Patents by Inventor Eungyul Lee
Eungyul Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11353268Abstract: A plate type heat exchanger includes a plate package in which a plurality of heat exchange plates is stacked to form a flow path, through which fluid flows, an end plate coupled to an outside of the plate package, and a socket connected to the plate package by passing through the end plate. The end plate includes a base which is in contact with the outside of the plate package, a socket hole which is formed through the base and into which the socket is inserted, and a ridge that protrudes outward from an edge of the socket hole of the base.Type: GrantFiled: July 13, 2020Date of Patent: June 7, 2022Assignee: LG ELECTRONICS INC.Inventors: Jiwon Choi, Eungyul Lee, Hanchoon Lee
-
Patent number: 11041676Abstract: A heat exchanger may include flat tubes formed of a microchannel type, and first and second fins positioned at a top and bottom of the flat tubes so as to conduct the heat of the flat tubes. The first and second fins may be respectively provided with first and second condensate water discharge fins at a top and bottom. The second condensate water discharge fins of the first fins and the first condensate water discharge fins of the second fins may come into contact, and the second condensate water discharge fins of the first fins and the first condensate water discharge fins of the second fins may be disposed in a line with respect to a vertical direction, thereby having an advantage of quickly transferring condensate water formed at the top to the bottom.Type: GrantFiled: July 29, 2016Date of Patent: June 22, 2021Assignee: LG ELECTRONICS INC.Inventors: Eungyul Lee, Seungmo Jung, Juhyok Kim, Taegyun Park
-
Publication number: 20210131749Abstract: A heat exchanger for a refrigerator, which is of a microchannel type, includes a first heat exchange unit including a plurality of flat tubes, which serves to exchange heat between refrigerant and are connected to an introduction pipe, a second heat exchange unit including a plurality of flat tubes, which serve to exchange heat between the refrigerant and air and are disposed outside the first heat exchange unit so as to be connected to a discharge tube, and a connecting pipe connecting the first heat exchange unit to the second heat exchange unit to supply the refrigerant to the second heat exchange unit, wherein the first heat exchange unit is disposed so as to exchange heat with air, and wherein a total cross-sectional area of the flat tubes of the first heat exchange unit is larger than that of the flat tubes of the second heat exchange unit.Type: ApplicationFiled: January 25, 2018Publication date: May 6, 2021Inventors: Taegyun PARK, Juhyok KIM, Eungyul LEE, Jiwon CHOI
-
Publication number: 20210033349Abstract: A plate type heat exchanger according to an embodiment of the present disclosure includes a plate package in which a plurality of heat exchange plates is stacked to form a flow path, through which fluid flows, an end plate coupled to an outside of the plate package, and a socket connected to the plate package by passing through the end plate, in which the end plate includes a base which is in contact with the outside of the plate package, a socket hole which is formed through the base and into which the socket is inserted, and a ridge which protrudes outward from an edge of the socket hole of the base.Type: ApplicationFiled: July 13, 2020Publication date: February 4, 2021Inventors: Jiwon Choi, Eungyul Lee, Hanchoon Lee
-
Publication number: 20210018277Abstract: The present disclosure relates to a plate-type heat exchanger and a method for manufacturing same. A plate-type heat exchanger according to an embodiment of the present disclosure comprises a first plate and a second plate which have flange parts vertically adhered by an adhesive, respectively, wherein the flange parts are formed in a stepped shape and can thus increase the area adhered to the first plate and the second plate.Type: ApplicationFiled: March 27, 2019Publication date: January 21, 2021Inventors: Eungyul LEE, Juhyok KIM, Jiwon CHOI, Sanghoon YOO, Hanchoon LEE
-
Patent number: 10551127Abstract: Provided is a heat exchanger. The heat exchanger includes a plurality of refrigerant tubes in which a refrigerant flows, a heatsink fin coupled to the plurality of refrigerant tubes to heat-exchange the refrigerant with a fluid, a header disposed on at least one side of the plurality of refrigerant tubes to define a flow space of the refrigerant and a guide device disposed in the header to partition the flow space, the guide device guiding the refrigerant from the header to the refrigerant tubes. The guide device includes a movable cover part.Type: GrantFiled: April 19, 2013Date of Patent: February 4, 2020Assignee: LG ELECTRONICS INC.Inventors: Taegyun Park, Sehyeon Kim, Seungmo Jung, Eungyul Lee, Sanghoon Yoo, Naehyun Park
-
