Patents by Inventor Ethem Erkan Aktakka

Ethem Erkan Aktakka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making a thin film device
    Patent number: 8209857
    Abstract: A thin-film device and a method of fabricating the thin-film device are provided herein. The thin-film device comprises a bond layer, a film layer that has bulk material properties, and a substrate that has a heat-sensitive component disposed thereon. The method of fabricating the thin-film device comprises the step of providing an active material that has bulk material properties. The active material is bonded to the substrate through the bond layer. After bonding the active material to the substrate, the active material that is bonded to the substrate is thinned to produce the film layer of the thin-film device. The substrate is provided with the heat-sensitive component disposed thereon prior to bonding the active material to the substrate.
    Type: Grant
    Filed: June 21, 2010
    Date of Patent: July 3, 2012
    Assignee: The Regents of the University of Michigan
    Inventors: Khalil Najafi, Ethem Erkan Aktakka, Hanseup Kim
  • Thin-Film Device and Method of Fabricating The Same
    Publication number: 20110012478
    Abstract: A thin-film device and a method of fabricating the thin-film device are provided herein. The thin-film device comprises a bond layer, a film layer that has bulk material properties, and a substrate that has a heat-sensitive component disposed thereon. The method of fabricating the thin-film device comprises the step of providing an active material that has bulk material properties. The active material is bonded to the substrate through the bond layer. After bonding the active material to the substrate, the active material that is bonded to the substrate is thinned to produce the film layer of the thin-film device. The substrate is provided with the heat-sensitive component disposed thereon prior to bonding the active material to the substrate.
    Type: Application
    Filed: June 21, 2010
    Publication date: January 20, 2011
    Inventors: Khalil Najafi, Ethem Erkan Aktakka, Hanseup Kim