Abstract: This pick and place device and method for arranging components on a printed circuit board utilizes a placement head having an articulated, compliant tip for facilitating proper alignment of the component lead plane on the substrate, for example, in a fine pitch component placement machine where extreme accuracy must be achieved in matching the component leads to the circuit land pattern. In general, the articulating tip is fitted within a cavity or opening in the lower end of a spindle. Compressed air may be introduced into the cavity generating an air bearing, thus causing the articulating tip to comply with the upper surface of the component, or else the weight of the tip itself can be used to create the desired compliance. A vacuum force is then created within said opening sufficient to pick-up the component once the compressed air has been turned off. Various configurations of the articulating tip and various methods of air and/or vacuum application are provided.