Abstract: A composite containing directly adjoining and firmly bonded sections (I) and (II) of the following type: (I) section, formed from a thermoplastic moulding compound FM-1 containing at least one polyamide (A) and optionally fillers and reinforcing materials (C) and additives (D); (II) section, formed from a thermoplastic moulding compound containing at least one olefinic and/or vinyl aromatic polymer (E) and optionally fillers and reinforcing agents (F), plasticisers (G) and additives (H); wherein the moulding compound FM-1 or FM-2 contains 0.1 to 5.0 percent by weight of polyethyleneimine (B) or a copolymer or derivative thereof and a method for producing such composites.

Abstract: Thermoplastic polyamide moulding composition consisting of: (A) 30-99.9 percent by weight of at least one polyamide selected from the group consisting of: at least one aliphatic or semiaromatic polyamide, in each case with C:N ratio at least 8; at least one aliphatic or semiaromatic polyamide composed of at least one dicarboxylic acid and of at least one diamine and also optionally a proportion below 50 mol percent based on the entirety of dicarboxylic acids and diamine as 100 mol percent, of lactams and/or aminocarboxylic acids; and mixtures thereof; (B) 0.1-5.0 percent by weight of polyethyleneimine (PEI) or copolymers or derivatives thereof; (C) 0-60 percent by weight of fillers and/or reinforcing materials; (D) 0-5.0 percent by weight of additives; where the entirety of (A)-(D) provides 100% of the thermoplastic polyamide moulding composition, and also uses of such moulding compositions in particular in the context of components bonded to mineral glass.

Abstract: Polyamide moulding composition consisting of the following components (A) 28.0-64.9 wt % of at least one polyamide, (B) 15.0-40.0 wt % of glass fibres, (C) 15.0-35.0 wt % of glass flakes having a particle thickness in the range of 0.3-2.0 pi II, (D) 0.1-2.0 wt % of heat stabilizer, (E) 0-5.0 wt % of additives with the proviso that the sum of components (B) and (C) is in the range of 35.0 to 65.0 wt %, based on the sum of components (A) to (E), and the sum of components (A) to (E) makes 100 wt %.

Abstract: Polyamide moulding composition consisting of the following components (A) 28.0-64.9 wt % of at least one polyamide, (B) 15.0-40.0 wt % of glass fibres, (C) 15.0-35.0 wt % of glass flakes having a particle thickness in the range of 0.3-2.0 ?m, (D) 0.1-2.0 wt % of heat stabilizer, (E) 0-5.0 wt % of additives with the proviso that the sum of components (B) and (C) is in the range of 35.0 to 65.0 wt %, based on the sum of components (A) to (E), and the sum of components (A) to (E) makes 100 wt %.

Abstract: Thermoplastic polyamide moulding composition consisting of: (A) 30-99.9 percent by weight of at least one polyamide selected from the group consisting of: at least one aliphatic or semiaromatic polyamide, in each case with C:N ratio at least 8; at least one aliphatic or semiaromatic polyamide composed of at least one dicarboxylic acid and of at least one diamine and also optionally a proportion below 50 mol percent based on the entirety of dicarboxylic acids and diamine as 100 mol percent, of lactams and/or aminocarboxylic acids; and mixtures thereof; (B) 0.1-5.0 percent by weight of polyethyleneimine (PEI) or copolymers or derivatives thereof; (C) 0-60 percent by weight of fillers and/or reinforcing materials; (D) 0-5.0 percent by weight of additives; where the entirety of (A)-(D) provides 100% of the thermoplastic polyamide moulding composition, and also uses of such moulding compositions in particular in the context of components bonded to mineral glass.

Abstract: The present invention relates to a polyamide molding material with high fracture energy and molded parts produced therefrom which are particularly suitable for visible parts for automotive parts or for electronic devices. The polyamide molding material has, in addition to excellent fracture energy, a likewise excellent piano lacquer finish and a high rubbing resistance.

Abstract: The present invention relates to a polyamide moulding compound consisting of A 33-79.4 wt% of a polymer mixture consisting of A1 55 to 85 wt% of at least one semi-crystalline, aliphatic polyamide selected from the group PA 6, PA 46, PA 56, PA 66, PA 66/6, PA 610, PA 612, PA 6/12, PA 1010, PA 11, PA 12, PA 1012, PA 1212 and mixtures thereof; A2 15 to 45 wt% of at least one semi-aromatic polyamide selected from the group PA 6l, PA 5l/5T, PA 6l/6T, PA 10l/10T, PA 10T/6T, PA 6T/BACT/66/BAC6, PA MXD6, PA MXD6/MXDl and mixtures thereof; wherein the sum of A1 and A2 is 100 wt% of A; B 20 to 60 wt% of a reinforcing fibre; C 0.6 to 2.0 wt% metal borate, wherein the molar ratio of metal to boron is in the range from 0.5 to 4; D 0 to 5.0 wt% additives, different from A, B and C; wherein the sum of the components A to D is 100 wt% and wherein the moulding compound comprises neither copper halides nor metal phosphinates.

