Patents by Inventor Eun KO

Eun KO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240177250
    Abstract: A computer-implemented method of managing the productivity of fish in a land-based aquafarm through data prediction for each growth period is proposed. The method may include predicting, at a processor, a feed amount input to an aquaculture tank based on aquaculture tank sensing data. The method may also include predicting, at the processor, the growth of fish based on results of the prediction of the input feed amount.
    Type: Application
    Filed: October 26, 2023
    Publication date: May 30, 2024
    Inventors: Sung Yoon CHO, Ki Won KWON, Won Gi JEON, Yang Seob KIM, Juhyoung SUNG, Da Eun JUNG, Young Myoung KO, Jongwon KIM, Eunbi PARK
  • Publication number: 20240174812
    Abstract: Provided is a leveling agent that controls a plating process for forming a circuit pattern. The leveling agent allows the circuit pattern to have a uniform height and square shape even though the circuit pattern has various line widths. Also provided is an electroplating composition including the leveling agent.
    Type: Application
    Filed: June 24, 2022
    Publication date: May 30, 2024
    Inventors: Sung Wook CHUN, Bo Mook CHUNG, Dae Geun KIM, Nak Eun KO, Ju Yong SIM
  • Publication number: 20240164147
    Abstract: A display device includes: a base substrate; a first pixel electrode, a second pixel electrode, and a third pixel electrode arranged on the base substrate to be spaced apart from each other; a pixel defining film on the first pixel electrode, the second pixel electrode, and the third pixel electrode and including a first opening exposing the first pixel electrode, a second opening exposing the second pixel electrode and spaced apart from the first opening, and a third opening exposing the third pixel electrode and spaced apart from the first opening and the second opening; a first organic layer on the first pixel electrode exposed by the first opening; a second organic layer on the second pixel electrode exposed by the second opening; and a third organic layer on the third pixel electrode exposed by the third opening.
    Type: Application
    Filed: January 18, 2024
    Publication date: May 16, 2024
    Inventors: Sang Shin LEE, Joon Young PARK, Min Goo KANG, Jung Woo KO, Jong Sung PARK, Hong Kyun AHN, Sang Min YI, Sang Woo JO, Young Eun RYU, Yoon Seo LEE
  • Publication number: 20240140905
    Abstract: The present invention relates to a leveler capable of efficiently filling the inside of via holes formed during the manufacturing process of a printed circuit board, and an electroplating composition comprising the same. When via holes on a substrate are filled with the electroplating composition according to the present invention, the via holes can be filled in a relatively short time while minimizing the formation of dimples or voids.
    Type: Application
    Filed: June 27, 2023
    Publication date: May 2, 2024
    Inventors: Dea Geun KIM, Sung Wook CHUN, Bo Mook CHUNG, Nak Eun KO
  • Publication number: 20240138075
    Abstract: The present invention relates to a release layer for a metal foil with carrier and a metal foil with carrier including the release layer. The release layer is designed for easy removal of the carrier and includes one or more nitrogenous heterocyclic compounds and one or more inorganic compounds containing at least one metal selected from the group consisting of nickel, molybdenum, cobalt, phosphorus, manganese, and iron.
    Type: Application
    Filed: December 10, 2021
    Publication date: April 25, 2024
    Inventors: Sung Wook CHUN, Bo Mook CHUNG, Dea Geun KIM, Myong Hwan PARK, Nak Eun KO, Ju Young SIM
  • Publication number: 20240133039
    Abstract: The present invention relates to a leveling agent and an electrolytic composition comprising the same. When the via hole in the substrate is filled with the electrolytic composition according to the present invention, the via hole can be filled within a relatively short time while minimizing the formation of dimples or voids.
    Type: Application
    Filed: July 29, 2022
    Publication date: April 25, 2024
    Inventors: Sung Wook CHUN, Bo Mook CHUNG, Dea Geun KIM, Nak Eun KO, Ju Yong SIM
  • Publication number: 20240132441
    Abstract: The present invention relates to a leveling agent and an electrolytic composition comprising the same. When the via hole in the substrate is filled with the electrolytic composition according to the present invention, the via hole can be filled within a relatively short time while minimizing the formation of dimples or voids.
    Type: Application
    Filed: July 29, 2022
    Publication date: April 25, 2024
    Inventors: Sung Wook CHUN, Bo Mook CHUNG, Dea Geun KIM, Nak Eun KO, Ju Yong SIM
  • Patent number: 11949042
    Abstract: Lighting module disclosed in an embodiment of the invention, a substrate; a plurality of light emitting devices disposed on the substrate; a first reflective layer disposed on the substrate; a resin layer disposed on the first reflective layer and the light emitting device; and a second reflective layer disposed on the resin layer, wherein the resin layer is a front side surface on which light generated from the plurality of light emitting devices is emitted, a rear side surface facing the front side surface, and first and second side surfaces connecting the front side surface and the rear side surface with each other.
