Patents by Inventor Erich Syri
Erich Syri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20170278762Abstract: A package comprising an electronic chip, a laminate type encapsulant in and/or on which the electronic chip is mounted, a solderable electric contact on a solder surface of the package, and a solder flow path on and/or in the package which is configured so that, upon soldering the electric contact with a mounting base, part of solder material flows along the solder flow path towards a surface of the package at which the solder material is optically inspectable after completion of the solder connection between the mounting base and the electric contact.Type: ApplicationFiled: March 23, 2017Publication date: September 28, 2017Inventors: Angela KESSLER, Oliver HAEBERLEN, Matteo-Alessandro KUTSCHAK, Ralf OTREMBA, Petteri PALM, Boris PLIKAT, Thorsten SCHARF, Klaus SCHIESS, Fabian SCHNOY, Erich SYRI
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Patent number: 8071433Abstract: A semiconductor component including: a substrate, at least one semiconductor chip arranged on the substrate and at least one passive device likewise arranged on the substrate. The passive device is mounted with its underside on the substrate. The semiconductor component further includes an interspace disposed between the underside of the passive device and the substrate. The interspace is filled with an underfilling material. In order to avoid the solder pumping effect, the upper side and the lateral sides of the passive device are also embedded in a plastic compound.Type: GrantFiled: August 25, 2010Date of Patent: December 6, 2011Assignee: Infineon Technologies AGInventors: Erich Syri, Gerold Gruendler, Juergen Hoegerl, Thomas Killer, Volker Strutz
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Patent number: 8026618Abstract: A semiconductor device includes a plastic housing and a semiconductor chip, wherein the semiconductor chip includes an active top side and a rear side. An interposer is arranged on the active top side of the semiconductor chip. At least a portion of the interposer is embedded into the plastic housing, while the top side of the interposer forms the top side of the semiconductor device. A top side fitting shape is arranged on the top side of the interposer, where the top side fitting shape has a predetermined radius of curvature that is free of plastic housing composition, and the top side fitting shape has a convex or concave lens-shaped sphere segment shape.Type: GrantFiled: June 8, 2007Date of Patent: September 27, 2011Assignee: Infineon Technologies AGInventors: Erich Syri, Gerold Gruendler, Juergen Hoegerl, Thomas Killer, Volker Strutz
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Patent number: 7998797Abstract: A method of assembling a semiconductor device includes providing a chip attached to an elastic carrier, and supporting the elastic carrier with a stiffener. The method additionally includes removing the stiffener from the elastic carrier after attaching the elastic carrier to a board.Type: GrantFiled: December 9, 2008Date of Patent: August 16, 2011Assignee: Infineon Technologies AGInventors: Thomas Killer, Erich Syri, Gerold Gruendler, Juergen Hoegerl, Volker Strutz, Hermann Josef Lutz
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Publication number: 20100323479Abstract: A semiconductor component including: a substrate, at least one semiconductor chip arranged on the substrate and at least one passive device likewise arranged on the substrate. The passive device is mounted with its underside on the substrate. The semiconductor component further includes an interspace disposed between the underside of the passive device and the substrate. The interspace is filled with an underfilling material. In order to avoid the solder pumping effect, the upper side and the lateral sides of the passive device are also embedded in a plastic compound.Type: ApplicationFiled: August 25, 2010Publication date: December 23, 2010Applicant: INFINEON TECHNOLOGIES AGInventors: Erich Syri, Gerold Gruendler, Juergen Hoegerl, Thomas Killer, Volker Strutz
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Patent number: 7825506Abstract: A semiconductor module and a method for producing the same is disclosed. In one embodiment, the semiconductor module has adjacent regions on a common wiring substrate in a common plastic housing composition. The regions are thermally decoupled by a thermal barrier. Semiconductor chips whose evolution of heat loss differs are arranged in these thermally separate regions, the thermal barrier ensuring that the function of the more thermally sensitive semiconductor chip is not impaired by the heat-loss-generating semiconductor chip.Type: GrantFiled: March 27, 2006Date of Patent: November 2, 2010Assignee: Infineon Technologies AGInventors: Erich Syri, Gerold Gruendler, Juergen Hoegerl, Thomas Killer, Volker Strutz
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Patent number: 7804178Abstract: A semiconductor component including: a substrate, at least one semiconductor chip arranged on the substrate and at least one passive device likewise arranged on the substrate. The passive device is mounted with its underside on the substrate. The semiconductor component further includes an interspace disposed between the underside of the passive device and the substrate. The interspace is filled with an underfilling material. In order to avoid the solder pumping effect, the upper side and the lateral sides of the passive device are also embedded in a plastic compound.Type: GrantFiled: May 14, 2007Date of Patent: September 28, 2010Assignee: Infineon Technologies AGInventors: Erich Syri, Gerold Gruendler, Juergen Hoegerl, Thomas Killer, Volker Strutz
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Publication number: 20100140785Abstract: A method of assembling a semiconductor device includes providing a chip attached to an elastic carrier, and supporting the elastic carrier with a stiffener. The method additionally includes removing the stiffener from the elastic carrier after attaching the elastic carrier to a board.Type: ApplicationFiled: December 9, 2008Publication date: June 10, 2010Applicant: INFINEON TECHNOLOGIES AGInventors: Thomas Killer, Erich Syri, Gerold Gruendler, Juergen Hoegerl, Volker Strutz, Hermann Josef Lutz
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Publication number: 20090057874Abstract: Semiconductor module comprising semiconductor chips in a plastic housing in separate regions and method for producing the same The invention relates to a semiconductor module (9) comprising semiconductor chips (1, 2) in a plastic housing (3) in separate regions (4, 5), and to a method for producing the same. In this case, the semiconductor module (9) has adjacent regions (4, 5) on a common wiring substrate (7) in a common plastic housing composition (6), said regions being thermally decoupled by a thermal barrier (8). Semiconductor chips whose evolution of heat loss differs are arranged in these thermally separate regions (4, 5), the thermal barrier (8) ensuring that the function of the more thermally sensitive semiconductor chip (2) is not impaired by the heat-loss-generating semiconductor chip (1).Type: ApplicationFiled: March 27, 2006Publication date: March 5, 2009Applicant: Infineon Technologies AGInventors: Erich Syri, Gerold Gruendler, Juergen Hoegerl, Thomas Killer, Volker Strutz
