Patents by Inventor Fang Cheng

Fang Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11996328
    Abstract: A method for forming a gate structure includes forming a trench within an interlayer dielectric layer (ILD) that is disposed on a semiconductor substrate, the trench exposing a top surface of the semiconductor substrate, forming an interfacial layer at a bottom of the trench, forming a dielectric layer within the trench, forming a work function metal layer on the dielectric layer, forming an in-situ nitride layer on the work function metal layer in the trench, performing a first cobalt deposition process to form a cobalt layer within the trench, performing a second cobalt deposition process to increase a thickness of the cobalt layer within the trench, and performing an electrochemical plating (ECP) process to fill the trench with cobalt.
    Type: Grant
    Filed: July 19, 2022
    Date of Patent: May 28, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chung-Liang Cheng, Ziwei Fang
  • Publication number: 20240153924
    Abstract: A manufacturing method of an electronic device is disclosed by the present disclosure. The manufacturing method includes providing a substrate, wherein the substrate includes a plurality of working areas, and each of the plurality of working areas includes a plurality of first recesses and a plurality of second recesses; disposing a plurality of first electronic units in the plurality of first recesses of the plurality of working areas through fluid transfer; identifying a defective working area from the plurality of working areas, wherein at least one of the plurality of first recesses of the defective working area has no electronic unit or a defective first electronic unit disposed therein; and disposing at least one repairing electronic unit in at least one of the plurality of second recesses of the defective working area through laser transfer.
    Type: Application
    Filed: October 3, 2023
    Publication date: May 9, 2024
    Applicant: InnoLux Corporation
    Inventors: Fang-Ying Lin, Kai Cheng, Ming-Chang Lin, Tsau-Hua Hsieh
  • Publication number: 20240149057
    Abstract: A device for treating a user's skin using plasma is provided. The device comprises a plasma generation assembly and a power supply. The plasma generation assembly comprises a discharge electrode including a first surface; a first dielectric material layer provided on the first surface of the discharge electrode and the first surface, a ground electrode surrounding the discharge electrode, and an insulation member spacing around the discharge electrode from the ground electrode. The power supply configured to apply power to the plasma generation assembly so that plasma is generated from the first surface of the discharge electrode to the ground electrode and between the first dielectric material layer and the user's skin.
    Type: Application
    Filed: November 4, 2022
    Publication date: May 9, 2024
    Inventors: HUI-FANG LI, YU-TING LIN, CHUN-HAO CHANG, CHIH-TUNG LIU, CHUN-PING HSIAO, YU-PIN CHENG
  • Patent number: 11978781
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate containing a first active region in a first region of the substrate and a second active region in a second region of the substrate, a plurality of first gate structures over the first active region each including a first gate stack having a first high-k gate dielectric and a first gate electrode and first gate spacers surrounding the first gate stack, and a plurality of second gate structures over the second active region each including a second gate stack having a second high-k gate dielectric and a second gate electrode and second gate spacers surrounding the second gate stack. At least a portion of the second gate electrode comprises dopants.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: May 7, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Anhao Cheng, Fang-Ting Kuo, Yen-Yu Chen
  • Publication number: 20240145280
    Abstract: The present application discloses a method for analyzing a layout pattern density, comprising: step 1, providing layouts of a chip, and merging the layouts to form a wafer level layout, wherein the wafer level layout presents a first circle in a top view, and the layout comprises a plurality of mask layers; step 2, segmenting the first circle to form a plurality of check windows; step 3, searching for the mask layer containing the patterns having a height morphology, and combining the found mask layers into a pattern layer combination; step 4, sequentially calculating a pattern density of the pattern layer combination in each check window; and step 5, recording the pattern density in each check window on a third circle to form a wafer level pattern density distribution diagram. The present application can predict a height morphology of a top surface of a wafer related to a layout.
    Type: Application
    Filed: June 27, 2023
    Publication date: May 2, 2024
    Applicant: Shanghai Huali Microelectronics Corporation
    Inventors: Wei CHENG, Zhonghua ZHU, Fang WEI
  • Publication number: 20240139199
    Abstract: The present disclosure provides a use of a pharmaceutical composition including adenine and/or a pharmaceutically acceptable salt thereof in a manufacture of a medicament for treating diabetic ulcers, and the medicament can effectively accelerate and enhance wound healing of diabetic ulcers and prevent scar formation.