Publication number: 20180231319Abstract: The present invention relates to a heat exchanger comprising: flat tubes formed of a microchannel type; and first and second fins positioned at the top and bottom of the flat tubes so as to conduct the heat of the flat tubes, wherein the first and second fins are respectively provided with first and second condensate water discharge pins at the top and bottom, the second condensate water discharge pins of the first fins and the first condensate water discharge pins of the second fins come into contact, and the second condensate water discharge pins of the first fins and the first condensate water discharge pins of the second fins are disposed in a line with respect to the vertical direction, thereby having the advantage of quickly transferring condensate water formed at the top to the bottom.Type: ApplicationFiled: July 29, 2016Publication date: August 16, 2018Inventors: Eungyul LEE, Seungmo JUNG, Juhyok KIM, Taegyun PARK
-
Publication number: 20170030662Abstract: A heat exchanger is provided which is capable of rapidly moving condensed water downward. The heat exchanger may include a plurality of flat tubes forming a plurality of flow paths therein; and a fin located between the plurality of flat tubes to conduct heat.Type: ApplicationFiled: July 29, 2016Publication date: February 2, 2017Inventors: Eungyul LEE, Seungmo JUNG, Juhyok KIM
-
Patent number: 9557121Abstract: Provided is a heat exchanger. The heat exchanger includes a plurality of refrigerant tubes in which a refrigerant flows, a heat dissipation-fin in which the plurality of refrigerant tubes are inserted and through which the refrigerant and a fluid are heat-exchanged with each other, a header coupled to at least one side of the plurality of refrigerant tubes to define a refrigerant flow space, and a guide device disposed within the header to branch the refrigerant into a plurality of passages corresponding to the plurality of refrigerant tubes.Type: GrantFiled: May 1, 2013Date of Patent: January 31, 2017Assignee: LG ELECTRONICS INC.Inventors: Taegyun Park, Sehyeon Kim, Seungmo Jung, Eungyul Lee, Sanghoon Yoo, Naehyun Park
-
Patent number: 9353997Abstract: Provided is a heat exchanger, which includes a plurality of flat tubes in which refrigerant flows, a fin including tube couplers in which the flat tubes are inserted, wherein the refrigerant exchanges heat with a fluid through the fin, and a header coupled to at least one side portion of the flat tubes and distributing the refrigerant to the flat tubes. The fin includes a first fin coupled to a part of the flat tubes, the part of the flat tubes constituting a first row, and a second fin provided on a side portion of the first fin and coupled to another part of the flat tubes, the another part of the flat tubes constituting a second row.Type: GrantFiled: April 26, 2013Date of Patent: May 31, 2016Assignee: LG ELECTRONICS INC.Inventors: Sehyeon Kim, Eungyul Lee
-
Publication number: 20150226498Abstract: A heat exchanger is provided. The heat exchanger includes a refrigerant tube through which a refrigerant flows, the refrigerant tube being arranged in a plurality of rows, a first header on which a refrigerant inflow part is disposed, the first header being coupled to one side of the plurality of refrigerant tubes, a first partition part for partitioning an inner space of the first header, a second header on which a refrigerant discharge part is disposed, the second header being coupled to the other side of the plurality of refrigerant tubes, a second partition part for partitioning an inner space of the second header, and a baffle coupled to the first or second partition part, the baffle guiding a flow of the refrigerant from the header to the plurality of refrigerant tubes. The refrigerant discharge part of the second header is disposed lower than the refrigerant inflow part of the first header.Type: ApplicationFiled: January 21, 2015Publication date: August 13, 2015Inventors: Taegyun Park, Sanghoon Yoo, Eungyul Lee
-
Patent number: 9033029Abstract: A heat exchanger is provided. The heat exchanger may include a plurality of refrigerant tubes extending in a horizontal direction, at least one fin coupled to the plurality of refrigerant tubes, a vertically oriented header coupled to corresponding ends of the plurality of refrigerant tubes, the header distributing refrigerant into the plurality of refrigerant tubes, and a partition device that partitions an inner space of the header, the partition device including at least two through holes that guide refrigerant into the plurality of refrigerant tubes.Type: GrantFiled: January 26, 2012Date of Patent: May 19, 2015Assignee: LG ELECTRONICS INC.Inventors: Taegyun Park, Sehyeon Kim, Seungmo Jung, Eungyul Lee, Sanghoon Yoo, Naehyun Park
-
