Abstract: An adapter (13) for a printed circuit board testing device (6), by means of which test contacts, (7) which are located in a grid, may be connected with test points (3), which are located in and/or beyond the grid, on a printed circuit board (2), which is to be tested, the connection being effected by means of adapter pins (14) which extend through first, second and third guide plates (10, 15 and 16), the third guide plate (16) being arranged between the first and second guide plates (10 and 15). The third guide plate (16) is arranged to be shifted square to the first and second guide plates (10 and 15) and guide holes (20) in the third guide plate (16) are provided at all points of the grid. The holes (20) have a diameter which tolerates a limited amount of clearance for steering of the adapter pins (14) in these guide holes (20).

Abstract: An adapter (175) for a printed circuit board testing apparatus. The adapter serves to connect testing contacts located in the grid to testing points, located in and/or out of grid, of a printed circuit board to be tested, through adapter pins (181). The adapter pins (181) are conically tapered at their ends facing the testing points. The adapter (175) has a first guide plate (176), a second guide plate (177) and a third guide plate (178) lying in between. The first guide plate (176) only has holes (180) only located in the grid. The second guide plate (177) has holes (179) located in the grid, as well as holes (179a) located out of grid.

Abstract: In a universal testing apparatus for electrical printed circuit boards in each case a quotient of test pins (26) covering a partial grid field is to be provided on one of several separable modules (27) which contains that part of the switch matrix which corresponds to this test pin quotient. Each module (27) is to be connectable electrically with other modules (27) and/or the control circuit part (32) of the apparatus. The apparatus also has a perforated grid plate (24) provided with guide holes (36) for the test pins (26), on which the modules (27) may be suspended so that the test pins (26) engage through the guide holes (36). Futhermore, the modules (27) are to be shaped so that they can be assembled in the form of building blocks in order to cover a partial area, corresponding to the printed circuit board (22) to be tested, of the total grid field defined by the perforated grid plate (24).

Abstract: Board-shaped articles are to be stacked in a frame in such a way that they can be introduced into the frame from the same elevation, means being provided to ensure the maintenance of the desired spacing between the individual articles. To that end the spacing elements are supported in the frame in such a manner as to be deflectable and the articles during insertion deflect the spacing elements in the loading direction. The spacing element which is closest to an article already inserted comes into contact with such article.

Abstract: Conductor plates are fed to a conductor plate tester from a stack by a reciprocating feeder which removes the lowermost plate only of the stack and propels it forwardly to a transport path. The transport path is inclined downwardly toward said tester, the feeder is also inclined at the same angle, with the stack perpendicular thereto. As a result, the conductor plates are moved along the transport path by the force of gravity.

Abstract: Sorting and stacking tested conductor plates by forming from the bottom up a stack of conductor plates which have passed the tests, raising from the bottom the entire stack each time a tested conductor plate approaches the bottom of the stack, feeding each tested conductor plate beneath the raised stack to temporary support means, actuating the temporary support means to eject a failed said plate, lowering the stack after an ejection opportunity has passed, whether used or not, and lowering the lifting means below the latest tested plate that has passed the test, so that such a plate is incorporated into the stack before the lifting means is next activated.

Abstract: A conductor plate and a method for determining the offset between conductor paths and contact holes in the conductor plate. Conductor paths with contact eyes and at least one control mark are simultaneously applied, and, in a later step, contact holes and a control hole for each control mark are simultaneously punched through the conductor plate. Then the position of the control hole is determined relative to its associated control mark. The control mark has at least one curved control path which encloses, on at least one side, a control area of the conductor plate; the control hole is centrally located within the control area when the contact holes are centrally located within their associated contact eyes. Preferably, there are two control marks disposed diagonally opposite each other and pointing in different directions. Each control mark may comprise a group of control paths disposed within one another.

Abstract: A printed circuit having a protective coating of lacquer or the like thereover is tested by bringing a plurality of resiliently mounted measuring pins into engagement with certain measuring points on the printed circuit. The printed circuit is then subjected to ultrasonic vibrations to cause the contacting pins to be impacted into good electrical contact with the measuring points on the printed circuit. The pins are resiliently mounted for axial movement in opposed openings in a pair of spaced plates and the plate and pin assembly is capable of being moved toward and away from the printed circuit.