Abstract: A land grid array package or a ball grid array package is electrically connected by an elastomeric type layer (containing alternating elements of conductive and non-conductive silicone) to a printed wire board or motherboard. A hold-down collar engages the peripheral edges of the package and snaps into holes in the board in such manner as to create pressure on the elastomeric layer, causing the layer to compress and create through-going electrical paths between exposed lands or conductive elements on the bottom of the package and exposed conductive elements on the wiring board. In one embodiment, solder balls adhere to the exposed conductive elements on the bottom of the package. In this embodiment the collar is initially in two pieces which are fitted together to engage both the top and bottom edges of the substrate.

Abstract: A single in-line memory module (SIMM) having on-board regulation circuits is disclosed. The present invention includes a plurality of inputs. These inputs include a first reference voltage signal. The present invention employs a plurality of memory elements that are arranged to form a datapath having a predetermined width. These memory elements operate at a second reference voltage signal that is different from the first reference voltage signal received by the SIMM. On-board regulation circuits are provided to translate the first reference voltage signal into the second reference voltage signal so that the memory elements of the SIMM can use the first reference voltage signal. A driver for providing an interface between the memory elements and a computer system is also provided. This driver may also operate at the second reference.