Patents by Inventor Erwin G. Siwek

Erwin G. Siwek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4427716
    Abstract: A method is disclosed for predetermining the magnitude of the average release peel strength at the interface between a vapor deposited copper film and a flexible aluminum carrier sheet to which the copper has been previously directly applied. The resulting copper-to-aluminum adherence is due to the formation of a preferential diffusion bond.
    Type: Grant
    Filed: January 21, 1983
    Date of Patent: January 24, 1984
    Assignee: General Electric Company
    Inventor: Erwin G. Siwek