Abstract: Radiation sensitive negative resists with requisite stability for dry processing of integrated circuits are polymerized from aromatic moieties containing halogen atoms. Halogen-aryl bridging, generally carbonaceous, increases sensitivity to radiation. Exemplary materials, copolymers prepared from aromatic and glycidyl methacrylate (GMA) comonomers, are suitable for direct processing of large-scale integrated circuits. While electron beam patterning is contemplated both for direct processing and mask making, radiation such as X-ray and deep u.v. may be used.

Abstract: Radiation sensitive negative resists with requisite stability for dry processing of integrated circuits are polymerized from aromatic moieties containing halogen atoms. Halogen-aryl bridging, generally carbonaceous, increases sensitivity to radiation. Exemplary materials, copolymers prepared from aromatic and glycidyl methacrylate (GMA) comonomers, are suitable for direct processing of large-scale integrated circuits. While electron beam patterning is contemplated both for direct processing and mask making, radiation such as X-ray and deep u.v. may be used.

Abstract: Fabrication of fine dimensioned circuits, e.g., VLSI includes at least one lithographic step dependent upon members of a particular category of polymer resists. Such resists, generally negative acting, are characterized by high contrast due to unusually narrow molecular weight distribution of the polymer molecules. This distribution is in turn dependent upon choice of a base polymer which is itself characterized by narrow molecular weight distribution due to "living polymerization" (solution anionic, polymerization). Functionalization of such base polymer is designedly such as to retain narrow distribution. Chlorinated polystyrene is exemplary of the resist category.

Abstract: A flame retardant, flexible, solder resistant covercoat has been formulated based on dichloropropyl acrylate.

Abstract: Negative resist compositions are based on carbonaceous polymers with substituent branches containing epoxy groupings. Exemplary materials which include, for example, a copolymer of glycidyl methacrylate and ethyl acrylate in which epoxy groupings are unesterified show high sensitivity, for example, to electron radiation and to X-rays. Resolution is sufficient to permit expedient fabrication of detailed resist patterns for integrated circuits. High adherence permits use of acid or base reagents and thermal stability permits use of ion milling for circuit fabrication.