    Type: Application
    Filed: March 25, 2022
    Publication date: May 2, 2024
    Inventors: Jen-Yi Chio, Han-Min Chen, Jiun-Tsai Lin, Yi-Fang Cheng, Guang-Huar Young, Chun-Fang Huang
  • Patent number: 11973067
    Abstract: Methods for manufacturing a display device are provided. The methods include providing a plurality of light-emitting units and a substrate. The methods also include transferring the light-emitting units to a transfer head. The methods further include attaching at least one of the plurality of light-emitting units on the transfer head to the substrate by a bonding process, wherein the transfer head and the substrate satisfy the following equation during the bonding process: 0 ? ? ? T ? ? 1 T ? ? 2 ? A ? ( T ) ? dT - ? T ? ? 1 T ? ? 3 ? E ? ( T ) ? dT ? ? < 0.01 wherein A(T) is the coefficient of thermal expansion of the transfer head, E(T) is the coefficient of thermal expansion of the substrate, T1 is room temperature, T2 is the temperature of the transfer head, and T3 is the temperature of the substrate.
    Type: Grant
    Filed: August 24, 2021
    Date of Patent: April 30, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Tung-Kai Liu, Tsau-Hua Hsieh, Fang-Ying Lin, Kai Cheng, Hui-Chieh Wang, Shun-Yuan Hu
  • Publication number: 20240135846
    Abstract: An electronic device and a manufacturing method thereof are provided. The manufacturing method of the electronic device includes the following. A substrate is provided. A plurality of electronic units are transferred to the substrate. The electronic units are inspected to obtain M first defect maps. The M first defect maps are integrated into N second defect maps, where N<M. M repairing groups are provided according to the N second defect maps. Each of the repairing groups includes at least one repairing electronic unit. The M repairing groups are transferred to the substrate. At least two of the repairing groups have the same location distribution of repairing electronic units, and the location distribution is consistent with a defect distribution of one of the second defect maps.
    Type: Application
    Filed: September 17, 2023
    Publication date: April 25, 2024
    Applicant: Innolux Corporation
    Inventors: Kai Cheng, Fang-Ying Lin, Ming-Chang Lin, Tsau-Hua Hsieh
  • Publication number: 20240128531
    Abstract: The present disclosure discloses a method for recycling all types of lithium batteries. First, the lithium battery waste is acid-leached to obtain a solution containing most of metal ions. After filtering, the solution is separated from the remaining solids, and then the obtained solution is subjected to separate precipitation many times. After separately adjusting the pH value of the solution many times, adding precipitants with a high selectivity ratio, and matching with filtration and separation reaction, all ions in the lithium battery waste are sequentially precipitated in forms of iron phosphate (FePO4), aluminum hydroxide (Al(OH)3), manganese oxide (MnO2), dicobalt trioxide (cobalt oxide, Co2O3), nickel hydroxide (Ni(OH)2), and lithium carbonate (Li2CO3).
    Type: Application
    Filed: September 24, 2023
    Publication date: April 18, 2024
    Applicant: Cleanaway Company Limited
    Inventors: CHIH-HUANG LAI, HSIN-FANG CHANG, TZU-MIN CHENG, YUNG-FA YANG, TSUNG-TIEN CHEN, ZHENG-YU CHENG, CHI-YUNG CHANG
  • Publication number: 20240130156
    Abstract: A light-emitting element includes a pair of electrodes, a first light-emitting unit, a second light-emitting unit, and a charge generation layer. The first light-emitting unit, between the pair of electrodes, and the first light-emitting unit, includes a first light-emitting layer. The second light-emitting unit, between the pair of electrodes, includes a second light-emitting layer. A first luminescent layer includes a first main body material, a second main body material, a first guest material, and a first auxiliary material, and the first main body material forms a first excimer complex with the second main body material. A first excited triplet state energy level of the first auxiliary material is lower than a first excited triplet state energy level of the first excimer complex, and the first excited triplet state energy level of the first auxiliary material is higher than that of the first guest material.
    Type: Application
    Filed: September 26, 2023
    Publication date: April 18, 2024
    Applicant: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventors: Yu ZHANG, Li YUAN, Munjae LEE, Wenxu XIANYU, Jie YANG, Huizhen PIAO, Mugyeom KIM, Xianjie LI, Jing HUANG, Fang WANG, Kailong WU, Lin YANG, Yu GU, Mingzhou WU, Jingyao SONG, Danhua SHEN, Guo CHENG
  • Patent number: 11962014
    Abstract: Electrodeposited copper foils having adequate puncture strength to withstand both pressure application during consolidation with negative electrode active materials during manufacture, as well as expansion/contraction during repeated charge/discharging cycles when used in a rechargeable secondary battery are described. These copper foils find specific utility as current collectors in rechargeable secondary batteries, particularly in lithium secondary battery with high capacity. Methods of making the copper foils, methods of producing negative electrode for use in lithium secondary battery and lithium secondary battery of high capacity are also described.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: April 16, 2024
    Assignee: CHANG CHUN PETROCHEMICAL CO., LTD.