Abstract: The invention relates to a polyamide molding composition with good weathering resistance containing or preferably consisting of the following components: 85 to 99.85% by weight of a component A, where component A consists of polyamide A1 or of a mixture of the polyamides A1 and A2, where A1 is at least one amorphous or microcrystalline polyamide having more than 60 mol % of monomers having exclusively aliphatic structural units, based on the total amount of monomers, and A2 is at least one acyclic aliphatic polyamide, and where the sum of components A1 and A2 gives 100% by weight of component A; 0.05 to 2.0% by weight of at least one colorant B; 0.10 to 3.

Abstract: The invention relates to microwave-resistant mouldings comprising at least one amorphous or microcrystalline copolyamide moulding compound, comprising at least one amorphous or microcrystalline copolyamide (A), said copolyamide (A) containing at least the following monomers: (a) at least one cycloaliphatic diamine, (b) 0.25 to 30 mol % of at least one dimeric fatty acid and (c) at least one aromatic dicarboxylic acid, where the proportions of all the monomers add up to 100 mol % and which has a glass transition temperature of at least 155° C. and a dielectric loss factor tan ? of not more than 8.30×10?3. The invention also relates to the use of an amorphous or microcrystalline copolyamide moulding compound comprising the copolyamide (A) for production of microwave-resistant mouldings.

Abstract: A transparent polyamide moulding with high resistance to steam, containing at least one copolyamide with polyamide units AB/AC/D, wherein: (A) is selected as a cycloaliphatic diamine from the group: MACM and PACM; (B) is selected as an aromatic dicarboxylic acid from the group: isophthalic acid (I), naphthalenedicarboxylic acid, and terephthalic acid (T); (C) is selected as an aliphatic dicarboxylic acid from the group: decanedioic acid, undecanedioic acid, dodecanedioic acid, tridecanedioic acid, tetradecanedioic acid, pentadecanedioic acid, hexadecanedioic acid; and (D) is selected as at least one lactam or ?,?-aminocarboxylic acid from the group: laurolactam, undecanolactam, 12-aminododecanoic acid, and 11-aminoundecanoic acid, wherein: the proportions of polyamide units AB are from 30 to 45 mol %, the proportions of polyamide units AC are from 30 to 40 mol %, and the proportions of polyamide units D are from 20 to 32 mol %, and wherein the sum total of polyamide units AB, AC and D is 100 mol %.

Abstract: The invention relates to polyamide moulding compounds comprising the following components: a) 50 to 95% by weight of a single amorphous copolyamide constructed from monomers a1) to a6), b) 5 to 50% by weight of at least one glass filler, c) 0 to 15% by weight of at least one monomeric lactam and/or polyamide 12, d) 0 to 19% by weight of additives, the sum of components a) to d) producing 100% by weight. Furthermore, the invention relates to moulded articles made of this polyamide moulding compound.

Abstract: The present invention relates to an amorphous or microcrystalline copolyamide (A) containing at least the following monomers: (a) at least one cycloaliphatic diamine; (b) 0.25 to 4.4 mol % of at least one dimeric fatty acid; and (c) 12 to 49.75 mol % of at least one aromatic dicarboxylic acid selected from the group consisting of isophthalic acid, terephthalic acid and naphthalenedicarboxylic acid, and (d) 0 to 37.75 mol % of at least one aliphatic dicarboxylic acid; where the molar proportion of isophthalic acid is at least equal to the molar proportion of terephthalic acid, and where the monomers (b), (c) and optionally (d) add up to 50 mol % and the molar proportions of all the monomers present in the copolyamide (A) add up to 100 mol %. The invention further relates to moulding compounds comprising the copolyamide (A), to mouldings made therefrom and to the use thereof.

Abstract: A composite containing directly adjoining and firmly bonded sections (I) and (II) of the following type: (I) section, formed from a thermoplastic moulding compound FM-1 containing at least one polyamide (A) and optionally fillers and reinforcing materials (C) and additives (D); (II) section, formed from a thermoplastic moulding compound containing at least one olefinic and/or vinyl aromatic polymer (E) and optionally fillers and reinforcing agents (F), plasticisers (G) and additives (H); wherein the moulding compound FM-1 or FM-2 contains 0.1 to 5.0 percent by weight of polyethyleneimine (B) or a copolymer or derivative thereof and a method for producing such composites.

