Abstract: The present invention relates generally to apparatus and methods for cooling semiconductor integrated circuit (IC) chip package structures. More specifically, the present invention relates to apparatus and methods for thermally coupling semiconductor chips to a heat conducting device (e.g., copper thermal hat or lid) using a compliant thermally conductive material (e.g., thermal paste), wherein a thermal interface is designed to prevent/inhibit the formation of voids in the compliant thermally conductive material due to the flow of such material in and out from between the chips and the heat conducting device due to thermal cycling.

Abstract: Apparatus and methods are provided for thermally coupling a semiconductor chip directly to a heat conducting device (e.g., a copper heat sink) using a thermal joint that provides increased thermal conductivity between the heat conducting device and high power density regions of the semiconductor chip, while minimizing or eliminating mechanical stress due to the relative displacement due to the difference in thermal expansion between the semiconductor chip and the heat conducting device.

Abstract: Apparatus and methods are provided for constructing electronic package structures using LGA (land grid array) module-to-board connectors that are designed to provide higher count I/O interconnections by expanding LGA area, but without having to increase chip module footprint or reduce the pitch of area array I/O contacts of an LGA interposer or circuit board beyond practical limits.

Abstract: Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density electronic devices. Apparatus for microchannel cooling include integrated microchannel heat sink devices and fluid distribution manifold structures that are designed to provide uniform flow and distribution of coolant fluid and minimize pressure drops along coolant flow paths.

Abstract: Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density electronic devices having a non-uniform power density distribution, which are mounted face down on a package substrate. For example, integrated microchannel cooler devices (or microchannel heat sink devices) for cooling IC chips are designed to provide uniform flow and distribution of coolant fluid and minimize pressure drops along coolant flow paths, as well as provide variable localized cooling capabilities for high power density regions (or “hot spots”) of IC chips with higher than average power densities.

Abstract: Optical devices, components and methods for mounting optical fibers and for side-coupling light to/from optical fibers using a modified silicon V-groove, or silicon V-groove array, wherein V-grooves, which are designed for precisely aligning/spacing optical fibers, are “recessed” below the surface of the silicon. Optical fibers can be recessed below the surface of the silicon substrate such that a precisely controlled portion of the cladding layer extending above the silicon surface can be removed (lapped). With the cladding layer removed, the separation between the fiber core(s) and optoelectronic device(s) can be reduced resulting in improved optical coupling when the optical fiber silicon array is connected to, e.g., a VCSEL array.

Abstract: An electroplating apparatus, in accordance with the present invention, includes a plurality of chambers. A first chamber includes an anode therein. The first chamber has an opening for delivering an electrolytic solution containing metal ions onto a surface to be electroplated. The surface to be electroplated is preferably a cathode. A second chamber is formed adjacent to the first chamber and has a second opening in proximity of the first opening for removing electrolytic solution containing metal ions from the surface to be electroplated. The plurality of chambers are adapted for movement in a first direction along the surface to be electroplated.

Abstract: Optical devices, components and methods for mounting optical fibers and for side-coupling light to/from optical fibers using a modified silicon V-groove, or silicon V-groove array, wherein V-grooves, which are designed for precisely aligning/spacing optical fibers, are “recessed” below the surface of the silicon. Optical fibers can be recessed below the surface of the silicon substrate such that a precisely controlled portion of the cladding layer extending above the silicon surface can be removed (lapped). With the cladding layer removed, the separation between the fiber core(s) and optoelectronic device(s) can be reduced resulting in improved optical coupling when the optical fiber silicon array is connected to, e.g., a VCSEL array.

Abstract: A method wherein optical fibers in a silicon connector are joined to a second optical component. The silicon connector is etched back with a dry etchant that is highly preferential for silicon to thereby etch the silicon connector much more than the optical fiber. After etching, the optical fibers protrude beyond the silicon connector so that they may be easily joined to the second optical component. Also disclosed is an optical fiber assembly made according to this method.

Abstract: A display device and method for fabricating a liquid crystal cell are disclosed. A liquid crystal cell includes a first substrate, and a second substrate attached to the first substrate. The first substrate has a same thickness as the second substrate. The first substrate is lapped at a first rate while concurrently lapping the second substrate at a second rate, which is different from the first rate. The first substrate and the second substrate are thinned to different thicknesses. The thinner of the first and second substrates is provided on a viewer side of a collimate and post diffuse type liquid crystal cell to reduce depixelization.

