Abstract: Carrier, container or other system that provides a separation and protection for substrates, wafers, etc. for before, during or after processing or storage through the use of a membrane integral to the carrier or container respectively. This includes for use with Tec-Cell systems with high and low density configurations as well as other standardized systems, such as FOUPs. Includes protection for contamination brakeage chafing, through isolation and containment. Additional features are included such as the membrane providing guides or otherwise increasing efficiency or presence of airflow, such as laminar airflow over each substrate, wafer, etc. being held.

Abstract: Methods, systems and apparatuses for an improved wafer and substrate carrier or container with improved modularity. More specifically, to a carrier or container with improved abilities which may provide high or low density carriers or containers with improved interchanging and compatibility, including for Tec-Cells, FOUPs, and other third party containers, carriers, modules, rings or any other systems, structures, apparatuses, or methods associated. The invention may provided an ability to interchange or be cross-compatible such as wherein Tec-Cell carriers, containers, rings or modules may be provided to be housed in a FOUP or other third party carrier or wherein substrates or wafers held in the Tec-Cell Carriers, rings, containers, or modules, and then held within the FOUP.

Abstract: Sputtering is performed by making use of a stationary magnetic field (Hs). Uneroded areas of the sputtering surface (3) which are subject to re-deposition are minimized or omitted by modulating the stationary magnetic field (Hs) adjacent to one of the magnetic poles responsible for the stationary magnetic field, by superimposing a modulating magnetic field (Hm) to said stationary field (Hs).