    Type: Grant
    Filed: April 11, 2023
    Date of Patent: April 2, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Se Eun Kang, Kwang Hyun Ko, Moo Ryong Park
  • Publication number: 20240074284
    Abstract: A display device includes: a display panel including a first region including a transmissive part configured to transmit light provided from the outside and a second region not including the transmissive part; and a sensor overlapping with the transmissive part, and configured to obtain electrical information based on information provided from the outside, wherein the display panel includes: a thin film transistor layer including a plurality of transistors; a pixel defining layer defining an emission region of a plurality of pixels; and a light blocking layer on the pixel defining layer, and defining the transmissive part, and wherein the pixel defining layer in the first region covers at least a portion of the thin film transistor layer such that light provided through the transmissive part is blocked.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Inventors: Sun Ho KIM, Sun Hee LEE, Gun Hee KIM, Dong Hwan SHIM, Yoo Min KO, Chea Eun KIM
  • Publication number: 20240067668
    Abstract: The present invention relates to a heteroaryl derivative compound and a use thereof. Since the heteroaryl derivative of the present invention exhibits excellent inhibitory activity against EGFR, the heteroaryl derivative can be usefully used as a therapeutic agent for EGFR-associated diseases.
    Type: Application
    Filed: December 29, 2021
    Publication date: February 29, 2024
    Inventors: Yi Kyung Ko, Ah Reum Han, Jin Hee Park, Yeong Deok Lee, Hye Rim Im, Kyun Eun Kim, Dong Keun Hwang, Su Been Nam, Myung Hoe Heo, Se Rin Cho, Eun Hwa Ko, Sung Hwan Kim, Hwan Geun Choi
  • Publication number: 20240015885
    Abstract: The present invention relates to a metal foil having a rough surface, a carrier-attached metal foil including the metal foil, and a printed circuit board manufactured using the metal foil. The rough surface is naturally formed during formation of the metal foil. The formation of the rough surface allows the metal foil to have a high adhesive strength to an insulating resin substrate and enables the manufacture of a printed circuit board with improved efficiency.
    Type: Application
    Filed: December 10, 2021
    Publication date: January 11, 2024
    Inventors: Sung Wook CHUN, Bo Mook CHUNG, Dea Geun KIM, Myong Hwan PARK, Nak Eun KO, Ju Yong SIM
  • Patent number: 11475354
    Abstract: Provided is a deep learning method including a step of each of at least two or more deep learning machines learning a web traffic by using a hexadecimal; a step of the deep learning machines learning the web traffic by using an incremental learning using a weight; a step of, when the web traffic is received, each of the deep learning machines encoding a character string of the web traffic with UTF-8 hexadecimal; a step of each of the deep learning machines converting the character string into an image and deep learning the image.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: October 18, 2022
    Assignee: Cloudbric Corp
    Inventors: Seung Young Park, Tai Yun Kim, Tae Joon Jung, Eun A Ko
  • Patent number: 11285993
    Abstract: An apparatus and a method for controlling a vehicle steering system, which are capable of improving a sense of unity between driver's driving input and vehicle motion and the stability of the vehicle by estimating a side slip angle and performing return control, may include an assist torque determination module for determining assist torque for steering assist, a return control module for determining steering return torque for returning the steering wheel to a neutral position, a side slip angle estimation module for estimating a side slip angle, a side slip control module for determining a return control gain value in a response to the estimated side slip angle, a correction unit of correcting the determined steering return torque in a response to the return control gain value, and a torque compensation unit of determining final assist torque by compensating the determined assist torque with the corrected steering return torque.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: March 29, 2022
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Chan Jung Kim, Il Rae Park, Young Eun Ko
  • Patent number: 11257801
    Abstract: A stacked semiconductor package includes a first semiconductor chip having a first active surface over which first bonding pads including peripheral bonding pads and central bonding pads are arranged, a first encapsulation member, two second semiconductor chips having second active surfaces over which second bonding pads are arranged at one side peripheries and disposed to be separated from each other such that the second active surfaces face the first active surface and the second bonding pads overlap with the peripheral bonding pads, first coupling members interposed between the peripheral bonding pads and the second bonding pads, a second encapsulation member formed over second side surfaces of the second semiconductor chips including a region between the second semiconductor chips, and a mold via formed through a portion of the second encapsulation member in the region between the second semiconductor chips and coupled with the central bonding pads.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: February 22, 2022
    Assignee: SK hynix Inc.
