Patents by Inventor Ernst Feurer
Ernst Feurer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150289373Abstract: For the production of a flexible circuit configuration, which contains a layer sequence and a film connected thereto, for the creation of through contacts through the film up to terminal surfaces of the layer sequence, it is proposed that the film be connected unstructured to the layer sequence provided in a defined position on the substrate and then, while the composite of layer sequence and film remains on the substrate, perforations be created through the film up to terminal surfaces of a conductive layer of the layer sequence and contact metal be deposited in structured form on the film and in the perforations as through contacts.Type: ApplicationFiled: April 15, 2015Publication date: October 8, 2015Inventors: Ernst Feurer, Bruno Holli, Alexander Kaiser, Karin Ruess
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Patent number: 9027240Abstract: For the production of a flexible circuit configuration, which contains a layer sequence and a film connected thereto, for the creation of through contacts through the film up to terminal surfaces of the layer sequence, it is proposed that the film be connected unstructured to the layer sequence provided in a defined position on the substrate and then, while the composite of layer sequence and film remains on the substrate, perforations be created through the film up to terminal surfaces of a conductive layer of the layer sequence and contact metal be deposited in structured form on the film and in the perforations as through contacts.Type: GrantFiled: October 1, 2010Date of Patent: May 12, 2015Assignee: Cicor Management AGInventors: Ernst Feurer, Bruno Holl, Alexander Kaiser, Karin Ruess
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Patent number: 8915489Abstract: A method is specified for the production of a flexible circuit configuration, which allows the manufacturing of such flexible circuits on a carrier film cost-effectively and with high precision. For this purpose, the carrier film is fastened at the beginning of the method on a rigid frame, which encloses an inner area, and spans the inner area using an inner surface. After finishing of a layer structure and optionally additional method steps, structures for flexible circuit configurations which are created over the inner surface may be cut out easily by cutting the flexible circuit configurations out of the inner surface as a cutout. Through the fastening of the carrier film on the frame, it is ensured during the various method steps of the production of the flexible circuit configuration that the carrier film, which is flexible per se, always forms a level foundation for the various method measures, in particular the photolithographic structuring of layers of a layer structure.Type: GrantFiled: April 9, 2013Date of Patent: December 23, 2014Assignee: Cicor Management AGInventors: Ernst Feurer, Bruno Holli, Alexander Kaiser, Karin Ruess
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Patent number: 8623450Abstract: For a method for producing a flexible circuit configuration in the form of a layer sequence of at least one insulating layer and at least one conductive layer, typically multiple insulating layers (N1, N2, N3, NF) and multiple structured conductive layers (L1, L2), the layer sequence for the flexible circuit configuration is deposited on a rigid substrate so that the adhesion of the layer sequence with respect to the substrate is less in an inner area, in which at least one, preferably multiple flexible circuit configurations are created, than in an edge area (RB) which surrounds the inner area (ZB). An intermediate layer can advantageously be deposited for this purpose in the edge area, which causes a stronger adhesion of the layer sequence over the edge area than the inner area, which is not provided with an intermediate layer.Type: GrantFiled: October 1, 2010Date of Patent: January 7, 2014Assignee: Cicor Management AGInventors: Ernst Feurer, Bruno Holl, Alexander Kaiser, Karin Ruess
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Publication number: 20130263780Abstract: A method is specified for the production of a flexible circuit configuration, which allows the manufacturing of such flexible circuits on a carrier film cost-effectively and with high precision. For this purpose, the carrier film is fastened at the beginning of the method on a rigid frame, which encloses an inner area, and spans the inner area using an inner surface. After finishing of a layer structure and optionally additional method steps, structures for flexible circuit configurations which are created over the inner surface may be cut out easily by cutting the flexible circuit configurations out of the inner surface as a cutout. Through the fastening of the carrier film on the frame, it is ensured during the various method steps of the production of the flexible circuit configuration that the carrier film, which is flexible per se, always forms a level foundation for the various method measures, in particular the photolithographic structuring of layers of a layer structure.Type: ApplicationFiled: April 9, 2013Publication date: October 10, 2013Inventors: Ernst Feurer, Bruno Holl, Alexander Kaiser, Karin Ruess