Publication number: 20150114030Abstract: Provided is a heat exchanger. The heat exchanger includes a plurality of refrigerant tubes in which a refrigerant flows, a heatsink fin coupled to the plurality of refrigerant tubes to heat-exchange the refrigerant with a fluid, a header disposed on at least one side of the plurality of refrigerant tubes to define a flow space of the refrigerant and a guide device disposed in the header to partition the flow space, the guide device guiding the refrigerant from the header to the refrigerant tubes. The guide device includes a movable cover part.Type: ApplicationFiled: April 19, 2013Publication date: April 30, 2015Applicant: LG ELECTRONICS INC.Inventors: Taegyun Park, Sehyeon Kim, Seungmo Jung, Eungyul Lee, Sanghoon Yoo, Naehyun Park
-
Patent number: 8671706Abstract: A heat pump according to the present invention comprises a plurality of the compression chambers, and compresses refrigerant with multistage, and injects vapor refrigerant into the space between the plurality of the compression chambers by using the first refrigerant injection flow path and the second refrigerant injection flow path. Performance and efficiency of the heat pump can be improved compared with non-injection, as flow rate of the refrigerant circulating the indoor heat exchanger is increased. Thus heating performance can be improved also in the extremely cold environmental condition such as the cold area by increasing the injection flow rate. Also, because the heat pump according to the present invention comprises the first refrigerant injection flow path and the second refrigerant injection flow path, refrigerant is injected twice. Thus, as the injection flow rate of the refrigerant is increased, heating capacity can be improved.Type: GrantFiled: July 29, 2010Date of Patent: March 18, 2014Assignee: LG Electronics Inc.Inventors: Simwon Chin, Eungyul Lee, Younghwan Ko, Sangkyoung Park
-
Publication number: 20130292104Abstract: Provided is a heat exchanger. The heat exchanger includes a plurality of refrigerant tubes in which a refrigerant flows, a heat dissipation-fin in which the plurality of refrigerant tubes are inserted and through which the refrigerant and a fluid are heat-exchanged with each other, a header coupled to at least one side of the plurality of refrigerant tubes to define a refrigerant flow space, and a guide device disposed within the header to branch the refrigerant into a plurality of passages corresponding to the plurality of refrigerant tubes.Type: ApplicationFiled: May 1, 2013Publication date: November 7, 2013Applicant: LG Electronics Inc.Inventors: Taegyun Park, Sehyeon Kim, Seungmo Jung, Eungyul Lee, Sanghoon Yoo, Naehyun Park
-
Publication number: 20130284414Abstract: Provided is a heat exchanger, which includes a plurality of flat tubes in which refrigerant flows, a fin including tube couplers in which the flat tubes are inserted, wherein the refrigerant exchanges heat with a fluid through the fin, and a header coupled to at least one side portion of the flat tubes and distributing the refrigerant to the flat tubes. The fin includes a first fin coupled to a part of the flat tubes, the part of the flat tubes constituting a first row, and a second fin provided on a side portion of the first fin and coupled to another part of the flat tubes, the another part of the flat tubes constituting a second row.Type: ApplicationFiled: April 26, 2013Publication date: October 31, 2013Applicant: LG Electronics Inc.Inventors: Sehyeon Kim, Eungyul Lee
-
Publication number: 20130126140Abstract: A heat exchanger is provided. The heat exchanger may include a plurality of refrigerant tubes extending in a horizontal direction, at least one fin coupled to the plurality of refrigerant tubes, a vertically oriented header coupled to corresponding ends of the plurality of refrigerant tubes, the header distributing refrigerant into the plurality of refrigerant tubes, and a partition device that partitions an inner space of the header, the partition device including at least two through holes that guide refrigerant into the plurality of refrigerant tubes.Type: ApplicationFiled: January 26, 2012Publication date: May 23, 2013Inventors: Taegyun PARK, Sehyeon Kim, Seungmo Jung, Eungyul Lee, Sanghoon Yoo, Naehyun Park
-
Publication number: 20110113804Abstract: A heat pump according to the present invention comprises a plurality of the compression chambers, and compresses refrigerant with multistage, and injects vapor refrigerant into the space between the plurality of the compression chambers by using the first refrigerant injection flow path and the second refrigerant injection flow path. Performance and efficiency of the heat pump can be improved compared with non-injection, as flow rate of the refrigerant circulating the indoor heat exchanger is increased. Thus heating performance can be improved also in the extremely cold environmental condition such as the cold area by increasing the injection flow rate. Also, because the heat pump according to the present invention comprises the first refrigerant injection flow path and the second refrigerant injection flow path, refrigerant is injected twice. Thus, as the injection flow rate of the refrigerant is increased, heating capacity can be improved.Type: ApplicationFiled: July 29, 2010Publication date: May 19, 2011Inventors: Simwon Chin, Eungyul Lee, Younghwan Ko, Sangkyoung Park