Patents by Inventor Eui Sung Hwang

Eui Sung Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device for compensating for a test temperature deviation in a semiconductor device handler
    Patent number: 6861861
    Abstract: A semiconductor device handler is provided, in which a test temperature deviation of a semiconductor device caused by heat produced by the semiconductor device itself during testing is compensated for, allowing a test of the semiconductor device to be carried out at an exact temperature, or within an exact temperature range.
    Type: Grant
    Filed: February 14, 2003
    Date of Patent: March 1, 2005
    Assignee: LG Electronics Inc.
    Inventors: Jae Myeong Song, Chul Ho Ham, Chan Ho Park, Eui Sung Hwang, Woo Young Lim, Jae Bong Seo, Eung Yong Lee, Byeng Gi Lee
  • Device for compensating for a test temperature deviation in a semiconductor device handler
    Publication number: 20040017185
    Abstract: A semiconductor device handler is provided, in which a test temperature deviation of a semiconductor device caused by heat produced by the semiconductor device itself during testing is compensated for, allowing a test of the semiconductor device to be carried out at an exact temperature, or within an exact temperature range.
    Type: Application
    Filed: February 14, 2003
    Publication date: January 29, 2004
    Applicant: Mirae Corporation
    Inventors: Jae Myeong Song, Chul Ho Ham, Chan Ho Park, Eui Sung Hwang, Woo Young Lim, Jae Bong Seo, Eung Yong Lee, Byeng Gi Lee
  • Printed circuit board flat level compensating unit of surface mounting apparatus
    Patent number: 6347442
    Abstract: The present invention relates to a printed circuit board(PCB) flat level compensating unit of a surface mounting apparatus in which when a PCB is stopped at its working position and is firstly pushed up from the lower portion thereof, the PCB is secondly pushed to be raised thereby to be compensated its flat level and the mounting height for the PCB according the thickness is adjusted thereby to be increased a mounting efficient and a precision.
    Type: Grant
    Filed: May 9, 2000
    Date of Patent: February 19, 2002
    Assignee: Mirae Corporation
    Inventor: Eui Sung Hwang