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Publication number: 20080150124Abstract: A semiconductor device includes a plastic housing and a semiconductor chip, wherein the semiconductor chip includes an active top side and a rear side. An interposer is arranged on the active top side of the semiconductor chip. At least a portion of the interposer is embedded into the plastic housing, while the top side of the interposer forms the top side of the semiconductor device. A top side fitting shape is arranged on the top side of the interposer, where the top side fitting shape has a predetermined radius of curvature that is free of plastic housing composition, and the top side fitting shape has a convex or concave lens-shaped sphere segment shape.Type: ApplicationFiled: June 8, 2007Publication date: June 26, 2008Applicant: Infineon Technologies AGInventors: Erich Syri, Gerold Gruendler, Juergen Hoegerl, Thomas Killer, Volker Strutz
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Patent number: 7355858Abstract: A heat sink for surface-mounted semiconductor devices is provided on a superordinate circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and snap-action hooks. The snap-action hooks are arranged approximately at right angles with respect to the press-on region and are spring-elastically connected to the press-on region of the heat sink via a spring-elastic connecting region of the heat sink. The snap-action hooks engage with edge regions of a thermally conductive coupling plate with the press-on region generating pressure. The coupling plate is fixed to a rear side of a semiconductor chip of the surface-mounted semiconductor device.Type: GrantFiled: March 15, 2006Date of Patent: April 8, 2008Assignee: Infineon Technologies, AGInventors: Gerold Gruendler, Juergen Hoegerl, Thomas Killer, Volker Strutz, Erich Syri
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Publication number: 20070262433Abstract: A semiconductor component including: a substrate, at least one semiconductor chip arranged on the substrate and at least one passive device likewise arranged on the substrate. The passive device is mounted with its underside on the substrate. The semiconductor component further includes an interspace disposed between the underside of the passive device and the substrate. The interspace is filled with an underfilling material. In order to avoid the solder pumping effect, the upper side and the lateral sides of the passive device are also embedded in a plastic compound.Type: ApplicationFiled: May 14, 2007Publication date: November 15, 2007Applicant: INFINEON TECHNOLOGIES AGInventors: Erich Syri, Gerold Gruendler, Juergen Hoegerl, Thomas Killer, Volker Strutz
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Publication number: 20060209513Abstract: A heat sink for surface-mounted semiconductor devices is provided on a superordinate circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and snap-action hooks. The snap-action hooks are arranged approximately at right angles with respect to the press-on region and are spring-elastically connected to the press-on region of the heat sink via a spring-elastic connecting region of the heat sink. The snap-action hooks engage with edge regions of a thermally conductive coupling plate with the press-on region generating pressure. The coupling plate is fixed to a rear side of a semiconductor chip of the surface-mounted semiconductor device.Type: ApplicationFiled: March 15, 2006Publication date: September 21, 2006Inventors: Gerold Gruendler, Juergen Hoegerl, Thomas Killer, Volker Strutz, Erich Syri
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Patent number: 6774483Abstract: A semiconductor assembly includes a module holder and a semiconductor module, which has a board substrate with conductor tracks and one or more unpackaged semiconductor chips mounted on the substrate, which are connected to conductor tracks on the substrate by electrical contacts. The substrate has at one edge at least one contact strip with connection contact areas, which are connected to at least some of the conductor tracks. The module holder has a plug-in connection for the electrical connection to other components, at least one mating contact strip for the connection to the contact strip of the at least one semiconductor module and electrical conductors between the contact areas of the at least one semiconductor module and electrical contacts of the plug-in connection. The configuration allows semiconductor modules to be connected to the outside world in an economical way.Type: GrantFiled: April 16, 2003Date of Patent: August 10, 2004Assignee: Infineon Technologies AGInventors: Jürgen Högerl, Erich Syri
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Publication number: 20030193085Abstract: A semiconductor assembly includes a module holder and a semiconductor module, which has a board substrate with conductor tracks and one or more unpackaged semiconductor chips mounted on the substrate, which are connected to conductor tracks on the substrate by electrical contacts. The substrate has at one edge at least one contact strip with connection contact areas, which are connected to at least some of the conductor tracks. The module holder has a plug-in connection for the electrical connection to other components, at least one mating contact strip for the connection to the contact strip of the at least one semiconductor module and electrical conductors between the contact areas of the at least one semiconductor module and electrical contacts of the plug-in connection. The configuration allows semiconductor modules to be connected to the outside world in an economical way.Type: ApplicationFiled: April 16, 2003Publication date: October 16, 2003Inventors: Jurgen Hogerl, Erich Syri
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Patent number: 6573593Abstract: An integrated circuit having a housing accommodating the integrated circuit. It being possible for the integrated circuit to be put optionally into one of a plurality of different operating modes by virtue of the selective provision of electrical connections between specific contact points constructed on the integrated circuit. The device described is distinguished by the fact that all the contact points of the integrated circuit which are provided for the operation and configuration of the integrated circuit are connected to terminal elements of the housing with which external contact can be made.Type: GrantFiled: March 18, 1999Date of Patent: June 3, 2003Assignee: Infineon Technologies AGInventors: Erich Syri, Bernd Römer