    Inventors: Sang-Eun Lee, Hyung-Dong Lee, Eun Ko
  • Patent number: 10857119
    Abstract: The present invention relates to a composition containing a monoacetyldiglyceride compound as an active ingredient, for inhibiting blood cancer or metastasis, and a use thereof. The monoacetyldiglyceride compound according to the present invention has excellent effects of inhibiting the expression of IL-4 and inhibiting the activity of STAT-6, and thereby is capable of overcoming side effects of currently used blood cancer or metastasis inhibiting agents. Also, the monoacetyldiglyceride compound is a non-toxic compound having superior therapeutic effects and thus can be useful as a composition for preventing, treating, or improving blood cancer and metastasis.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: December 8, 2020
    Assignees: Enzychem Lifesciences Corporation, Korea Research Institute of Bio Science and Biotechnology
    Inventors: Jae Wha Kim, Sei-Ryang Oh, Kyung Seop Ahn, Ho Bum Kang, Jae Min Shin, Young Eun Ko, Tae Suk Lee, Myung Hwan Kim, Jong Koo Kang, Yong-Hae Han, Ki-Young Sohn
  • Publication number: 20200330421
    Abstract: The present invention relates to a composition containing a monoacetyldiglyceride compound as an active ingredient, for inhibiting blood cancer or metastasis, and a use thereof. The monoacetyldiglyceride compound according to the present invention has excellent effects of inhibiting the expression of IL-4 and inhibiting the activity of STAT-6, and thereby is capable of overcoming side effects of currently used blood cancer or metastasis inhibiting agents. Also, the monoacetyldiglyceride compound is a non-toxic compound having superior therapeutic effects and thus can be useful as a composition for preventing, treating, or improving blood cancer and metastasis.
    Type: Application
    Filed: May 28, 2020
    Publication date: October 22, 2020
    Applicants: Enzychem Lifesciences Corporation, Korea Research Institute of Bio Science and Biotechnology
    Inventors: Jae Wha Kim, Sei-Ryang Oh, Kyung Seop Ahn, Ho Bum Kang, Jae Min Shin, Young Eun Ko, Tae Suk Lee, Myung Hwan Kim, Jong Koo Kang, Yong-Hae Han, Ki Young Sohn
  • Patent number: 10792371
    Abstract: Provided is a conjugate including a c-Met targeting compound and a bioactive material and methods of use of the conjugate.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: October 6, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Su Young Chae, Sunghyun Kim, Eun Ko, Yun Ju Jeong, Jae Hyun Choi
  • Publication number: 20200164914
    Abstract: An apparatus and a method for controlling a vehicle steering system, which are capable of improving a sense of unity between driver's driving input and vehicle motion and the stability of the vehicle by estimating a side slip angle and performing return control, may include an assist torque determination module for determining assist torque for steering assist, a return control module for determining steering return torque for returning the steering wheel to a neutral position, a side slip angle estimation module for estimating a side slip angle, a side slip control module for determining a return control gain value in a response to the estimated side slip angle, a correction unit of correcting the determined steering return torque in a response to the return control gain value, and a torque compensation unit of determining final assist torque by compensating the determined assist torque with the corrected steering return torque.
    Type: Application
    Filed: July 31, 2019
    Publication date: May 28, 2020
    Applicant: Hyundai Motor Company
    Inventors: Chan Jung KIM, II Rae PARK, Young Eun KO
  • Publication number: 20200019880
    Abstract: Provided is a deep learning method including a step of each of at least two or more deep learning machines learning a web traffic by using a hexadecimal; a step of the deep learning machines learning the web traffic by using an incremental learning using a weight; a step of, when the web traffic is received, each of the deep learning machines encoding a character string of the web traffic with UTF-8 hexadecimal; a step of each of the deep learning machines converting the character string into an image and deep learning the image.
    Type: Application
    Filed: January 8, 2019
    Publication date: January 16, 2020
    Applicant: Cloudbric Corp
    Inventors: Seung Young Park, Tai Yun Kim, Tae Joon Jung, Eun A Ko
  • Publication number: 20190355707
    Abstract: A stacked semiconductor package includes a first semiconductor chip having a first active surface over which first bonding pads including peripheral bonding pads and central bonding pads are arranged, a first encapsulation member, two second semiconductor chips having second active surfaces over which second bonding pads are arranged at one side peripheries and disposed to be separated from each other such that the second active surfaces face the first active surface and the second bonding pads overlap with the peripheral bonding pads, first coupling members interposed between the peripheral bonding pads and the second bonding pads, a second encapsulation member formed over second side surfaces of the second semiconductor chips including a region between the second semiconductor chips, and a mold via formed through a portion of the second encapsulation member in the region between the second semiconductor chips and coupled with the central bonding pads.
    Type: Application
    Filed: August 1, 2019
    Publication date: November 21, 2019
    Applicant: SK hynix Inc.
    Inventors: Sang-Eun LEE, Hyung-Dong LEE, Eun KO