Abstract: The present invention provides an electrolyte material formulation comprising: (a) a monomer of formula (I) (b) a monomer of formula (II) and (c) a polymerizable compound, wherein A, X, B1, B2, R1 to R3, q and w are defined as those recited in the specification, and the monomer (b) is in an amount of about 1 part by weight to about 800 parts by weight and the polymerizable compound (c) is in an amount of about 1 part by weight to about 10000 parts by weight based on 100 parts by weight of the monomer (a). The present invention further provides an electrolytic material composition obtained by the polymerization of the aforementioned electrolytic material formulation. The electrolytic material composition can be applied to a solid electrolyte capacitor.

Abstract: The present invention provides a polyimide precursor composition comprising a polyimide precursor and a thermal base generator having the structure of formula (1): wherein R1, R2, R3, R4, R5 and Y? are as defined in the specification. The present invention also provides a polyimide prepared from the aforementioned precursor composition, and a preparation method thereof.

Abstract: The present invention provides a base generator having the structure of formula (1): wherein R1, R2, R3, R4, R5, and Y{circle around (?)} are defined as in the specification. The base generator of the present invention can be used for imidization of a polyimide precursor, promoting crosslinking of epoxy monomers, or crosslinking of polyurethane or polyurea.

Abstract: The present invention relates to an anti-reflection coating composition containing hollow particles, an adhesive, and a hydrophobic organic solvent, wherein the weight ratio of the hollow particles to the solids content of the adhesive is in the range of 1:2 to 1:20. The present invention also provides a method for producing the anti-reflection coating composition.

Abstract: The invention pertains to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemical resistance and flexibility, and can be used in a liquid photo resist composition or dry film photo resist composition, or used in a solder resist, coverlay film, or printed wiring board.