Abstract: The invention relates to a device for guiding electromagnetic waves from a wave guide (10), in particular a multi-band wave guide, to a transmission line (20), in particular a micro strip line, arranged at one end of the wave guide (10), comprising coupling means (30-1, . . . , 30-7) for mechanical fixation and impedance matching between the wave guide (10) and the transmission line (20). It is the object of the invention to improve such a structure in the way that manufacturing is made easier and less expensive than according to prior art. According to the present invention that object is solved in the way that the coupling means comprises at least one dielectric layer (30) being mechanically connected with the main plane of the transmission line, the geometric dimension of that at least one dielectric layer extending along the propagation direction of the electromagnetic waves being correlated with the center frequency of electromagnetic waves in order to achieve optimised impedance matching.

Abstract: The invention relates to a waveguide manufacturing and a waveguide manufactured with the method, which can be integrated into a circuit structure manufactured with the multilayer ceramic technique. The core part (23, 33, 43, 53a, 53b, 53c) of the waveguide is formed by a unit assembled of ceramic layers, which is limited in the yz plane by two impedance discontinuities and in the xz plane by two planar surfaces (24, 25, 34, 35, 54a, 54c, 55a, 55b, 55c) made of conductive material. The conductive surfaces can be connected to each other by vias made of conductive material (38, 39, 48, 49). The waveguide manufactured with the method according to the invention is a fixed part of the circuit structure as a whole.

Abstract: The invention relates to structures, by which part of the incoming high-frequency energy can be separated to its own path (out1) or energies coming from different paths can be combined to a common path. The basic idea of the invention is that all components of the dividing or combining means are integrated into a monolithic structure in an insulating material, preferably multilayer ceramics. The transmission line strips (311) and other conductors are formed by printing conductive material on the outer surface of the ceramic piece (301) and in its interlayers, when required. The conductors between the surfaces are formed by filling the hole made through the layer or layers with conductive material. The resistive components (321) parallel with and between the surfaces are formed in a similar manner. The structure according to the invention is relatively small and reliable, and its manufacturing costs are low.