Abstract: Disclosed are polyamide moulding compounds having a relative permittivity of no more than 3.5 at 2.45 GHz, and having the following components: (A) 25 to 80% by weight of a mixture made of at least one partially crystalline aliphatic polyamide and at least one amorphous or microcrystalline polyamide, (B) 20 to 65% by weight of at least one glass filler, and (C) 0 to 10% by weight of additives, the sum of components (A), (B) and (C) producing 100% by weight. The polyamide moulding compounds are for use in components of devices such as laptops and mobile phones.

Abstract: Disclosed are polyamide moulding compounds having a relative permittivity of no more than 3.5 at 2.45 GHz, and having the following components: (A) 25 to 80% by weight of a mixture made of at least one partially crystalline aliphatic polyamide and at least one amorphous or microcrystalline polyamide, (B) 20 to 65% by weight of at least one glass filler, and (C) 0 to 10% by weight of additives, the sum of components (A), (B) and (C) producing 100% by weight. The polyamide moulding compounds are for use in components of devices such as laptops and mobile phones.

Abstract: Polyamide moulding composition consisting of the following components (A) 28.0-64.9 wt % of at least one polyamide, (B) 15.0-40.0 wt % of glass fibres, (C) 15.0-35.0 wt % of glass flakes having a particle thickness in the range of 0.3-2.0 ?m, (D) 0.1-2.0 wt % of heat stabilizer, (E) 0-5.0 wt % of additives with the proviso that the sum of components (B) and (C) is in the range of 35.0 to 65.0 wt %, based on the sum of components (A) to (E), and the sum of components (A) to (E) makes 100 wt %.

Abstract: The present invention relates to a polyamide molding compound comprising the following components or consisting of these components: (A) 50 to 95 wt % of a mixture comprising the specific polyamides (A1) and (A2); (B) 5 to 50 wt % of at least one glass filler having a refractive index in the range from 1.510 to 1.539; (C) 0 to 10 wt % of at least one additive; wherein the weight proportions of the components (A) to (C) add up to 100% by weight; wherein the content of (A1) in the mixture (A) is >50 wt %, if the ratio is ?2/?1>1 and the content of (A2) in the mixture (A) is >50 wt %, if the ratio is ?2/?1?1, where ?1=n(A1)?n(B) applies and ?2=n(B)?n(A2) applies; wherein the transparent polyamides (A1) and (A2) have a transparency of at least 90% and a haze of at most 3%; and wherein the mixture (A) has a transparency of at least 88% and a haze of at most 5%. The present invention furthermore relates to molded bodies composed of these polyamide molding compounds.

Abstract: The present invention relates to a polyamide molding compound comprising the following components or consisting of these components: (A) 50 to 95 wt % of a mixture comprising the specific polyamides (A1) and (A2); (B) 5 to 50 wt % of at least one glass filler having a refractive index in the range from 1.540 to 1.600; (C) 0 to 10 wt % of at least one additive; wherein the weight proportions of the components (A) to (C) add up to 100% by weight; wherein the content of (A1) in the mixture (A) is >50 wt %, if the ratio is ?2/?1>1 and the content of (A2) in the mixture (A) is >50 wt %, if the ratio is ?2/?1?1, where ?1=n(A1)?n(B) applies and ?2=n(B)?n(A2) applies; wherein the transparent polyamides (A1) and (A2) have a transparency of at least 90% and a haze of at most 3%; and wherein the mixture (A) has a transparency of at least 88% and a haze of at most 5%. The present invention additionally relates to molded bodies composed of these polyamide molding compounds.

Abstract: The present invention relates to a polyamide molding compound comprising the following components or consisting of these components: (A) 40 to 95 wt % of a specific polyamide mixture consisting of the polyamides (A1) and (A2); (B) 5 to 50 wt % of at least one glass filler having a refractive index in the range from 1.540 to 1.600; (C) 0 to 10 wt % of at least one additive; wherein the weight proportions of the components (A) to (C) add up to 100% wt %; wherein the at least one transparent polyamide (A2) has a transparency of at least 90% and a haze of at most 3%. The present invention additionally relates to molded bodies composed of this polyamide molding compound.

Abstract: Thermoplastic polyamide moulding composition consisting of: (A) 30-99.9 percent by weight of at least one polyamide selected from the group consisting of: at least one aliphatic or semiaromatic polyamide, in each case with C:N ratio at least 8; at least one aliphatic or semiaromatic polyamide composed of at least one dicarboxylic acid and of at least one diamine and also optionally a proportion below 50 mol percent based on the entirety of dicarboxylic acids and diamine as 100 mol percent, of lactams and/or aminocarboxylic acids; and mixtures thereof; (B) 0.1-5.0 percent by weight of polyethyleneimine (PEI) or copolymers or derivatives thereof; (C) 0-60 percent by weight of fillers and/or reinforcing materials; (D) 0-5.0 percent by weight of additives; where the entirety of (A)-(D) provides 100% of the thermoplastic polyamide moulding composition, and also uses of such moulding compositions in particular in the context of components bonded to mineral glass.