Abstract: In a liquid crystal display device of a direct view type, a lenticular lens sheet is provided in the backside of a liquid crystal display panel. Light emitted to a lens of the lenticular lens sheet is first converged in the liquid crystal display panel, and then diffused. When the light is emitted from the liquid crystal display panel, the radiation distribution thereof is widened. Thus, a bright display screen even when seen from a wide angle can be realized.

Abstract: Incident light from the space between the light-reflecting films in a liquid crystal light valve of a liquid crystal display device, especially in a reflection-type liquid crystal light valve of a projection-type liquid crystal display device is effectively blocked. The liquid crystal light valve having a semiconductor substrate, a counter substrate, light-reflecting films, and liquid crystal comprises a light-blocking layer and light shields formed between the light-blocking layer and the light-reflecting films.

Abstract: In an integrated circuit structure, such as in an MCM or in an SCM, a particulate thermally conductive conformable material, such as a thermal paste, is applied between a heat-generating chip and a cooling plate. Modification of the microstructure of at least one of the two nominally parallel surfaces which are in contact with the material is provided in a discrete pattern of sloped recesses. The largest particles in the material preferentially migrate downward into the recesses. The average thickness of the conductive paste is reduced to below the diameter of the largest particles dispersed in the material, providing improved cooling.

Abstract: In an integrated circuit structure, such as in an MCM or in an SCM, a particulate thermally conductive conformable material, such as a thermal paste, is applied between a heat-generating chip and a cooling plate. Modification of the microstructure of at least one of the two nominally parallel surfaces which are in contact with the material is provided in a discrete pattern of sloped recesses. The largest particles in the material preferentially migrate downward into the recesses. The average thickness of the conductive paste is reduced to below the diameter of the largest particles dispersed in the material, providing improved cooling.

Abstract: Optical devices, components and methods for mounting optical fibers and for side-coupling light to/from optical fibers using a modified silicon V-groove, or silicon V-groove array, wherein V-grooves, which are designed for precisely aligning/spacing optical fibers, are “recessed” below the surface of the silicon. Optical fibers can be recessed below the surface of the silicon substrate such that a precisely controlled portion of the cladding layer extending above the silicon surface can be removed (lapped). With the cladding layer removed, the separation between the fiber core(s) and optoelectronic device(s) can be reduced resulting in improved optical coupling when the optical fiber silicon array is connected to, e.g., a VCSEL array.

Abstract: A method wherein optical fibers in a silicon connector are joined to a second optical component. The silicon connector is etched back with a dry etchant that is highly preferential for silicon to thereby etch the silicon connector much more than the optical fiber. After etching, the optical fibers protrude beyond the silicon connector so that they may be easily joined to the second optical component. Also disclosed is an optical fiber assembly made according to this method.

Abstract: In a liquid crystal display device of a direct view type, a lenticular lens sheet is provided in the backside of a liquid crystal display panel. Light emitted to a lens of the lenticular lens sheet is first converged in the liquid crystal display panel, and then diffused. When the light is emitted from the liquid crystal display panel, the radiation distribution thereof is widened. Thus, a bright display screen even when seen from a wide angle can be realized.

Abstract: A method for forming ohmic contacts for semiconductor devices, in accordance with the present invention, includes forming a layer containing metal which includes dopants integrally formed therein. The layer containing metal is patterned to form components for a semiconductor device, and a semiconductor layer is deposited for contacting the layer containing metal. The semiconductor device is annealed to outdiffuse dopants from the layer containing metal into the semiconductor layer to form ohmic contacts therebetween.

Abstract: The invention is embodied in a wireless stylus that incorporates, for example, an infrared emitter for communicating with a receiver associated with a computer. The stylus is provided with push-buttons near its tip that can be actuated by the user during the course of pointing the stylus at a touch screen location. Accordingly, by the combined actuation of the touch screen and a concurrent actuation of one or more of the push buttons, a mouse input to the computer is accomplished.

Abstract: An electroplating apparatus, in accordance with the present invention, includes a plurality of chambers. A first chamber includes an anode therein. The first chamber has an opening for delivering an electrolytic solution containing metal ions onto a surface to be electroplated. The surface to be electroplated is preferably a cathode. A second chamber is formed adjacent to the first chamber and has a second opening in proximity of the first opening for removing electrolytic solution containing metal ions from the surface to be electroplated. The plurality of chambers are adapted for movement in a first direction along the surface to be electroplated.