Abstract: A system and method for manufacturing a semiconductor device including multi-layer bitlines. The location of the bitlines in multiple layers provides for increased spacing and increased width thereby overcoming the limitations of the pitch dictated by the semiconductor fabrication process used. The bitlines locations in multiple layers thus allows the customization of the spacing and width according to the use of a semiconductor device.

Abstract: A hybrid memory system is provided that combines the advantages of NAND flash memory devices with the advantages of NOR flashes memory devices. The system includes a NAND flash memory portion to provide mass storage and fast programming/erasure capabilities of conventional NAND flash memory devices. The system further comprises a NOR flash memory portion to provide code storage and fast random reading capabilities of conventional NOR flash memory devices. Accordingly, the hybrid memory system provides both mass storage and code storage along with fast programming/erasure speeds and fast random access speeds.

Abstract: A memory device includes a sense amplifier to sense the state of a bitcell. The sense amplifier includes two input terminals connected via a switch. One of the input terminals is connected to a node, whereby a current through the node represents a difference in current drawn by a bitcell and a reference current. During a first phase, the switch between the input terminals of the sense amplifier is closed, so that a common voltage is applied to both input terminals. During a second phase, the switch is opened, and the sense amplifier senses a state of information stored at the bitcell based on the current through the node. By using the switch to connect and disconnect the inputs of the sense amplifier in the two phases, the accuracy and speed with which the state of the information stored at the bitcell can be determined is improved.

Abstract: A system and method for manufacturing a semiconductor device including multi-layer bitlines. The location of the bitlines in multiple layers provides for increased spacing and increased width thereby overcoming the limitations of the pitch dictated by the semiconductor fabrication process used. The bitlines locations in multiple layers thus allows the customization of the spacing and width according to the use of a semiconductor device.

Abstract: A memory device includes a sense amplifier to sense the state of a bitcell. The sense amplifier includes two input terminals connected via a switch. One of the input terminals is connected to a node, whereby a current through the node represents a difference in current drawn by a bitcell and a reference current. During a first phase, the switch between the input terminals of the sense amplifier is closed, so that a common voltage is applied to both input terminals. During a second phase, the switch is opened, and the sense amplifier senses a state of information stored at the bitcell based on the current through the node. By using the switch to connect and disconnect the inputs of the sense amplifier in the two phases, the accuracy and speed with which the state of the information stored at the bitcell can be determined is improved.

Abstract: A method and apparatus are provided for high performance, high voltage memory operations on selected memory cells (200) of a semiconductor memory device (100). A high voltage generator (106) during program or erase operations provides a continuous high voltage level (702) on selected word lines (502) and maintains a continuous high voltage level supply to a bit line decoder (120) which sequentially provides the high voltage level (706) to a first portion of bit lines (504) and discharges (708) those bit lines (504) before providing the high voltage level to a second portion (710).

Abstract: Systems and methodologies are provided herein for increasing operation speed uniformity in a flash memory device. Due to the characteristics of a typical flash memory array, memory cells in a memory array may experience distributed substrate resistance that increases as the distance of the memory cell from an edge of the memory array increases. This difference in distributed substrate resistance can vary voltages supplied to different memory cells in the memory array depending on their location, which can in turn cause non-uniformity in the speed of high voltage operations on the memory array such as programming. The systems and methodologies provided herein reduce this non-uniformity in operation speed by providing compensated voltage levels to memory cells in a memory array based at least in part on the location of each respective memory cell.

Abstract: A hybrid memory system is provided that combines the advantages of NAND flash memory devices with the advantages of NOR flashes memory devices. The system includes a NAND flash memory portion to provide mass storage and fast programming/erasure capabilities of conventional NAND flash memory devices. The system further comprises a NOR flash memory portion to provide code storage and fast random reading capabilities of conventional NOR flash memory devices. Accordingly, the hybrid memory system provides both mass storage and code storage. along with fast programming/erasure speeds and fast random access speeds.

Abstract: Systems and methodologies are provided herein for increasing operation speed uniformity in a flash memory device. Due to the characteristics of a typical flash memory array, memory cells in a memory array may experience distributed substrate resistance that increases as the distance of the memory cell from an edge of the memory array increases. This difference in distributed substrate resistance can vary voltages supplied to different memory cells in the memory array depending on their location, which can in turn cause non-uniformity in the speed of high voltage operations on the memory array such as programming. The systems and methodologies provided herein reduce this non-uniformity in operation speed by providing compensated voltage levels to memory cells in a memory array based at least in part on the location of each respective memory cell.

Abstract: A method and apparatus are provided for high performance, high voltage memory operations on selected memory cells (200) of a semiconductor memory device (100). A high voltage generator (106) during program or erase operations provides a continuous high voltage level (702) on selected word lines (502) and maintains a continuous high voltage level supply to a bit line decoder (120) which sequentially provides the high voltage level (706) to a first portion of bit lines (504) and discharges (708) those bit lines (504) before providing the high voltage level to a second portion (710).

Abstract: A method and apparatus are provided for high performance, high voltage memory operations on selected memory cells (200) of a semiconductor memory device (100). A high voltage generator (106) during program or erase operations provides a continuous high voltage level (702) on selected word lines (502) and maintains a continuous high voltage level supply to a bit line decoder (120) which sequentially provides the high voltage level (706) to a first portion of bit lines (504) and discharges (708) those bit lines (504) before providing the high voltage level to a second portion (710).

Abstract: A method and apparatus are provided for high performance, high voltage memory operations on selected memory cells (200) of a semiconductor memory device (100). A high voltage generator (106) during program or erase operations provides a continuous high voltage level (702) on selected word lines (502) and maintains a continuous high voltage level supply to a bit line decoder (120) which sequentially provides the high voltage level (706) to a first portion of bit lines (504) and discharges (708) those bit lines (504) before providing the high voltage level to a second portion (710).