Abstract: Described herein are methods, systems, and apparatuses to utilize a laser device comprising a gain section, a wavelength filter, a first reflector, and a second reflector to form a laser cavity with the first reflector, the laser cavity to include the gain section and the wavelength filter. The wavelength filter is temperature stabilized to a predetermined temperature range and the remaining portions of the laser cavity are not temperature stabilized. The wavelength filter, when at the predetermined temperature range, comprises a plurality of adjacent longitudinal modes such that a difference in modal gain values associated with each of the adjacent longitudinal modes is within a predetermined delta. Thus, the cavity of the laser device is designed to experience some mode hops when the device temperature changes; however, because the wavelength filter is stabilized in temperature, the cavity drift due to these mode hops is within a limited range.

Abstract: Embodiments of the invention describe photonic integrated circuits (PICs) formed using simultaneous fabrication operations performed on photonic device layers. Each device of a PIC may be made from different optimized materials by growing the materials separately, cutting pieces of the different materials and bonding these pieces to a shared wafer. Embodiments of the invention bond photonic device layers so that shared (i.e., common) processing operations may be utilized to make more than one device simultaneously. Embodiments of the invention allow for simpler, more cost effective fabrication of PICs and improve photonic device performance and reliability.

Abstract: Described herein are methods, systems, and apparatuses to utilize a laser device comprising a gain section, a wavelength filter, a first reflector, and a second reflector to form a laser cavity with the first reflector, the laser cavity to include the gain section and the wavelength filter. The wavelength filter is temperature stabilized to a predetermined temperature range and the remaining portions of the laser cavity are not temperature stabilized. The wavelength filter, when at the predetermined temperature range, comprises a plurality of adjacent longitudinal modes such that a difference in modal gain values associated with each of the adjacent longitudinal modes is within a predetermined delta. Thus, the cavity of the laser device is designed to experience some mode hops when the device temperature changes; however, because the wavelength filter is stabilized in temperature, the cavity drift due to these mode hops is within a limited range.

Abstract: Described herein are methods, systems, and apparatuses to utilize an electro-optic modulator including one or more heating elements. The modulator can utilize one or more heating elements to control an absorption or phase shift of the modulated optical signal. At least the active region of the modulator and the one or more heating elements of the modulator are included in a thermal isolation region comprising a low thermal conductivity to thermally isolate the active region and the one or more heating elements from a substrate of the PIC.

Abstract: Described herein are methods, systems, and apparatuses to utilize shielding regions formed in photonic integrated circuits (PICs). Portions of layers of a PIC are selectively removed, and optionally, replaced with another material. These regions are formed to block stray light from interacting with optical components of the PIC, and therefore can prevent optical crosstalk and/or noise. Metal or another absorption/reflective material can be deposited in the place of the removed layer portions of the PIC to absorb or reflect light. Additionally, by depositing metal, RF isolation can be achieved by forming a ground plane, by forming a ground trace that shields a signal trace in an RF transmission line, or by placing a conductor which terminates electric fields between sensitive RF receivers and adjacent RF elements. Additionally the process operations required to perform isolation can also be used to change the thermal conductivity of devices and regions on a PIC.

Abstract: Embodiments of the invention describe photonic integrated circuits (PICs) formed using simultaneous fabrication operations performed on photonic device layers. Each device of a PIC may be made from different optimized materials by growing the materials separately, cutting pieces of the different materials and bonding these pieces to a shared wafer. Embodiments of the invention bond photonic device layers so that shared (i.e., common) processing operations may be utilized to make more than one device simultaneously. Embodiments of the invention allow for simpler, more cost effective fabrication of PICs and improve photonic device performance and reliability.

Abstract: Embodiments of the invention describe apparatuses, systems, and methods of thermal management for photonic integrated circuits (PICs). Embodiments include a first device and a second device comprising including waveguides, wherein the first and second devices have different thermal operating conditions. A first region is adjacent to a waveguide of the first device, wherein its optical mode is to be substantially confined by the first region, and wherein the first region has a first thermal conductivity to dissipate heat based on the thermal operating condition of the first device. A second region is adjacent to a waveguide of the second device, wherein its optical mode is to be substantially confined by the second region, and wherein the second region has a second thermal conductivity to dissipate heat based on the thermal operating condition of the second device. In some embodiments, thermal cross talk is reduced without significantly affecting optical performance.

Abstract: A roller arrangement for booklet makers comprises at least a first (1) and a second (2) pair of rotatably driven rollers, between which booklets (4) are intended to pass successively for folding. The first pair of rollers comprises two rollers (1) that are arranged such that they can move towards and away from each other and having a spring loading towards each other, while the second pair of rollers (2) comprises two rollers with a mutual separation that can be adjusted. Mechanical means (3) are arranged to, following the insertion of a booklet between the rollers of the first pair of rollers, automatically adjust the mutual separation of the rollers of the second pair of rollers depending on the distance between the rollers of the first pair of rollers.

Abstract: A roller arrangement for booklet makers comprises at least a first (1) and a second (2) pair of rotatably driven rollers, between which booklets (4) are intended to pass successively for folding. The first pair of rollers comprises two rollers (1) that are arranged such that they can move towards and away from each other and having a spring loading towards each other, while the second pair of rollers (2) comprises two rollers with a mutual separation that can be adjusted. Mechanical means (3) are arranged to, following the insertion of a booklet between the rollers of the first pair of rollers, automatically adjust the mutual separation of the rollers of the second pair of rollers depending on the distance between the rollers of the first pair of rollers.