Patents by Inventor Eun-Kyong Choi

Eun-Kyong Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • STACK PACKAGE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
    Publication number: 20120018871
    Abstract: A stack package usable in a three-dimensional (3D) system-in-package (SIP) includes a first semiconductor chip, a second semiconductor chip, and a supporter. The first semiconductor chip includes a through silicon via (TSV), and the second semiconductor chip is stacked on the first semiconductor chip and is electrically connected to the first semiconductor chip through the TSV of the first semiconductor chip. The supporter is attached onto the first semiconductor chip so as to be spaced apart from an edge of the second semiconductor chip.
    Type: Application
    Filed: July 15, 2011
    Publication date: January 26, 2012
    Applicant: Samsung Electronics Co., Ltd
    Inventors: Chung-sun LEE, Jung-Hwan Kim, Yun-Hyeok Im, Ji-Hwan Hwang, Hyon-chol Kim, Kwang-chul Choi, Eun-Kyong Choi, Tae-hong Min