    Inventors: Huei-Fang Huang, Kuei-Sen Cheng, Yao-Sheng Lai, Jui-Chang Chou
  • Patent number: 11959982
    Abstract: A low-cost modular liquid nitrogen low-temperature multi-nuclear magnetic resonance probe includes a Dewar, a pluggable coil and a front-end gain amplifier. The Dewar includes a cylindrical sandwich chamber, the center of the cylindrical sandwich chamber constitutes a room-temperature chamber, a sandwich of the cylindrical sandwich chamber is divided into a vacuum chamber and a liquid nitrogen chamber by a liquid nitrogen vessel wall, the vacuum chamber is located between the room-temperature chamber and the liquid nitrogen chamber, the pluggable coil and the front-end gain amplifier are provided in the vacuum chamber, the pluggable coil comprises a coil portion and a pluggable base, the coil portion is in pluggable connection with the pluggable base, and the pluggable coil is connected with the front-end gain amplifier. The probe realizes the transmission of radio frequency pulses and the reception of magnetic resonance signals, and is applicable to whole-body imaging of a small animal.
    Type: Grant
    Filed: November 10, 2021
    Date of Patent: April 16, 2024
    Assignee: INNOVATION ACADEMY FOR PRECISION MEASUREMENT SCIENCE AND TECHNOLOGY, CAS
    Inventors: Zhi Zhang, Qingjia Bao, Chaoyang Liu, Xinjie Liu, Fang Chen, Jiaxin Wang, Xin Cheng, Maili Liu
  • Publication number: 20240121369
    Abstract: The present disclosure provides a screen detection method, an apparatus and a device, a computer program and a readable medium, and belongs to the technical field of screens. The method includes: receiving a cylindrical lens detection instruction for a target screen, wherein the cylindrical lens detection instruction at least includes target viewpoints; acquiring browsing images shot from the target screen under the target viewpoints in response to the detection instruction, wherein the target screen is a screen of which the light emission side is provided with cylindrical lenses; using the browsing images as viewpoint images under the condition that the browsing images include target contents; and outputting detection parameters of the cylindrical lenses on the target screen based on image parameters of the viewpoint images.
    Type: Application
    Filed: May 28, 2021
    Publication date: April 11, 2024
    Inventors: Jian GAO, Sen MA, Fang CHENG, Tao HONG, Jinye ZHU, Pengxia LIANG, Jing YU
  • Patent number: 11955579
    Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate, wherein the first pattern array includes an adhesive layer. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate and forming the first pattern array on a third substrate. The method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate, and reducing an adhesion force of a portion of the adhesive layer. The method also includes forming a second pattern array on a fourth substrate, and transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: April 9, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Kai Cheng, Tsau-Hua Hsieh, Fang-Ying Lin, Tung-Kai Liu, Hui-Chieh Wang, Chun-Hsien Lin, Jui-Feng Ko
  • Patent number: 11949040
    Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of diodes on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of diodes from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of diodes from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of diodes from the third substrate to the fourth substrate. The pitch between the plurality of diodes on the first substrate is different from the pitch of the first pattern array.
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: April 2, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Kai Cheng, Tsau-Hua Hsieh, Fang-Ying Lin, Tung-Kai Liu, Hui-Chieh Wang, Chun-Hsien Lin, Jui-Feng Ko
  • Patent number: 11947206
    Abstract: An electronic device is provided. The electronic device includes a backboard, a circuit board disposed on the backboard, a light source disposed on the circuit board, a housing disposed on the backboard, and a panel disposed on the housing. The panel contacts the housing, and the light source and the circuit board are disposed between the panel and the backboard.
    Type: Grant
    Filed: February 24, 2023
    Date of Patent: April 2, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Fang-Cheng Jhou, Tsu-Hsien Ku
  • Publication number: 20240105132
    Abstract: A device may include an electronic display having a backlight that generates light and multiple display pixels that modulate the amount of generated light emitted from the electronic display based on compensated image data. The backlight may include multiple illuminators that generate the light, and a first color component illuminator may have a slower response rate than a second color component illuminator. The device may also include image processing circuitry that generates the compensated image data by compensating input image data for a color shift associated with a change in brightness of the backlight and the slower response rate of the first color component illuminator. The input image data may be compensated by increasing first color component pixel values of the input image data relative to second color component pixel values of the input image data, and the compensated image data may be output to the electronic display.
    Type: Application
    Filed: August 21, 2023
    Publication date: March 28, 2024
    Inventors: Chengrui Le, Fang-Cheng Lin, Alexey Kornienko
  • Patent number: D1019739
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: March 26, 2024
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chen-Hsien Cheng, Li-Fang Chen, Ruei-Hong Hong, Ting-Wei Wu
  • Patent number: D1024640
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: April 30, 2024
    Assignees: King Slide Works Co., Ltd., King Slide Technology Co., Ltd.
    Inventors: Fang-Cheng Su, Ci-Bin Huang, Ching-Fu Chiu, Shu-Chen Lin
  • Patent number: D1025077
    Type: Grant
    Filed: June 22, 2022
    Date of Patent: April 30, 2024
    Inventor: Fang Cheng