Abstract: A method of processing a wafer in a production tool includes receiving a wafer at a process tool, the wafer associated with a wafer process history, acquiring data associated with wafers processed by the process tool and having the wafer process history, when the amount of acquired data is insufficient, acquiring additional data associated with wafers processed by the process tool and having a process history differing from the wafer process history by a single factor, when the amount of acquired data is sufficient, determining a process parameter using the acquired data, and processing the wafer with the production tool using the process parameter.

Abstract: A method and an apparatus are provided for parallel fault detection. The method comprises receiving data associated with processing of a workpiece by a first processing tool, receiving data associated with processing of a workpiece by a second processing tool and comparing at least a portion of the received data to a common fault model to determine if a fault associated with at least one of the processing of the workpiece by the first processing tool and processing of the workpiece by the second processing tool occurred.

Abstract: The present invention provides a method and apparatus for hierarchical process control. The method includes accessing at least one first metric indicative of processing performed on a wafer by a plurality of tool groups. The method also includes providing at least one tool group parameter to each of the plurality of tool groups based on the at least one first metric and accessing a plurality of second metrics. Each second metric is associated with a corresponding one of the plurality of tool groups and is indicative of processing performed on the wafer by the plurality of tools in the corresponding tool group. The method further includes providing at least one tool parameter to at least one tool in each of the plurality of tool groups based on the second metric associated with the tool group and the at least one tool group parameter provided to the tool group.

Abstract: A method and an apparatus are provided for fault detection based on a multivariate sub-model. A method and apparatus is provided for fault detection on a multivariate sub-model. The method comprises defining a first model associated with a first sub-system of a processing tool, defining a second model associated with a second sub-system of the processing tool and detecting a fault associated with at least one of the first sub-system based on the first model and the second sub-system based on the second model.

Abstract: A method includes providing a process controller for controlling a process tool. The process tool is controlled in accordance with a process parameter. Measurements associated with the processing parameter for a plurality of runs of the process tool are accessed. A performance measure for the process controller is generated based on the process parameter and the measurements. A system includes a process tool, a process controller, and a performance monitor. The process controller is configured to control the process tool in accordance with a process parameter. The performance monitor is configured to retrieve measurements associated with the processing parameter for a plurality of runs of the process tool and generate a performance measure for the process controller based on the measured processing parameters.

Abstract: A method and an apparatus are provided for parallel fault detection. The method comprises receiving data associated with processing of a workpiece by a first processing tool, receiving data associated with processing of a workpiece by a second processing tool and comparing at least a portion of the received data to a common fault model to determine if a fault associated with at least one of the processing of the workpiece by the first processing tool and processing of the workpiece by the second processing tool occurred.

Abstract: A method and an apparatus for the determination of a process flow based upon fault detection. A process step upon a workpiece is performed. Fault detection analysis based upon the process step performed upon the workpiece is performed. A workpiece routing process is performed based upon the fault detection analysis. The wafer routing process includes using a controller to perform one or a rework process routing, a non-standard process routing, a fault verification process routing, a normal process routing, or a termination process routing, based upon the fault detection analysis.