Patents by Inventor Fadia Nounou

Fadia Nounou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040253401
    Abstract: A compound curved shaped housing part (104) includes integrated activatable electrochromic indicia (114, 116, 118, 120). The indicia are formed by coating an internal surface (302) of a transparent plastic shell (402) with a sequence of layers including: optionally a separate transparent conductor (408), an electrochromic material layer (410), an electrolyte layer (412), optionally a separate ion donor layer (414), optionally an insulator layer 418 and a second conductive layer. Laser etching is used to provide access to the transparent conductor layer. The insulator layer is patterned to provide access for electrodes to underlying layers. Laser etching is used to pattern the second conductive layer to define interconnected electrodes (322-332), traces (314-318), and electrical contacts (304-312).
    Type: Application
    Filed: June 12, 2003
    Publication date: December 16, 2004
    Inventors: Steven Duane Pratt, Robert W. Pennisi, Fadia Nounou, Ronald James Kelley, Sivakumar Muthuswamy
  • Publication number: 20030210780
    Abstract: A device housing (20) for a portable electronic device (10) includes an outer visible surface (30). At least one portion (35) of the outer visible surface (30) is composed of one or more optical fibers (40). The one or more optical fibers (40) are illuminated using a light source coupled to at least one end of the one or more optical fibers (40) to provide decorative characteristics and operational functions.
    Type: Application
    Filed: May 10, 2002
    Publication date: November 13, 2003
    Inventors: Steven Duane Pratt, Robert W. Pennisi, Fadia Nounou, Ronald James Kelley, Sivakumar Muthuswamy
  • Patent number: 5542171
    Abstract: A method of making a transfer molded chip carrier. A semiconductor device (10) is first electrically and mechanically attached to a substrate (12). The substrate (12) is then treated by sputter etching so that it will provide good adhesion between the substrate and a molding compound (18) that is subsequently molded to the substrate (25). Portions of the treated substrate are then selectively contaminated in order to reduce the adhesion between these selected portions of the substrate and the molding compound. The molding compound is then formed around the semiconductor device so as to encapsulate it and also part of the surface of the substrate. Portions (20) of the transfer molded material that were molded over the selectively contaminated portions of the substrate (12) are then removed by breaking away.
    Type: Grant
    Filed: October 4, 1991
    Date of Patent: August 6, 1996
    Assignee: Motorola, Inc.
    Inventors: Frank J. Juskey, Anthony B. Suppelsa, Fadia Nounou
  • Patent number: 5421083
    Abstract: A method of manufacturing a circuit carrying substrate having one or more coaxial via holes. The center core or inner layer (330) of the circuit carrying substrate is a dielectric material that has a plated (339) through hole or via (335) coupling the two surfaces of the inner layer together. One side of the inner layer has a first metallization pattern (336) and the other side has a second metallization pattern (338) on it. The through hole is electrically conductive (339) and connects portions of the first and second metallization patterns. The plated through hole is filled with a dielectric material (340). A first dielectric layer (342) is formed on one side of the inner layer, and a second dielectric layer (344) is formed on the other side of the inner layer, so that the dielectric layers cover the first and second metallization patterns and the filled via hole.
    Type: Grant
    Filed: April 1, 1994
    Date of Patent: June 6, 1995
    Assignee: Motorola, Inc.
    Inventors: Anthony B. Suppelsa, Anthony J. Suppelsa, Fadia Nounou
  • Patent number: 5373276
    Abstract: A self centering coil (200) includes a coil section (202) and also having curved end section (206) and (204) at opposite sides of the coil section (202). The curved end sections are preferably substantially flat and in a plane which is parallel to the center axis (306) of the coiled section (202).
    Type: Grant
    Filed: March 29, 1993
    Date of Patent: December 13, 1994
    Assignee: Motorola, Inc.
