Patents by Inventor Eunsuk Ko

Eunsuk Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230378839
    Abstract: A washing machine including a tub, a stator fastenable to a rear of the tub, and a rotor to electromagnetically interact with the stator and rotate around a rotating shaft, where the stator includes a stator core, an insulator configured to surround the stator core, and a bracket fastenable to the insulator, and fastenable to the rear of the tub such that while the stator is to the tub the stator is fastened to the rear of the tub through the bracket while the bracket is fastened to the insulator and the rear of the tub.
    Type: Application
    Filed: August 2, 2023
    Publication date: November 23, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eunsuk KO, Unyong LEE, Jinwoo CHO, Jungin MIN, Jongjin LEE
  • Publication number: 20230369076
    Abstract: Several designs of a gas distribution device for a substrate processing system are provided. The gas distribution device includes a dual plenum showerhead. Additionally, designs for a light blocking structure used with the showerheads are also provided.
    Type: Application
    Filed: July 3, 2023
    Publication date: November 16, 2023
    Inventors: Dengliang YANG, Haoquan FANG, David CHEUNG, Gnanamani AMBUROSE, Eunsuk KO, Weiyi LUO, Dan ZHANG
  • Patent number: 11694911
    Abstract: A substrate processing system for selectively etching a substrate includes a first chamber and a second chamber. A first gas delivery system supplies an inert gas species to the first chamber. A plasma generating system generates plasma including ions and metastable species in the first chamber. A gas distribution device removes the ions from the plasma, blocks ultraviolet (UV) light generated by the plasma and delivers the metastable species to the second chamber. A substrate support is arranged below the gas distribution device to support the substrate. A second gas delivery system delivers a reactive gas species to one of the gas distribution device or a volume located below the gas distribution device. The metastable species transfer energy to the reactive gas species to selectively etch one exposed material of the substrate more than at least one other exposed material of the substrate.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: July 4, 2023
    Assignee: LAM RESEARCH CORPORATION
    Inventors: Dengliang Yang, Haoquan Fang, David Cheung, Gnanamani Amburose, Eunsuk Ko, Weiyi Luo, Dan Zhang
  • Publication number: 20180174870
    Abstract: A substrate processing system for selectively etching a substrate includes a first chamber and a second chamber. A first gas delivery system supplies an inert gas species to the first chamber. A plasma generating system generates plasma including ions and metastable species in the first chamber. A gas distribution device removes the ions from the plasma, blocks ultraviolet (UV) light generated by the plasma and delivers the metastable species to the second chamber. A substrate support is arranged below the gas distribution device to support the substrate. A second gas delivery system delivers a reactive gas species to one of the gas distribution device or a volume located below the gas distribution device. The metastable species transfer energy to the reactive gas species to selectively etch one exposed material of the substrate more than at least one other exposed material of the substrate.
    Type: Application
    Filed: December 18, 2017
    Publication date: June 21, 2018
    Inventors: Dengliang Yang, Haoquan Fang, David Cheung, Gnanamani Amburose, Eunsuk Ko, Weiyi Luo, Dan Zhang