Abstract: The invention relates to a method for ascertaining a rough trajectory from a specified contour for controlling a machine tool which has at least two mutually redundant drive devices for carrying out superimposed movements, wherein the contour is determined by a contour function which is defined in portions at least by contour nodal points P0-Pn+1 with ascending indices and contour portion functions p0-pn assigned to the contour nodal points P0-Pn+1 and has a contour starting nodal point P0, wherein the rough trajectory is determined by a rough trajectory function which is defined in portions by rough trajectory nodal points Q0 to Qn+1 with ascending indices and has a rough trajectory starting nodal point Q0, wherein the rough trajectory starting nodal point Q0 is equated to the contour starting nodal point P0 and then in a first iteration step, on the basis of the contour nodal points Pj to Pn+1, the index value k of which is greater than or equal to the index value j of the respective rough trajectory sta

Abstract: The invention relates to a method for ascertaining a rough trajectory from a specified contour for controlling a machine tool which has at least two mutually redundant drive devices for carrying out superimposed movements, wherein the contour is determined by a contour function which is defined in portions at least by contour nodal points P0-Pn+1 with ascending indices and contour portion functions p0-pn assigned to the contour nodal points P0-Pn+1 and has a contour starting nodal point P0, wherein the rough trajectory is determined by a rough trajectory function which is defined in portions by rough trajectory nodal points Q0 to Qn+1 with ascending indices and has a rough trajectory starting nodal point Q0, wherein the rough trajectory starting nodal point Q0 is equated to the contour starting nodal point P0 and then in a first iteration step, on the basis of the contour nodal points Pj to Pn+1, the index value k of which is greater than or equal to the index value j of the respective rough trajectory sta

Abstract: The invention refers to an arrangement for positioning substrates, in particular for positioning wafers, within a device that is provided for exposure of the substrates and/or for measurement on the substrates by means of radiation under high-vacuum conditions. The following are provided according to the present invention: a retention system (4), displaceable on a linear guidance system (3), for receiving the substrate, the guidance direction of the linear guidance system (3) being oriented parallel or substantially parallel to the Y coordinate of an X, Y, Z spatial coordinate system; drives for limited modification of the inclination of the guidance direction relative to the Y coordinate; drives for limited rotation of the linear guidance system (3), including the retention system (4), about the guidance direction; and drives for parallel displacement of the linear guidance system (3), including the retention system (4), in the direction of the X coordinate, the Y coordinate, and/or the Z coordinate.

Abstract: The invention refers to an arrangement for positioning substrates, in particular for positioning wafers, within a device that is provided for exposure of the substrates and/or for measurement on the substrates by means of radiation under high-vacuum conditions.