carlton, K. Reed Gleason
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Patent number: 5973505Abstract: An interconnect assembly for evaluating a probe measurement network includes a base, respective inner and outer probing areas in mutually coplanar relationship on the upper face of the base, a reference junction, and a high-frequency transmission structure connecting the probing areas and the reference junction so that high-frequency signals can be uniformly transferred there-between despite, for example, variable positioning of the device-probing ends of the network on the probing areas. A preferred method for evaluating the signal channels of the network includes connecting a reference unit to the reference junction and successively positioning each device-probing end that corresponds to a signal channel of interest on the inner probing area.Type: GrantFiled: October 19, 1998Date of Patent: October 26, 1999Assignee: Cascade Microtech, Inc.Inventors: Eric W. Strid, Jerry B. Schappacher, Dale E. Carlton, K. Reed Gleason
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Patent number: 5869975Abstract: An interconnect assembly for evaluating a probe measurement network includes a base, respective first, second and third device-probing areas arranged on an upper face of the base in spaced-apart relation so that first, second and third device-probing ends belonging to the measurement network can be simultaneously placed on these respective areas, a reference junction, and a high frequency transmission structure connecting the probing areas and the reference junction so that high-frequency signals can be uniformly transferred therebetween despite variable positioning of the device-probing ends on the probing areas. Because the transmission structure uniformly transfers signals despite variable positioning of the device-probing ends, the measurement network can be accurately calibrated with reference, in particular, to the device-probing ends of the network by a reference unit connected to the reference junction.Type: GrantFiled: May 30, 1997Date of Patent: February 9, 1999Assignee: Cascade Microtech, Inc.Inventors: Eric W. Strid, Jerry B. Schappacher, Dale E. Carlton, K. Reed Gleason
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Patent number: 5659255Abstract: A method of evaluating the signal conditions in a probe measurement network of the type having a plurality of separate measurement channels, where each channel communicates through a corresponding device-probing end. The method includes providing an assembly which includes a conductive planar probing area on the upper face of a base and a reference junction connected to the probing area by a high-frequency transmission structure. The method further includes placing the respective device-probing end of a first one of the measurement channels into contact with the planar probing area, transmitting a high-frequency signal through both the measurement channel and the reference junction and, thereafter, measuring the signal.Type: GrantFiled: June 26, 1996Date of Patent: August 19, 1997Assignee: Cascade Microtech, Inc.Inventors: Eric W. Strid, Jerry B. Schappacher, Dale E. Carlton, K. Reed Gleason
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Patent number: 5565788Abstract: A shielded microwave probe tip assembly includes an end of a coaxial cable coupled to probe fingers forming a coplanar controlled impedance microwave transmission line where the ground probe fingers are interconnected by a shield member that is spaced apart from the signal line probe finger but is positioned between the signal line probe finger and a device under test. The shield prevents the generation of extraneous signals or parasitic coupling from the device under test which would otherwise degrade measurement accuracy.Type: GrantFiled: May 12, 1995Date of Patent: October 15, 1996Assignee: Cascade Microtech, Inc.Inventors: Jeremy Burr, Gregory Nordgren, Eric W. Strid, Kimberly R. Gleason
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Patent number: 5561377Abstract: An interconnect assembly for evaluating a probe measurement network includes a base, respective inner and outer probing areas in mutually coplanar relationship on the upper face of the base, a reference junction, and a high-frequency transmission structure connecting the probing areas and the reference junction so that high-frequency signals can be uniformly transferred therebetween despite, for example, variable positioning of the device-probing ends of the network on the probing areas. A preferred method for evaluating the signal channels of the network includes connecting a reference unit to the reference junction and successively positioning each device-probing end that corresponds to a signal channel of interest on the inner probing area.Type: GrantFiled: April 14, 1995Date of Patent: October 1, 1996Assignee: Cascade Microtech, Inc.Inventors: Eric W. Strid, Jerry B. Schappacher, Dale E. Carlton, K. Reed Gleason
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Patent number: 5068615Abstract: A one port tuner having a source port for connection to a device under test so that, in combination with a noise meter, the noise performance of such device can be evaluated. Preferably the one port tuner includes a plurality of predetermined admittances, a switching device having an output port for selectively connecting one of the admittances to the output port, and a two port device having a selectable response and interconnected between the output port of the switching device and the source port of the one port tuner. Desirably, the two port device includes a multiple-state attenuator where the signal passing through the attenuator is selectable in degree. Alternatively, or in combination, the two port device includes a phase shifter where the phase of the signals passing through the phase shifter are selectively shiftable.Type: GrantFiled: June 18, 1990Date of Patent: November 26, 1991Assignee: Cascade Microtech, Inc.Inventors: Eric W. Strid, Bernard W. Leake
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Patent number: 5047725Abstract: A method for correcting inaccuracies in error factors of an error model used for vector-corrected, microwave-frequency measurements. Verifying de-embedded measurements are compared to known characteristics of at least one verification standard. At least one parameter of the calibration standards, or an error factor, or measuring network geometry, is changed and the error factors are recalculated to bring the verifying measurements into conformity with the known characteristics of the verification standard.Type: GrantFiled: November 28, 1989Date of Patent: September 10, 1991Assignee: Cascade Microtech, Inc.Inventors: Eric W. Strid, Andrew C. Davidson
