Abstract: The present invention relates, generally to a wafer cassette holding mechanism for use in processing wafers. The cassette holding mechanism has adjustable alignment posts to facilitate the cassette placement, and an adjustment guide for guiding the placement of the cassette on the holding mechanism so that the holding mechanism may be configured to receive and securely hold a variety of different sizes and brands of wafer cassettes. In addition, the cassette holding mechanism further includes a plurality of adjustment screws for fine tuning the level position of the support platform.

Abstract: A hedge trimmer having a hedge trimmer housing, a motor disposed in the hedge trimmer housing and a drive assembly associated with the motor. The drive assembly includes a first housing, a first gear connected to the rotatable drive shaft of the motor, a second housing, a second gear associated with the second housing, the second gear being in contact with the first gear so that the second gear rotates when the first gear rotates, and a support connector for causing the first and second housings to maintain a fixed positional relationship to ensure that the first and second gears remain in contact. The hedge trimmer also includes a first cutting blade operatively coupled to the second gear so that the first cutting blade reciprocates when the second gear rotates and a second cutting blade movable relative to the first cutting blade. The hedge trimmer may also include a gear-travel limit member to prevent any substantial misalignment of the second gear with respect to the first gear.