Patents by Inventor Erik James Welsh
Erik James Welsh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20230185748Abstract: A Secure Enclave SiP (SE-SiP) is disclosed. The SE-SiP provides all the security benefits of a system designed using a Trusted Platform Module (TPM), replaces the need to trust a general-purpose CPU chip vendor with the need to trust a much simpler more trustworthy configurable device, and replaces the need to trust the entire system motherboard manufacturer with the much more limited need to trust the SE-SiP manufacturer. It can provide privacy for the software and data sent to the system, resident on it, or retrieved from it, with respect to all parties—including the person/party in physical possession of the device.Type: ApplicationFiled: May 21, 2021Publication date: June 15, 2023Applicant: Octavo Systems LLCInventors: Peter Robert LINDER, Masood MURTUZA, Erik James WELSH, William Arthur Fitzhugh LEE
-
Patent number: 11610844Abstract: High performance modules for use in System-in-Package (SIP) devices, and methods of manufacture for such modules and SIPs. The modules employ one or more interposer substrates on which high performance components and/or devices are operatively mounted and interconnected.Type: GrantFiled: October 11, 2018Date of Patent: March 21, 2023Assignee: Octavo Systems LLCInventors: Gene Alan Frantz, Masood Murtuza, Erik James Welsh, Peter Robert Linder
-
Patent number: 11502030Abstract: A substrate for a SIP is that has a portion of its top surface covered with spaced apart electrically conductive landing pads for electrical connection to components located on the surface and the landing pads serve as interconnection pads for making electrical connections between at least a portion of said pads when interconnected by a segment of bond wire to form at least a portion of the SIP. Methods for use of the universal substrate in SIP system design and manufacture of a SIP.Type: GrantFiled: August 31, 2017Date of Patent: November 15, 2022Assignee: OCTAVO SYSTEMS LLCInventors: Masood Murtuza, Erik James Welsh, Peter Linder, Gene Alan Frantz
-
Patent number: 11373720Abstract: The present disclosure describes analog memories for use in a computer, such as a computer using a combination of analog and digital components/elements used in a cohesive manner.Type: GrantFiled: February 22, 2019Date of Patent: June 28, 2022Assignee: OCTAVO SYSTEMS LLCInventors: Peter Linder, Laurence Ray Simar, Jr., Erik James Welsh, Gene Alan Frantz
-
Patent number: 11347478Abstract: The present disclosure describes a mixed signal arithmetic logic unit configured to use a combination of analog processing elements and digital processing elements in a cohesive manner. Depending on the signals and the data received for processing, the analog processing elements and digital processing elements may be used separately, independently or in combination to optimize computational results and the performance of the mixed signal arithmetic logic unit.Type: GrantFiled: February 22, 2019Date of Patent: May 31, 2022Assignee: OCTAVO SYSTEMS LLCInventors: Erik James Welsh, Laurence Ray Simar, Jr., Peter Linder, Gene Alan Frantz
-
Patent number: 11257803Abstract: A System in a Package (SiP) device is provided with an interconnect area or a physical space on a main SiP substrate that allows for a customizable second packaged component or device to be externally interconnected with the components on the main substrate of a packaged SiP to allow for modifications to the functionality of the components and devices on a primary (or main) SiP substrate.Type: GrantFiled: August 23, 2019Date of Patent: February 22, 2022Assignee: OCTAVO SYSTEMS LLCInventors: Masood Murtuza, Erik James Welsh, Christopher Lloyd Reinert, Gene Alan Frantz
-
Patent number: 11171651Abstract: The present disclosure describes a mixed signal computer unit using a combination of analog and digital components/elements in a cohesive manner. Depending on the signals and data that need to be processed, the analog processing elements and digital processing elements may be used separately, independently or in combination to optimize the computational results and the performance of the computation. Operations may be controlled by one or more digital cores.Type: GrantFiled: February 22, 2019Date of Patent: November 9, 2021Assignee: OCTAVO SYSTEMS LLCInventors: Laurence Ray Simar, Jr., Erik James Welsh, Peter Linder, Gene Alan Frantz
-
Patent number: 11032910Abstract: Systems and methods for the design and use of a System-in-Package (SiP) device with a connection layout for minimizing a system Printed Circuit Board (PCB) using the SiP are provided.Type: GrantFiled: May 1, 2018Date of Patent: June 8, 2021Assignee: OCTAVO SYSTEMS LLCInventors: Erik James Welsh, Kevin Michael Troy