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Patent number: 4998071Abstract: Method and apparatus for simultaneously measuring noise power of a two-port device under test (DUT) using a one-port tuner, a low-noise amplifier, a power divider with a plurality of outputs, and a plurality of noise meters. The noise meters are configured to measure available noise power in different frequency ranges which are closely spaced around a selected central frequency, thereby yielding the noise parameters of the DUT at the central frequency.Type: GrantFiled: October 25, 1988Date of Patent: March 5, 1991Assignee: Cascade Microtech, Inc.Inventors: Eric W. Strid, Bernard W. Leake
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Patent number: 4891612Abstract: An interface structure, for connecting a pair of coplanar transmission lines in end-to-end overlapping relation to each other, employs dissimilarly-shaped overlapping end portions of the respective signal and/or ground lines of the transmission lines. The dissimilarly-shaped end portions are effective to minimize variations in the impedance of the interface structure due to variations in transverse and/or longitudinal alignment of the overlapping end portions of the respective transmission lines, thereby making the interface tolerant to misalignments.Type: GrantFiled: November 4, 1988Date of Patent: January 2, 1990Assignee: Cascade Microtech, Inc.Inventors: K. Reed Gleason, Keith E. Jones, Eric W. Strid
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Patent number: 4858160Abstract: A system for calibrating vector corrected electrical measurements to adjust for distortion due to reactance in the measuring circuit, particularly that caused by variable positioning of a circuit element, such as probe or coupling. Initial error factors for directivity, source match, and frequency response, respectively, normally calculated from assumed reflection coefficients of respective primary impedance standards, are adjusted to correct for such reactance. Reflection coefficient measurements (magnitude and phase) of a further impedance standard, different from the primary standards, are obtained at multiple frequencies and corrected by the initial error factors. The corrected magnitude and phase measurements of the further impedance standard are compared with theoretical magnitude and phase values which very linearly with frequency, and the initial error factors are adjusted so as to minimize any deviation of the corrected measurements from the linear values.Type: GrantFiled: March 18, 1988Date of Patent: August 15, 1989Assignee: Cascade Microtech, Inc.Inventors: Eric W. Strid, Keith E. Jones
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Patent number: 4853627Abstract: A wafer probe comprises a support member having an end region which is shaped to permit the end region to be brought into close proximity with a component under test. An amplifier is mounted on the support member at its end region. A conductive probe element is attached to the amplifier and is electrically connected to the amplifier's input terminal. A transmission line is connected to the amplifier's output terminal for transmitting signals from the amplifier to a measurement instrument.Type: GrantFiled: July 11, 1988Date of Patent: August 1, 1989Assignee: TriQuint Semiconductor, Inc.Inventors: Kimberly R. Gleason, Eric W. Strid, Robert T. Flegal, Angus J. McCamant
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Patent number: 4849689Abstract: A microwave wafer probe having a replaceable planar transmission line probe tip which detachably connects to a planar transmission line circuit board within the probe head. The circuit board may include passive and/or active electrical circuit components interconnecting its conductors which, due to the detachable interconnection with the probe tip, do not have to be replaced if the probe tip should be damaged. The detachable interconnection between the probe tip and the circuit board is tolerant to misalignment of the two elements because the interconnected end portions of the respective conductors are shaped so as to maintain the impedance between the two elements substantially constant despite misalignment. Preferably, both the circuit board and the detachable tip include coplanar transmission lines interconnected by compressing the overlapping end portions of their conductors together.Type: GrantFiled: November 4, 1988Date of Patent: July 18, 1989Assignee: Cascade Microtech, Inc.Inventors: K. Reed Gleason, Keith E. Jones, Eric W. Strid
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Patent number: 4827211Abstract: A wafer probe for accessing bonding pads on a planar device includes contact pads mounted on one edge of the under side of a dielectric substrate board and arranged to align with the bonding pads to be accessed. Coplanar ground and signal conductors deposited on the under side of the substrate board form constant impedance transmission lines for connecting test equipment to the contact pads. A ground contact is mounted on the upper side of the substrate near the end on which the contact pads are mounted, the ground contact being connected by a conductive path to the ground conductors on the under side of the substrate. When two such wafer probes simultaneously access bonding pads on the same planar device, the ground conductors of the two probes are interconnected by a conductive sheet of foil extending between the ground contacts on the upper sides of the substrates of both wafer probes.Type: GrantFiled: January 30, 1987Date of Patent: May 2, 1989Assignee: Cascade Microtech, Inc.Inventors: Eric W. Strid, Kimberly R. Gleason
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Patent number: 4764723Abstract: A wafer probe for testing semiconductor devices brings low impedance connections closely adjacent device bonding pads for bypassing power supply voltages.Type: GrantFiled: November 10, 1986Date of Patent: August 16, 1988Assignee: Cascade Microtech, Inc.Inventor: Eric W. Strid
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Patent number: 4697143Abstract: A wafer probe is provided having metallic transmission lines mounted on a tapered alumina substrate generally surrounded by microwave absorbing material. The probe provides for on-wafer measurements of small planar devices at frequencies from DC to at least 18 GHz with low inductance, and with constant characteristic impedance from the probe external cable terminal to the point of contact on device being probed. The microwave absorbing material absorbs energy propagating along the probe ground preventing this energy from resonating, radiating and re-exciting normal transmission line modes with minimal transmission line mode resonance along the probe ground. The probe, which may be coupled to receive signals from a coaxial cable, is capable of making contact with bonding pads of a device having a center-to-center distance between pads of only 4 mils.Type: GrantFiled: April 30, 1984Date of Patent: September 29, 1987Assignee: Cascade Microtech, Inc.Inventors: Larry R. Lockwood, Kimberly R. Gleason, Eric W. Strid