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Publication number: 20110272180Abstract: For the production of a flexible circuit configuration, which contains a layer sequence and a film connected thereto, for the creation of through contacts through the film up to terminal surfaces of the layer sequence, it is proposed that the film be connected unstructured to the layer sequence provided in a defined position on the substrate and then, while the composite of layer sequence and film remains on the substrate, perforations be created through the film up to terminal surfaces of a conductive layer of the layer sequence and contact metal be deposited in structured form on the film and in the perforations as through contacts.Type: ApplicationFiled: October 1, 2010Publication date: November 10, 2011Applicant: Cicor Management AGInventors: Ernst Feurer, Bruno Holl, Alexander Kaiser, Karin Ruess
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Publication number: 20110274829Abstract: For a method for producing a flexible circuit configuration in the form of a layer sequence of at least one insulating layer and at least one conductive layer, typically multiple insulating layers (N1, N2, N3, NF) and multiple structured conductive layers (L1, L2), the layer sequence for the flexible circuit configuration is deposited on a rigid substrate so that the adhesion of the layer sequence with respect to the substrate is less in an inner area, in which at least one, preferably multiple flexible circuit configurations are created, than in an edge area (RB) which surrounds the inner area (ZB). An intermediate layer can advantageously be deposited for this purpose in the edge area, which causes a stronger adhesion of the layer sequence over the edge area than the inner area, which is not provided with an intermediate layer.Type: ApplicationFiled: October 1, 2010Publication date: November 10, 2011Applicant: Cicor Management AGInventors: Ernst Feurer, Bruno Holl, Alexander Kaiser, Karin Ruess
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Publication number: 20110274830Abstract: A method is specified for the production of a flexible circuit configuration, which allows the manufacturing of such flexible circuits on a carrier film cost-effectively and with high precision. For this purpose, the carrier film is fastened at the beginning of the method on a rigid frame, which encloses an inner area, and spans the inner area using an inner surface. After finishing of a layer structure and optionally additional method steps, structures for flexible circuit configurations which are created over the inner surface may be cut out easily by cutting the flexible circuit configurations out of the inner surface as a cutout. Through the fastening of the carrier film on the frame, it is ensured during the various method steps of the production of the flexible circuit configuration that the carrier film, which is flexible per se, always forms a level foundation for the various method measures, in particular the photolithographic structuring of layers of a layer structure.Type: ApplicationFiled: October 1, 2010Publication date: November 10, 2011Applicant: Cicor Management AGInventors: Ernst Feurer, Bruno Holl, Alexander Kaiser, Karin Ruess
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Patent number: 5013581Abstract: The method of making an electrically conductive polymer-metal compound having a predetermined electrical conductivity on a substrate includes the steps of preparing a reaction mixture of a gaseous metallo-organic compound, a metal-free gaseous organic compound and a carrier gas such as argon or mixtures of argon and hydrogen, producing a glow discharge zone in the reaction mixture and exposing the substrate to action of the gaseous metallo-organic compound and the metal-free gaseous organic compound in the glow discharge zone in such a way as to produce a film or layer of the polymer-metal compound with a predetermined electrical conductivity. The selection of the electrical conductivity can be made by setting at least one of a number of parameters of the process including the pressure and temperature of the glow discharge zone, the power density in the glow discharge and particularly the ratio of the amount of metal-free gaseous organic compound to carrier gas.Type: GrantFiled: August 2, 1990Date of Patent: May 7, 1991Assignee: Schering AktiengesellschaftInventors: Harald Suhr, Angelika Etspuler, Ernst Feurer, Christian Oehr
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Patent number: 4980197Abstract: A method for manufacturing metallic structures on inorganic non-conductive substrates, in which desired structures to be produced on the upper faces of the substrates are covered with screen means and the objects are then subjected to the action of reactive halogen-containing gases in a glow-discharge zone. Then the screen means are removed from the objects and they are metallized by known physical methods.Type: GrantFiled: April 16, 1986Date of Patent: December 25, 1990Assignee: Schering AktiengesellschaftInventors: Harald Suhr, Ernst Feurer, Christian Oehr
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Patent number: 4717587Abstract: A method of producing electrically conductive structures on non-conductors, in which the deposition of metallic films on non-conductive substrates is carried out by disintegration of metallo-organic compositions in a glow discharge zone of a plasma reactor.Type: GrantFiled: March 17, 1986Date of Patent: January 5, 1988Assignee: Schering AktiengesellschaftInventors: Harald Suhr, Christian Oehr, Ernst Feurer