Abstract: Sockets that provide easy access for users to change cards while allowing the use of thinner device enclosures. One example provides a socket having two positions. When the socket is in an open state, the card may be oriented in a direction substantially away from the main logic board. When the socket is in a closed state, the card moves such that it is oriented at least closer to being in parallel to the main logic board.

Abstract: Non-rectangular or rectangular interposers for space efficient, reliable to manufacture, high speed interconnections between two printed circuit boards, such as a motherboard and a mating board. One example provides space efficiency with a non-rectangular interposer, where the interposer may be at least approximately circular. Reliable manufacturing may be provided by the inclusion of one or more openings to accept one or more alignment features. In one example, a first opening is provided to accept a threaded boss, which may be used to fasten the two printed circuit boards and interposer together. In another example, a second opening may be provided to accept an alignment post, wherein the post aligns the interposer to the two printed circuit boards. Contacts may be provided on each side to mate with contacts on each of the two printed circuit boards.

Abstract: Non-rectangular interposers for space efficient, reliable to manufacture, high speed interconnections between two printed circuit boards, such as a motherboard and a mating board. One example provides space efficiency with a non-rectangular interposer, where the interposer may be at least approximately circular. Reliable manufacturing may be provided by the inclusion of one or more openings to accept one or more alignment features. In one example, a first opening is provided to accept a threaded boss, which may be used to fasten the two printed circuit boards and interposer together. In another example, a second opening may be provided to accept an alignment pin, wherein the pin aligns the interposer to the two printed circuit boards. Contacts may be provided on each side to mate with contacts on each of the two printed circuit boards.

Abstract: High-speed memory systems that consume a reduced amount of board space, have a low height or profile, or both. This reduction in board space and height may result in shorter signal paths from a board to a memory device, thereby improving the high-speed performance of the high-speed memory system. One example may provide a space-efficient memory system that consumes a reduced amount of board space. Space efficiency may gained by arraying memory devices on an interposer that mates with a socket attached to a board. Another example may provide a memory system that has a reduced height or profile. This reduced height may be achieved by employing a socket that accepts an interposer in a lateral or rotational direction.

Abstract: Systems and methods for treating a patient having a head with a first ear and a second ear, function by aligning a first device with a tympanic membrane of the first ear; inputting a command to an input device operatively coupled to the first device to generate a signal; and actuating the first device in response to the signal so as to drive a penetrator of the device through the tympanic membrane.

Abstract: Systems and methods for treating a patient having a head with a first ear and a second ear, function by aligning a first device with a tympanic membrane of the first ear; inputting a command to an input device operatively coupled to the first device to generate a signal; and actuating the first device in response to the signal so as to drive a penetrator of the device through the tympanic membrane.

Abstract: Systems and methods for treating a patient having a head with a first ear and a second ear, function by aligning a first device with a tympanic membrane of the first ear; inputting a command to an input device operatively coupled to the first device to generate a signal; and actuating the first device in response to the signal so as to drive a penetrator of the device through the tympanic membrane.