-
Publication number: 20210072958Abstract: The present disclosure describes a mixed signal arithmetic logic unit configured to use a combination of analog processing elements and digital processing elements in a cohesive manner. Depending on the signals and the data received for processing, the analog processing elements and digital processing elements may be used separately, independently or in combination to optimize computational results and the performance of the mixed signal arithmetic logic unit.Type: ApplicationFiled: February 22, 2019Publication date: March 11, 2021Applicant: Octavo Systems LLCInventors: Erik James WELSH, Laurence Ray SIMAR, Jr., Peter LINDER, Gene Alan FRANTZ
-
Publication number: 20200403618Abstract: The present disclosure describes a mixed signal computer unit using a combination of analog and digital components/elements in a cohesive manner. Depending on the signals and data that need to be processed, the analog processing elements and digital processing elements may be used separately, independently or in combination to optimize the computational results and the performance of the computation. Operations may be controlled by one or more digital cores.Type: ApplicationFiled: February 22, 2019Publication date: December 24, 2020Applicant: Octavo Systems LLCInventors: Laurence Ray SIMAR, Jr., Erik James WELSH, Peter LINDER, Gene Alan FRANTZ
-
Publication number: 20200402601Abstract: The present disclosure describes analog memories for use in a computer, such as a computer using a combination of analog and digital components/elements used in a cohesive manner.Type: ApplicationFiled: February 22, 2019Publication date: December 24, 2020Applicant: Octavo Systems LLCInventors: Peter LINDER, Laurence Ray SIMAR, Jr., Erik James WELSH, Gene Alan FRANTZ
-
Publication number: 20200243451Abstract: High performance modules for use in System-in-Package (SIP) devices, and methods of manufacture for such modules and SIPs. The modules employ one or more interposer substrates on which high performance components and/or devices are operatively mounted and interconnected.Type: ApplicationFiled: October 11, 2018Publication date: July 30, 2020Applicant: Octavo Systems LLCInventors: Gene Alan FRANTZ, Masood MURTUZA, Erik James WELSH, Peter Robert LINDER
-
Publication number: 20200066702Abstract: Methods and structures for manufacturing one or more System in a Package (SiP) devices. The functionality of a packaged SiP device can be modified according to aspects of the disclosure.Type: ApplicationFiled: August 23, 2019Publication date: February 27, 2020Applicant: OCTAVO SYSTEMS LLCInventors: Masood MURTUZA, Erik James Welsh, Christopher Lloyd Reinert, Gene Alan FRANTZ
-
Patent number: 10470294Abstract: Methods and systems for reducing the number of, and values of, passive components, such as capacitors, in System-in-Package devices below vendor recommendations for an active component are provided.Type: GrantFiled: May 1, 2018Date of Patent: November 5, 2019Assignee: OCTAVO SYSTEMS LLCInventors: Erik James Welsh, Peter Linder
-
Publication number: 20190206779Abstract: A substrate for a SIP is that has a portion of its top surface covered with spaced apart electrically conductive landing pads for electrical connection to components located on the surface and the landing pads serve as interconnection pads for making electrical connections between at least a portion of said pads when interconnected by a segment of bond wire to form at least a portion of the SIP. Methods for use of the universal substrate in SIP system design and manufacture of a SIP.Type: ApplicationFiled: August 31, 2017Publication date: July 4, 2019Applicant: OCTAVO SYSTEMS LLCInventors: Masood MURTUZA, Erik James WELSH, Peter LINDER, Gene Alan FRANTZ
-
Publication number: 20180317316Abstract: Methods and systems for reducing the number of, and values of, passive components, such as capacitors, in System-in-Package devices below vendor recommendations for an active component are provided.Type: ApplicationFiled: May 1, 2018Publication date: November 1, 2018Applicant: Octavo Systems LLCInventors: Erik James Welsh, Peter Linder
-
Publication number: 20180317323Abstract: Systems and methods for the design and use of a System-in-Package (SiP) device with a connection layout for minimizing a system Printed Circuit Board (PCB) using the SiP are provided.Type: ApplicationFiled: May 1, 2018Publication date: November 1, 2018Applicant: Octavo Systems LLCInventors: Erik James Welsh, Kevin Michael Troy