Abstract: A process for manufacturing a 3-dimensional circuit board by electrophoretic deposition whereby (a) providing the board with a conductive surface and (b) applying a photoresist by electrophoretic deposition.

Abstract: A process is disclosed comprising laminating an anodically treated aluminum surface against a thermoset plastic substrate, whereby the surface of the substrate after chemically removing the aluminum has an improved affinity for the adherence thereon of electrolessly deposited metal films.

Abstract: An improvement is obtained in the bond strength between members of a laminate comprising a plastic substrate and a metal film through a process of first laminating to the plastic substrate a thin, sacrificial, anodized metal foil while providing at the interface prior to laminating of the foil to the plastic at least a mono molecular film of an organic silicon compound. After laminating the treated metal foil to the substrate under heat and pressure, the foil is chemically stripped from the substrate, leaving a surface of improved receptivity for conventional electroless plating and electroplating procedures, or other metallizing techniques. The final metal film when applied to the substrate exhibits consistently better adhesive strength than is obtained without the organic silicon treatment of the interface, especially in respect to adhesive strength at elevated temperature.

Abstract: An improvement is obtained in the bond strength between members of a laminate comprising a plastic substrate and a metal film through a process of first laminating to the plastic substrate a thin, sacrificial, anodized metal foil by heat and pressure, chemically stripping the foil from the substrate surface, activating the surface for electroless plating and electrolessly depositing a metal thereon, wherein the substrate is contacted with an aqueous solution containing an organic silicon compound at some stage subsequent to said chemical stripping operation. The final metal film when applied to the substrate exhibits consistently better adhesive strength than is obtained without the organic silicon treatment.

Abstract: Circuit boards for electronic equipment are produced in which the circuit-forming conductor metal is deposited on a suitably catalyzed and masked resin substrate by an all-additive electroless deposition technique, in which the characterizing feature is the use of a two-stage metal deposition to build up the desired total thickness of metal. In the first stage a fine grained, thin deposit of metal is produced on the substrate which is then water rinsed and immersed in a second metal bath having a sufficiently high rate of deposition to produce the desired total thickness of metal in a commercially practical period of time. Improved adhesion of plated metal to the resin substrate, both before and after thermal shock, is achieved by resort to this two-stage plating procedure.