Patents by Inventor Eva Leong Ching Wai

Eva Leong Ching Wai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemical sensor package for highly pressured environment
    Patent number: 9841399
    Abstract: A package for a chemical sensor including an encapsulation and a pressure balancing structure is disclosed. The encapsulation encapsulates a chemical sensor and has a hole for exposing a chemical sensitive part of the chemical sensor. The pressure balancing structure balances pressure applied to the chemical sensor at the chemical sensitive part.
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: December 12, 2017
    Assignee: Agency for Science, Technology and Research
    Inventors: Daniel Rhee Min Woo, How Yuan Hwang, Vivek Chidambaram, Yuen Sing Chan, Eva Leong Ching Wai, Jong Bum Lee
  • CHEMICAL SENSOR PACKAGE FOR HIGHLY PRESSURED ENVIRONMENT
    Publication number: 20170003247
    Abstract: A package for a chemical sensor including an encapsulation and a pressure balancing structure is disclosed. The encapsulation encapsulates a chemical sensor and has a hole for exposing a chemical sensitive part of the chemical sensor. The pressure balancing structure balances pressure applied to the chemical sensor at the chemical sensitive part.
    Type: Application
    Filed: July 26, 2016
    Publication date: January 5, 2017
    Inventors: Daniel Rhee Min Woo, How Yuan Hwang, Vivek Chidambaram, Yuen Sing Chan, Eva Leong Ching Wai, Jong Bum Lee
  • Chemical sensor package for highly pressured environment
    Patent number: 9431315
    Abstract: A package for a chemical sensor including an encapsulation and a pressure balancing structure is disclosed. The encapsulation encapsulates a chemical sensor and has a hole for exposing a chemical sensitive part of the chemical sensor. The pressure balancing structure balances pressure applied to the chemical sensor at the chemical sensitive part.
    Type: Grant
    Filed: December 26, 2014
    Date of Patent: August 30, 2016
    Assignee: Agency for Science, Technology and Research
    Inventors: Daniel Rhee Min Woo, How Yuan Hwang, Vivek Chidambaram, Yuen Sing Chan, Eva Leong Ching Wai, Jong Bum Lee
  • CHEMICAL SENSOR PACKAGE FOR HIGHLY PRESSURED ENVIRONMENT
    Publication number: 20150206816
    Abstract: A package for a chemical sensor including an encapsulation and a pressure balancing structure is disclosed. The encapsulation encapsulates a chemical sensor and has a hole for exposing a chemical sensitive part of the chemical sensor. The pressure balancing structure balances pressure applied to the chemical sensor at the chemical sensitive part.
    Type: Application
    Filed: December 26, 2014
    Publication date: July 23, 2015
    Inventors: Daniel Rhee Min Woo, How Yuan Hwang, Vivek Chidambaram, Yuen Sing Chan, Eva Leong Ching Wai, Jong Bum Lee