Abstract: A semiconductor flow sensor provides a self-aligning seal between the sensor and a manifold carrying the fluid being measured. The sensor includes a sensing element and a semiconductor body having a fluid flow region formed therein. The sensing element crosses through a portion of the flow region and is supported by the semiconductor body. A characteristic of the fluid flowing through the flow region is measured by operation of the sensing element. A sealing ring integrally disposed on the semiconductor body surrounds the flow region and further provides a seal between the sensor and a manifold. To ensure accurate placement of the sealing ring with respect to the sensing element, the sealing ring is electroplated to the semiconductor body prior to formation of the flow region. A pressure and temperature stable seal between the sensor and the manifold is achieved by either compression of the sealing ring, or solder bonding of the sealing ring to the manifold.