Patents by Inventor Erin K. Yaeger

Erin K. Yaeger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reworkable thermosetting resin composition
    Publication number: 20080214840
    Abstract: This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.
    Type: Application
    Filed: December 20, 2007
    Publication date: September 4, 2008
    Applicant: Henkel Corporation
    Inventors: Philip T. Klemarczyk, Andrew D. Messana, Afranio Torres-Filho, Erin K. Yaeger, Takahisa Doba
  • Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith
    Patent number: 7109061
    Abstract: A flip-chip type integrated circuit chip including a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical interconnection with a carrier substrate is provided. The chip die includes a fluxing agent disposed on a surface of the electrical contacts, and a curable thermosetting underfill composition distinct from the fluxing agent and disposed in a flowable form over the chip die. Upon mating of the chip die with the substrate and heating, the electrical contacts flow and the thermosetting underfill composition cures, thus adhering the chip die to the substrate, forming a circuit assembly.
    Type: Grant
    Filed: November 6, 2001
    Date of Patent: September 19, 2006
    Assignee: Henkel Corporation
    Inventors: Lawrence N. Crane, Mark M. Konarski, Erin K. Yaeger, Afranio Torres-Filho, J. Paul Krug, Rebecca Tishkoff
  • Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent
    Patent number: 7012120
    Abstract: This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.
    Type: Grant
    Filed: March 27, 2001
    Date of Patent: March 14, 2006
    Assignee: Henkel Corporation
    Inventors: Philp T. Klemarczyk, Andrew D. Messana, Afranio Torres-Filho, Erin K. Yaeger, Takahisa Doba
  • Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom
    Patent number: 6887737
    Abstract: This invention relates to epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, thermosetting resin compositions based on such epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, reaction products of which are controllably degradable when subjected to appropriate conditions.
    Type: Grant
    Filed: December 13, 2001
    Date of Patent: May 3, 2005
    Assignee: Henkel Corporation
    Inventors: John G. Woods, Afranio Torres-Filho, Rebecca L. Tishkoff, Erin K. Yaeger, Jianzhao Wang
  • Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith
    Publication number: 20020089067
    Abstract: A flip-chip type integrated circuit chip including a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical interconnection with a carrier substrate is provided. The chip die includes a fluxing agent disposed on a surface of the electrical contacts, and a curable thermosetting underfill composition distinct from the fluxing agent and disposed in a flowable form over the chip die. Upon mating of the chip die with the substrate and heating, the electrical contacts flow and the thermosetting underfill composition cures, thus adhering the chip die to the substrate, forming a circuit assembly.
    Type: Application
    Filed: November 6, 2001
    Publication date: July 11, 2002
    Applicant: Loctite Corporation
    Inventors: Lawrence N. Crane, Mark M. Konarski, Erin K. Yaeger, Afranio Torres-Filho, J. Paul Krug, Rebecca Tishkoff