Patents by Inventor Eun Ji Hong

Eun Ji Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240132571
    Abstract: The present invention relates to a composition for preventing or treating a bone disease, obesity or an obesity-mediated metabolic disease, cancer, or cancer metastasis, and a method of screening a drug for treating the diseases, which includes an inhibitor of transmembrane 4 L six family member 19 (TM4SF19) expression or activity.
    Type: Application
    Filed: January 17, 2023
    Publication date: April 25, 2024
    Applicant: MedPacto Inc.
    Inventors: Seong Jin KIM, Su Jin PARK, Jin Sun HEO, Eun Ji HONG, Hae In AN, Min Woo KIM
  • Patent number: 11942427
    Abstract: A semiconductor device includes a first interlayer insulating film disposed on a substrate and having a first trench. A first lower conductive pattern fills the first trench and includes first and second valley areas that are spaced apart from each other in a first direction parallel to an upper surface of the substrate. The first and second valley areas are recessed toward the substrate. A second interlayer insulating film is disposed on the first interlayer insulating film and includes a second trench that exposes at least a portion of the first lower conductive pattern. An upper conductive pattern fills the second trench and includes an upper barrier film and an upper filling film disposed on the upper barrier film. The upper conductive pattern at least partially fills the first valley area.
    Type: Grant
    Filed: September 19, 2022
    Date of Patent: March 26, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung Yong Yoo, Jong Jin Lee, Rak Hwan Kim, Eun-Ji Jung, Won Hyuk Hong
  • Patent number: 10787724
    Abstract: Disclosed herein are an aluminum alloy for an insert ring, an aluminum insert ring using the same, and a piston manufacturing method using the same, and, particularly, are an insert ring manufactured to have high strength and abrasion resistance and reduce its weight by adjusting aluminum alloy components, and a method of manufacturing a piston having high bonding properties to the insert ring through the same.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: September 29, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Hee-Sam Kang, Eun-Ji Hong
  • Patent number: 10266931
    Abstract: An aluminum alloy is provided that includes magnesium (Mg) of about 8.0 wt % to 10.5 wt %, silicon (Si) of about 1.9 wt % to 3.4 wt %, copper (Cu) of about 0.4 wt % to 2.0 wt %, and a balance of Al. In addition, a vehicle part is manufactured using the same aluminum alloy.
    Type: Grant
    Filed: July 10, 2014
    Date of Patent: April 23, 2019
    Assignee: Hyundai Motor Company
    Inventors: Hee Sam Kang, Eun Ji Hong
  • Publication number: 20180171441
    Abstract: Disclosed herein are an aluminum alloy for an insert ring, an aluminum insert ring using the same, and a piston manufacturing method using the same, and, particularly, are an insert ring manufactured to have high strength and abrasion resistance and reduce its weight by adjusting aluminum alloy components, and a method of manufacturing a piston having high bonding properties to the insert ring through the same.
    Type: Application
    Filed: November 22, 2017
    Publication date: June 21, 2018
    Inventors: Hee-Sam Kang, Eun-Ji Hong
  • Publication number: 20150167136
    Abstract: An aluminum alloy is provided that includes magnesium (Mg) of about 8.0 wt % to 10.5 wt %, silicon (Si) of about 1.9 wt % to 3.4 wt %, copper (Cu) of about 0.4 wt % to 2.0 wt %, and a balance of Al. In addition, a vehicle part is manufactured using the same aluminum alloy.
    Type: Application
    Filed: July 10, 2014
    Publication date: June 18, 2015
    Inventors: Hee Sam Kang, Eun Ji Hong