    Inventors: Anthony J. Suppelsa, Fadia Nounou, Anthony B. Suppelsa
  • Patent number: 5311059
    Abstract: A semiconductor device package comprises a substrate (20) having a metallization pattern (22) on at least one surface, and a semiconductor device (10) having an active surface (12) and a grounded surface (14) on opposed sides. The semiconductor device is electrically attached to the substrate metallization pattern with the active surface (12) facing the substrate. A polymeric underfill material (30) substantially fills the space between the semiconductor device and the substrate. An electrically conductive material (35) covers the exposed grounded surface (14) of the semiconductor device and at least a portion of the metallization pattern (22), providing electrical connection between the grounded surface of the semiconductor and the metallization pattern (22) on the substrate.
    Type: Grant
    Filed: January 24, 1992
    Date of Patent: May 10, 1994
    Assignee: Motorola, Inc.
    Inventors: Kingshuk Banerji, Fadia Nounou, William B. Mullen, III
  • Patent number: 5122200
    Abstract: Solder pastes having vehicles including formic acid-soluble organic acids as fluxing agents are described. Fluxing agents may be compounds of the formula: ##STR1## where R is an electron withdrawing group. In one embodiment, R is selected from the group consisting of fluorine, chlorine, bromine, iodine, sulfur, hydroxyl, nitrile, and benzyl. Other suitable formic-acid fluxing agents include, but are not limited to, adipic acid, acrylic acid, polyacrylic acid, methacrylic acid and polymethacrylic acid. The compounds clean oxides from the printed circuit boards (PCBs) under assembly and then volatilize leaving a residue to be cleaned away. The cleaning step involves rinsing with formic acid. No undesired residue remains indicating that the organic acids of the invention are effective in cleaning boards.
    Type: Grant
    Filed: September 17, 1990
    Date of Patent: June 16, 1992
    Assignee: Motorola, Inc.
    Inventors: James L. Davis, Robert W. Pennisi, Fadia Nounou, Robert J. Mulligan, Bobby D. Landreth
  • Patent number: 5116433
    Abstract: A solder paste is formulated by combining a solder paste vehicle, a resin, and solder alloy particles. The solder paste vehicle is made by combining mono and polyfunctional alcoholic solvents with a fluxing agent. The solder particles are first reacted with a formate ion produced by formic acid, formaldehyde, paraformaldehyde, or mixtures thereof, in order to create a metal-formate complex that functions as an oxygen scavenger on the surface of the solder alloy particles.
    Type: Grant
    Filed: October 31, 1990
    Date of Patent: May 26, 1992
    Assignee: Motorola, Inc.
    Inventors: James L. Davis, Fadia Nounou, Anthony B. Suppelsa, Robert W. Pennisi
  • Patent number: 5092943
    Abstract: Solder pastes having vehicles including blends of low boiling point alcohols and relatively high boiling point alcohols are described which leave residues which may be cleaned using only water are described. The low boiling point alcohols have a boiling point range of between about 65.degree. and about 150.degree. C. whereas the high boiling point alcohols have a boiling point in rhe range of about 150.degree. to about 270.degree. C. The solder pastes also use water-soluble organic acids as fluxing agents such as compounds of the formula: ##STR1## where R is an electron withdrawing group such as fluorine, chlorine, bromine, iodine, sulfur, hydroxyl, nitrile, and benzyl. Other suitable formic-acid fluxing agents include, but are not limited to, adipic acid, polyacrylic acid, methacrylic acid and polymethacrylic acid. The compounds clean oxides from the printed circuit boards (PCBs) under assembly and then volatilze leaving a residue to be cleaned away. The cleaning step involves rinsing with water.
    Type: Grant
    Filed: September 17, 1990
    Date of Patent: March 3, 1992
    Assignee: Motorola, Inc.
