Patents by Inventor Etsuji Kameda

Etsuji Kameda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Micro-etching composition for copper or copper alloy, micro-etching method, and method for manufacturing printed circuit board
    Patent number: 6746621
    Abstract: A micro-etching composition and a printed circuit board fabricated by using the micro-etching composition are provided. The micro-etching composition, comprising a main ingredient consisting of sulfuric acid and hydrogen peroxide and an assisting ingredient consisting of phenyltetrazole and a chloride ion source, can continuously treat the surface of copper and copper alloys to produce fine microscopic pits for improved adhesion to resins without producing a brown or black deposit. The printed circuit board exhibits excellent adhesion between inner layer circuit patterns and insulation resin layers, and is free from haloing.
    Type: Grant
    Filed: July 26, 2001
    Date of Patent: June 8, 2004
    Assignee: Mec Co., Ltd.
    Inventors: Yoshihiro Kurii, Etsuji Kameda, Sachiko Nakamura
  • Micro-etching composition for copper or copper alloy, micro-etching method, and method for manufacturing printed circuit board
    Publication number: 20020038790
    Abstract: A micro-etching composition and a printed circuit board fabricated by using the micro-etching composition are provided. The micro-etching composition, comprising a main ingredient consisting of sulfuric acid and hydrogen peroxide and an assisting ingredient consisting of phenyltetrazole and a chloride ion source, can continuously treat the surface of copper and copper alloys to produce fine microscopic pits for improved adhesion to resins without producing a brown or black deposit. The printed circuit board exhibits excellent adhesion between inner layer circuit patterns and insulation resin layers, and is free from haloing.
    Type: Application
    Filed: July 26, 2001
    Publication date: April 4, 2002
    Applicant: MEC Co., Ltd.
    Inventors: Yoshihiro Kurii, Etsuji Kameda, Sachiko Nakamura