Patents by Inventor Evan C. Wickes
Evan C. Wickes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8382522Abstract: A substrate is disclosed that is configured to receive an electrical component. The substrate comprises a plurality of first vias and a plurality of second vias. The plurality of first vias is arranges in the substrate in a matrix of rows and columns and is configured to provide mounting of the electric component, each first via associated with one of its closest neighbor first via to form a pair. The plurality of second vias is capable of being electrically commoned to one another and is positioned amongst the plurality of first vias such that there is at least one second via positioned directly between each first via and any of the closest non-pair first via neighbors.Type: GrantFiled: July 27, 2011Date of Patent: February 26, 2013Assignee: Tyco Electronics CorporationInventors: Douglas W. Glover, David W. Helster, Timothy R. Minnick, Chad W. Morgan, Evan C. Wickes
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Patent number: 8167651Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.Type: GrantFiled: May 29, 2009Date of Patent: May 1, 2012Assignee: Tyco Electronics CorporationInventors: Douglas W. Glover, David W. Helster, Timothy R. Minnick, Chad W. Morgan, Evan C. Wickes
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Publication number: 20110278057Abstract: A substrate is disclosed that is configured to receive an electrical component. The substrate comprises a plurality of first vias and a plurality of second vias. The plurality of first vias is arranges in the substrate in a matrix of rows and columns and is configured to provide mounting of the electric component, each first via associated with one of its closest neighbor first via to form a pair. The plurality of second vias is capable of being electrically commoned to one another and is positioned amongst the plurality of first vias such that there is at least one second via positioned directly between each first via and any of the closest non-pair first via neighbors.Type: ApplicationFiled: July 27, 2011Publication date: November 17, 2011Inventors: Douglas W. Glover, David W. Helster, Timothy R. Minnick, Chad W. Morgan, Evan C. Wickes
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Patent number: 8016616Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.Type: GrantFiled: May 29, 2009Date of Patent: September 13, 2011Assignee: Tyco Electronics CorporationInventors: Douglas W. Glover, David W. Helster, Timothy R. Minnick, Chad W. Morgan, Evan C. Wickes
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Patent number: 7871296Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.Type: GrantFiled: May 29, 2009Date of Patent: January 18, 2011Assignee: Tyco Electronics CorporationInventors: David K. Fowler, Evan C. Wickes, Donald E. Wood
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Patent number: 7811129Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.Type: GrantFiled: May 29, 2009Date of Patent: October 12, 2010Assignee: Tyco Electronics CorporationInventors: Douglas W. Glover, Evan C. Wickes
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Patent number: 7775802Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.Type: GrantFiled: May 29, 2009Date of Patent: August 17, 2010Assignee: Tyco Electronics CorporationInventors: George R. Defibaugh, James L. Fedder, Douglas W. Glover, David W. Helster, John E. Knaub, Timothy R. Minnick, Chad W. Morgan, Alex M. Sharf, Lynn R. Sipe, Evan C. Wickes
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Publication number: 20100144169Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.Type: ApplicationFiled: May 29, 2009Publication date: June 10, 2010Inventors: Douglas W. Glover, David W. Helster, Timothy R. Minnick, Chad W. Morgan, Evan C. Wickes
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Publication number: 20100144201Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.Type: ApplicationFiled: May 29, 2009Publication date: June 10, 2010Inventors: George R. Defibaugh, James L. Fedder, Douglas W. Glover, David W. Helster, John E. Knaub, Timothy R. Minnick, Chad W. Morgan, Alex M. Sharf, Lynn R. Sipe, Evan C. Wickes
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Publication number: 20100144203Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.Type: ApplicationFiled: May 29, 2009Publication date: June 10, 2010Inventors: Douglas W. Glover, Evan C. Wickes
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Publication number: 20100144168Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.Type: ApplicationFiled: May 29, 2009Publication date: June 10, 2010Inventors: Douglas W. Glover, David W. Helster, Timothy R. Minnick, Chad W. Morgan, Evan C. Wickes
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Publication number: 20100144165Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.Type: ApplicationFiled: May 29, 2009Publication date: June 10, 2010Inventors: David K. Fowler, Evan C. Wickes, Donald E. Wood