Patents by Inventor Erin Welch
Erin Welch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11309462Abstract: A semiconductor light emitting device includes a light emitting diode (LED) chip, a recipient luminophoric medium on the LED chip, a patterned superstrate on the recipient luminophoric medium opposite the LED chip, the patterned superstrate comprising a patterned superstrate on the recipient luminophoric medium opposite the LED chip, the patterned superstrate comprising a patterned surface that is configured to reduce a variation in a color point of a light emitted by the semiconductor light emitting device as a function of an angle off an optical axis of the LED chip.Type: GrantFiled: April 22, 2019Date of Patent: April 19, 2022Assignee: CREE LED, INC.Inventors: Erin Welch, Paul Thomas Fini, Eric Tarsa, Kenneth Morgan Davis
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Publication number: 20190326484Abstract: A semiconductor light emitting device includes a light emitting diode (LED) chip, a recipient luminophoric medium on the LED chip, a patterned superstrate on the recipient luminophoric medium opposite the LED chip, the patterned superstrate comprising a patterned superstrate on the recipient luminophoric medium opposite the LED chip, the patterned superstrate comprising a patterned surface that is configured to reduce a variation in a color point of a light emitted by the semiconductor light emitting device as a function of an angle off an optical axis of the LED chip.Type: ApplicationFiled: April 22, 2019Publication date: October 24, 2019Inventors: Erin Welch, Paul Thomas Fini, Eric Tarsa, Kenneth Morgan Davis
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Patent number: 9897267Abstract: Light emitter components, systems, and related methods having improved optical efficiency and a lower manufacturing cost are disclosed. In one aspect, a light emitter component can include a substrate having an elongated body and first and second ends. At least a first trace and a second trace can be provided on the substrate. In some aspects, the first trace can be disposed proximate the first end of the substrate and the second trace can be disposed proximate the second end of the substrate, with no other portion of the first trace or second trace being disposed between the first and second ends of the substrate. In some aspects, a string of LED chips can be provided on the substrate. The string of LED chips can be disposed between the first and second ends of the substrate. Angled traces, gaps and light emitter components can also be provided in some aspects.Type: GrantFiled: March 15, 2013Date of Patent: February 20, 2018Assignee: Cree, Inc.Inventors: Christopher P. Hussell, Sung Chul Joo, Erin Welch, Peter Scott Andrews, Joseph G. Clark, John A. Edmond, Jesse C. Reiherzer
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Patent number: 9780268Abstract: Submount based surface mount design (SMD) light emitter components and related methods are disclosed. In some aspects, light emitter components can include a submount with a first side having a first surface area, first and second electrical contacts disposed on the first side of the submount, and at least one light emitter chip on the first side. In some aspects, the electrical contact area can be less than half of the first surface area of the first side of the submount. Components disclosed herein can include low profile parts or domes where a ratio between a dome height and a dome width is less than 0.5. A method of providing components can include providing a panel of material and LED chips, dispensing a liquid encapsulant material over the panel, and singulating the panel into individual submount based components after the encapsulant material has hardened.Type: GrantFiled: January 31, 2013Date of Patent: October 3, 2017Assignee: Cree, Inc.Inventors: Christopher P. Hussell, Erin Welch, Jesse Colin Reiherzer, Peter Scott Andrews
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Patent number: 9735198Abstract: Substrate based light emitter devices, components, and related methods are disclosed. In some aspects, light emitter components can include a substrate and a plurality of light emitter devices provided over the substrate. Each device can include a surface mount device (SMD) adapted to mount over an external substrate or heat sink. In some aspects, each device of the plurality of devices can include at least one LED chip electrically connected to one or more traces and at least one pair of bottom contacts adapted to mount over a surface of external substrate. The component can further include a continuous layer of encapsulant disposed over each device of the plurality of devices. Multiple devices can be singulated from the component.Type: GrantFiled: March 15, 2013Date of Patent: August 15, 2017Assignee: Cree, Inc.Inventors: Sung Chul Joo, Peter Scott Andrews, Erin Welch
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Patent number: 9590155Abstract: Light emitting devices and substrates are provided with improved plating. In one embodiment, a light emitting device can include a submount and one or more light emitting diodes (LED) chips disposed over the submount. In one embodiment, the submount can include a copper (Cu) substrate, a first metallic layer of material that is highly reflective disposed over the Cu substrate for increased brightness of the device, and a second metallic layer disposed between the Cu substrate and the first metallic layer for forming a barrier therebetween.Type: GrantFiled: March 14, 2013Date of Patent: March 7, 2017Assignee: Cree, Inc.Inventors: Christopher P. Hussell, Jesse Colin Reiherzer, Erin Welch