    Inventors: James L. Davis, Robert W. Pennisi, Fadia Nounou, Bobby D. Landreth, Robert J. Mulligan
  • Patent number: 5064481
    Abstract: Fluxing compositions are described containing as fluxing agents compounds of the formula: ##STR1## where R is an electron withdrawing group. In one embodiment, R is selected from the group consisting of fluorine, chlorine, bromine, iodine, sulfur, hydroxyl, nitrile, and benzyl. The compound cleans oxides from the printed circuit boards (PCBs) under assembly and then volatilize with little or no need for a cleaning step, or cleaning only with water or formic acid. Very little or no undesired residue remains. Such acid fluxing agents can be used mixed with typical solder formulations, such as lead/tin solder pastes, or applied topically to solders, such as solder balls; both techniques permit the assembly of PCBs more easily with high quality bonds, and with little or no residue. Malic acid is a preferred organic acid fluxing agent.
    Type: Grant
    Filed: May 17, 1990
    Date of Patent: November 12, 1991
    Assignee: Motorola, Inc.
    Inventors: James L. Davis, Robert W. Pennisi, Fadia Nounou, Bobby D. Landreth
  • Patent number: 5045128
    Abstract: Fluxing compositions containing compounds that generate acids upon photoinitiation from a light source such as Hg/Xe ultraviolet (UV) light sources are described. The acids clean oxides from the printed circuit boards (PCBs) under assembly and then volatilize with little or no need for a cleaning step, or cleaning only with water. The compounds that release an oxide removing agent, sometimes called a "photoacid" include metal and organic onium salts and furyl compounds bearing a carbonyl group. Such fluxing compositions can be used mixed with typical solder formulations, such as lead/tin solders, or applied topically thereto; both techniques permit the assembly of PCBs more easily and with high quality bonds.
    Type: Grant
    Filed: August 13, 1990
    Date of Patent: September 3, 1991
    Assignee: Motorola, Inc.
    Inventors: Bobby D. Landreth, Robert W. Pennisi, James L. Davis, Fadia Nounou
  • Patent number: 5028399
    Abstract: A manifold (10) for use in a gas solder-reflow oven (50) comprises a hollow tube made from a transition metal having an open end (18) for receiving gas, a closed end (16), and a plurality of holes (12).
    Type: Grant
    Filed: January 12, 1990
    Date of Patent: July 2, 1991
    Assignee: Motorola, Inc.
    Inventors: Anthony B. Suppelsa, Robert W. Pennisi, Fadia Nounou, James L. Davis
  • Patent number: 4995921
    Abstract: Solder paste vehicles using blends of monofunctional and polyfunctional alcohols are described. The blend may have a major portion of a low viscosity, monofunctional alcohol solvent and a minor portion of a high viscosity polyfunctional alcohol thickener. The monohydric solvent has a room temperature viscosity of at least 3 centipoise and from about 3 to 18 carbon atoms and may include such materials as 2-butanol, 1-hexanol, 1-heptanol, 1-octanol, 1-nonanol, 1-dodecanol, 2-ethoxyethanol, 2-(2-ethoxyethoxy)ethanol, 2-(2-butoxyethoxy)ethanol, n-hexadecanol, n-octadecanol, benzyl alcohol and mixtures thereof. The polyalcohol has a room temperature viscosity of between about 26 to about 1500 cp and includes compounds such as 1,2-ethanediol; 1,2-propanediol; 1,3-propanediol; 1,2-butanediol; 1,3-butanediol; 1,4-butanediol; 1,2-pentanediol; 1,5-pentanediol; 2,4-pentanediol; 2,5-hexane-diol; glycerol; 1,2,4-butanetriol; 2,2'-(ethylenedioxy)diethanol; 1,12-dodecane-diol; 1,16-hexanedecanediol and mixtures thereof.
    Type: Grant
    Filed: May 11, 1990
    Date of Patent: February 26, 1991
    Assignee: Motorola, Inc.
    Inventors: James L. Davis, Robert W. Pennisi, Fadia Nounou, Bobby D. Landreth