Patents by Inventor Erwin Ian Almagro
Erwin Ian Almagro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11735508Abstract: In a general aspect, an apparatus can include a leadframe including a plurality of leads disposed along a single edge of the apparatus. The apparatus can also include an assembly including a substrate and a plurality of semiconductor die disposed on the substrate, the assembly being mounted on the leadframe and an inductor having a first terminal and a second terminal. The first terminal of the inductor can be electrically coupled with the leadframe via a first contact pad of the leadframe. The second terminal of the inductor can be electrically coupled with the leadframe via a second contact pad of the leadframe. The first contact pad and the second contact pad can be exposed through a molding compound by respective mold cavities defined in the molding compound. The leadframe, the assembly and the inductor can be arranged in a stacked configuration.Type: GrantFiled: November 4, 2021Date of Patent: August 22, 2023Assignee: SEMICONDUCTOR COMONENTS INDUTRIES, LLCInventors: Jerome Teysseyre, Romel Manatad, Chung-Lin Wu, Bigildis Dosdos, Erwin Ian Almagro, Maria Cristina Estacio
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Publication number: 20220059443Abstract: In a general aspect, an apparatus can include a leadframe including a plurality of leads disposed along a single edge of the apparatus. The apparatus can also include an assembly including a substrate and a plurality of semiconductor die disposed on the substrate, the assembly being mounted on the leadframe and an inductor having a first terminal and a second terminal. The first terminal of the inductor can be electrically coupled with the leadframe via a first contact pad of the leadframe. The second terminal of the inductor can be electrically coupled with the leadframe via a second contact pad of the leadframe. The first contact pad and the second contact pad can be exposed through a molding compound by respective mold cavities defined in the molding compound. The leadframe, the assembly and the inductor can be arranged in a stacked configuration.Type: ApplicationFiled: November 4, 2021Publication date: February 24, 2022Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Jerome TEYSSEYRE, Romel MANATAD, Chung-Lin WU, Bigildis DOSDOS, Erwin Ian ALMAGRO, Maria Cristina ESTACIO
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Patent number: 11177203Abstract: In a general aspect, an apparatus can include a leadframe including a plurality of leads disposed along a single edge of the apparatus. The apparatus can also include an assembly including a substrate and a plurality of semiconductor die disposed on the substrate, the assembly being mounted on the leadframe and an inductor having a first terminal and a second terminal. The first terminal of the inductor can be electrically coupled with the leadframe via a first conductive clip, where the first terminal of the inductor can be coupled with a contact pad of the first conductive clip. The second terminal of the inductor can be electrically coupled with the leadframe via a second conductive clip, where the second terminal of the inductor can be coupled with a contact pad of the second conductive clip. The leadframe, the assembly and the inductor can be arranged in a stacked configuration.Type: GrantFiled: February 19, 2019Date of Patent: November 16, 2021Assignee: FAIRCHILD SEMICONDUCTOR CORPORATIONInventors: Jerome Teysseyre, Romel Manatad, Chung-Lin Wu, Bigildis Dosdos, Erwin Ian Almagro, Maria Cristina Estacio
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Publication number: 20190181083Abstract: In a general aspect, an apparatus can include a leadframe including a plurality of leads disposed along a single edge of the apparatus. The apparatus can also include an assembly including a substrate and a plurality of semiconductor die disposed on the substrate, the assembly being mounted on the leadframe and an inductor having a first terminal and a second terminal. The first terminal of the inductor can be electrically coupled with the leadframe via a first conductive clip, where the first terminal of the inductor can be coupled with a contact pad of the first conductive clip. The second terminal of the inductor can be electrically coupled with the leadframe via a second conductive clip, where the second terminal of the inductor can be coupled with a contact pad of the second conductive clip. The leadframe, the assembly and the inductor can be arranged in a stacked configuration.Type: ApplicationFiled: February 19, 2019Publication date: June 13, 2019Applicant: FAIRCHILD SEMICONDUCTOR CORPORATIONInventors: Jerome TEYSSEYRE, Romel MANATAD, Chung-Lin WU, Bigildis DOSDOS, Erwin Ian ALMAGRO, Maria Cristina ESTACIO
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Patent number: 10256178Abstract: In a general aspect, an apparatus can include a leadframe including a plurality of leads configured to be coupled with a printed circuit board. The plurality of leads can be disposed along a single edge of the apparatus. The apparatus can also include an assembly including a substrate and a plurality of semiconductor die disposed on the substrate. The assembly can being mounted on the leadframe. The apparatus can further include an inductor having a first terminal and a second terminal. The first terminal of the inductor can being coupled with the leadframe via a first contact pad, and the second terminal of the inductor can be coupled with the leadframe via a second contact pad. The leadframe, the assembly and the inductor can be arranged in a stacked configuration.Type: GrantFiled: August 31, 2017Date of Patent: April 9, 2019Assignee: Fairchild Semiconductor CorporationInventors: Jerome Teysseyre, Romel Manatad, Chung-Lin Wu, Bigildis Dosdos, Erwin Ian Almagro, Maria Cristina Estacio
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Publication number: 20180068935Abstract: In a general aspect, an apparatus can include a leadframe including a plurality of leads configured to be coupled with a printed circuit board. The plurality of leads can be disposed along a single edge of the apparatus. The apparatus can also include an assembly including a substrate and a plurality of semiconductor die disposed on the substrate. The assembly can being mounted on the leadframe. The apparatus can further include an inductor having a first terminal and a second terminal. The first terminal of the inductor can being coupled with the leadframe via a first contact pad, and the second terminal of the inductor can be coupled with the leadframe via a second contact pad. The leadframe, the assembly and the inductor can be arranged in a stacked configuration.Type: ApplicationFiled: August 31, 2017Publication date: March 8, 2018Applicant: FAIRCHILD SEMICONDUCTOR CORPORATIONInventors: Jerome TEYSSEYRE, Romel MANATAD, Chung-Lin WU, Bigildis DOSDOS, Erwin Ian ALMAGRO, Maria Cristina Estacio
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Publication number: 20090091010Abstract: Disclosed in this specification is a wireless semiconductor package with multiple dies, at least two of which are attached to a thermally and electrically conductive heat sink. The package provides an efficient means for dissipating heat.Type: ApplicationFiled: October 9, 2007Publication date: April 9, 2009Inventors: Paul Armand Calo, Margie T. Rios, Tiburcio A. Maldo, JoonSeo Son, Erwin Ian Almagro