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Patent number: 8878204Abstract: Submount based light emitter components and methods are provided herein. In one aspect, a submount based light emitter component can include a primary submount, a secondary submount, and at least one light emitter chip. The at least one light emitter chip can be disposed over the primary submount and electrically connected to the secondary submount.Type: GrantFiled: March 14, 2013Date of Patent: November 4, 2014Assignee: Cree, Inc.Inventors: Jesse Colin Reiherzer, Christopher P. Hussell, Erin Welch
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Publication number: 20140268728Abstract: Light emitter components, systems, and related methods having improved optical efficiency and a lower manufacturing cost are disclosed. In one aspect, a light emitter component can include a substrate having an elongated body and first and second ends. At least a first trace and a second trace can be provided on the substrate. In some aspects, the first trace can be disposed proximate the first end of the substrate and the second trace can be disposed proximate the second end of the substrate, with no other portion of the first trace or second trace being disposed between the first and second ends of the substrate. In some aspects, a string of LED chips can be provided on the substrate. The string of LED chips can be disposed between the first and second ends of the substrate. Angled traces, gaps and light emitter components can also be provided in some aspects.Type: ApplicationFiled: March 15, 2013Publication date: September 18, 2014Applicant: CREE, INC.Inventors: Christopher P. Hussell, Sung Chul Joo, Erin Welch, Peter Scott Andrews, Joseph G. Clark, John A. Edmond, Jesse C. Reiherzer
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Publication number: 20140070235Abstract: Improved wire bonds and light emitting devices and related methods are disclosed. In one aspect, an improved wire bond can include a shaped wire bond, where at least a portion of the wire bond includes a negative kink and/or a concave shape with respect to an underlying substrate.Type: ApplicationFiled: September 7, 2012Publication date: March 13, 2014Inventors: Peter Scott Andrews, Erin Welch, Andrew Signor, Christopher P. Hussell
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Publication number: 20130328070Abstract: Light emitting devices and substrates are provided with improved plating. In one embodiment, a light emitting device can include a submount and one or more light emitting diodes (LED) chips disposed over the submount. In one embodiment, the submount can include a copper (Cu) substrate, a first metallic layer of material that is highly reflective disposed over the Cu substrate for increased brightness of the device, and a second metallic layer disposed between the Cu substrate and the first metallic layer for forming a barrier therebetween.Type: ApplicationFiled: March 14, 2013Publication date: December 12, 2013Inventors: Christopher P. Hussell, Jesse Colin Reiherzer, Erin Welch
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Publication number: 20130292708Abstract: Submount based light emitter components and methods are provided herein. In one aspect, a submount based light emitter component can include a primary submount, a secondary submount, and at least one light emitter chip. The at least one light emitter chip can be disposed over the primary submount and electrically connected to the secondary submount.Type: ApplicationFiled: March 14, 2013Publication date: November 7, 2013Applicant: CREE, INC.Inventors: Jesse Colin Reiherzer, Christopher P. Hussell, Erin Welch
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Publication number: 20130258658Abstract: Devices, components and methods containing one or more light emitter devices, such as light emitting diodes (LEDs) or LED chips, are disclosed. In one aspect, a light emitter device component can include a ceramic body having a top surface, one or more light emitter devices mounted directly or indirectly on the top surface, and one or more electrical components mounted on the top surface and electrically coupled to the one or more light emitter devices, wherein the one or more electrical components can be spaced from the ceramic body by one or more non-metallic layers. Components disclosed herein can result in improved light extraction and thermal management.Type: ApplicationFiled: March 30, 2012Publication date: October 3, 2013Inventors: Christopher P. Hussell, Peter Scott Andrews, Florin A. Tudorica, Erin Welch
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Publication number: 20130256711Abstract: Substrate based light emitter devices, components, and related methods are disclosed. In some aspects, light emitter components can include a substrate and a plurality of light emitter devices provided over the substrate. Each device can include a surface mount device (SMD) adapted to mount over an external substrate or heat sink. In some aspects, each device of the plurality of devices can include at least one LED chip electrically connected to one or more traces and at least one pair of bottom contacts adapted to mount over a surface of external substrate. The component can further include a continuous layer of encapsulant disposed over each device of the plurality of devices. Multiple devices can be singulated from the component.Type: ApplicationFiled: March 15, 2013Publication date: October 3, 2013Applicant: CREE, INC.Inventors: Sung Chul Joo, Peter Scott Andrews, Erin Welch
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Patent number: D721339Type: GrantFiled: June 27, 2012Date of Patent: January 20, 2015Assignee: Cree, Inc.Inventors: Christopher P. Hussell, Erin Welch
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Patent number: D753612Type: GrantFiled: September 7, 2012Date of Patent: April 12, 2016Assignee: Cree, Inc.Inventors: Christopher P. Hussell, Peter Scott Andrews, Erin Welch, Andrew Signor