Patents by Inventor Euy-sik Shin

Euy-sik Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High performance multilayer insulation composite for high voltage applications
    Patent number: 10546666
    Abstract: A thin micro-multilayer electrical insulator having a plurality of layers of polymeric materials is high performance and lightweight. The insulator provides a structured material with improved dielectric strength and partial corona discharge resistance that can be used in high voltage and high temperature applications. The durable insulator is well suited for use in insulating high voltage aircraft wiring and power transmission composites in hybrid and all electric airplanes. The insulator can have multiple layers of different polymeric materials such as fluorine-containing polymers and polyimides.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: January 28, 2020
    Assignees: OHIO AEROSPACE INSTITUTE, U.S. GOVERNMENT AS REPRESENTED BY THE ADMINISTRATOR OF THE NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
    Inventor: Euy-sik Shin
  • HIGH PERFORMANCE MULTILAYER INSULATION COMPOSITE FOR HIGH VOLTAGE APPLICATIONS
    Publication number: 20190326034
    Abstract: A thin micro-multilayer electrical insulator having a plurality of layers of polymeric materials is high performance and lightweight. The insulator provides a structured material with improved dielectric strength and partial corona discharge resistance that can be used in high voltage and high temperature applications. The durable insulator is well suited for use in insulating high voltage aircraft wiring and power transmission composites in hybrid and all electric airplanes. The insulator can have multiple layers of different polymeric materials such as fluorine-containing polymers and polyimides.
    Type: Application
    Filed: April 11, 2019
    Publication date: October 24, 2019
    Inventor: Euy-sik Shin