Patents by Inventor Evan R. Boyle

Evan R. Boyle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for high-speed, low-profile memory packages and pinout designs
    Patent number: 9853016
    Abstract: Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.
    Type: Grant
    Filed: February 17, 2017
    Date of Patent: December 26, 2017
    Assignee: APPLE INC.
    Inventors: Anthony Fai, Evan R. Boyle, Zhiping Yang, Zhonghua Wu
  • SYSTEMS AND METHODS FOR HIGH-SPEED, LOW-PROFILE MEMORY PACKAGES AND PINOUT DESIGNS
    Publication number: 20170162546
    Abstract: Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.
    Type: Application
    Filed: February 17, 2017
    Publication date: June 8, 2017
    Inventors: Anthony Fai, Evan R. Boyle, Zhiping Yang, Zhonghua Wu
  • Systems and methods for high-speed, low-profile memory packages and pinout designs
    Patent number: 9583452
    Abstract: Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: February 28, 2017
    Assignee: APPLE INC.
    Inventors: Anthony Fai, Evan R. Boyle, Zhiping Yang, Zhonghua Wu
  • Solid state drive with self-refresh power saving mode
    Patent number: 9568971
    Abstract: A storage device includes a non-volatile memory, a volatile memory and a controller. The volatile memory supports a normal mode and a self-refresh mode. The controller is configured to store data for a host in the non-volatile memory while using the volatile memory in the normal mode and, in response to receiving a power-down command from the host, to deactivate at least part of the storage device and to switch the volatile memory from the normal mode to the self-refresh mode.
    Type: Grant
    Filed: February 5, 2015
    Date of Patent: February 14, 2017
    Assignee: APPLE INC.
    Inventors: Avraham Poza Meir, Evan R. Boyle, Christopher J. Sarcone, Barak Rotbard
  • SYSTEMS AND METHODS FOR HIGH-SPEED, LOW-PROFILE MEMORY PACKAGES AND PINOUT DESIGNS
    Publication number: 20170005056
    Abstract: Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.
    Type: Application
    Filed: September 15, 2016
    Publication date: January 5, 2017
    Inventors: Anthony Fai, Evan R. Boyle, Zhiping Yang, Zhonghua Wu
  • Systems and methods for high-speed, low-profile memory packages and pinout designs
    Patent number: 9466571
    Abstract: Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.
    Type: Grant
    Filed: July 17, 2015
    Date of Patent: October 11, 2016
    Assignee: APPLE INC.
    Inventors: Anthony Fai, Evan R. Boyle, Zhiping Yang, Zhonghua Wu
  • SOLID STATE DRIVE WITH SELF-REFRESH POWER SAVING MODE
    Publication number: 20160231797
    Abstract: A storage device includes a non-volatile memory, a volatile memory and a controller. The volatile memory supports a normal mode and a self-refresh mode. The controller is configured to store data for a host in the non-volatile memory while using the volatile memory in the normal mode and, in response to receiving a power-down command from the host, to deactivate at least part of the storage device and to switch the volatile memory from the normal mode to the self-refresh mode.
    Type: Application
    Filed: February 5, 2015
    Publication date: August 11, 2016
    Inventors: Avraham Poza Meir, Evan R. Boyle, Christopher J. Sarcone, Barak Rotbard
  • SYSTEMS AND METHODS FOR HIGH-SPEED, LOW-PROFILE MEMORY PACKAGES AND PINOUT DESIGNS
    Publication number: 20150325560
    Abstract: Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.
    Type: Application
    Filed: July 17, 2015
    Publication date: November 12, 2015
    Inventors: Anthony Fai, Evan R. Boyle, Zhiping Yang, Zhonghua Wu
  • Systems and methods for high-speed, low-profile memory packages and pinout designs
    Patent number: 9087846
    Abstract: Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: July 21, 2015
    Assignee: APPLE INC.
    Inventors: Anthony Fai, Evan R. Boyle, Zhiping Yang, Zhonghua Wu
  • UNIFIED PCB DESIGN FOR SSD APPLICATIONS, VARIOUS DENSITY CONFIGURATIONS, AND DIRECT NAND ACCESS
    Publication number: 20140264904
    Abstract: Memory systems and methods for creating the same are disclosed. The memory systems can include pairs of IC packages mounted on either side of a system substrate. Contacts formed on the IC packages can be communicatively coupled with contacts of a paired IC package using vias that extend through the system substrate. The IC packages can further communicate with a controller mounted on one side of the system substrate using the vias as well as conductive traces formed in the system substrate.
    Type: Application
    Filed: March 13, 2013
    Publication date: September 18, 2014
    Inventors: Anthony Fai, Evan R. Boyle, Zhiping Yang, Zhonghua Wu
  • SYSTEMS AND METHODS FOR HIGH-SPEED, LOW-PROFILE MEMORY PACKAGES AND PINOUT DESIGNS
    Publication number: 20140264906
    Abstract: Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.
    Type: Application
    Filed: March 13, 2013
    Publication date: September 18, 2014
    Applicant: APPLE INC.
    Inventors: Anthony Fai, Evan R. Boyle, Zhiping Yang, Zhonghua Wu