Patents by Inventor Eu Poh Leng

Eu Poh Leng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF FORMING BALL BOND
    Publication number: 20100059883
    Abstract: A method of forming a ball bond (10) includes forming a bonding ball (12) at an end of a bonding wire (16). The bonding ball (12) is preformed to a substantially ball bond shape at a preform location (14) remote from a bonding site (24). The preformed bonding ball (22) is subsequently bonded to the bonding site (24).
    Type: Application
    Filed: September 5, 2008
    Publication date: March 11, 2010
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Kai Yun Yow, Eu Poh Leng