Abstract: A wire soldered structure includes a substrate including a main body, a first conducting layer disposed on the main body, and a through hole extending through the main body and the first conducting layer; a wire including a soldered portion that is disposed on the first conducting layer and that is adjacent to the through hole; and a solder disposed in the through hole; wherein the soldered portion of the wire is soldered to the first conducting layer of the substrate via the solder.

Abstract: An endoscope device, a flexible printed circuit board assembly and a flexible printed circuit board thereof are provided. The flexible printed circuit board includes a sensing module carrier portion, a first body portion, a second body portion, a third body portion, a fourth body portion and a light-emitting element carrier portion. The first body portion and the second body portion are respectively located on opposite sides of the sensing module carrying portion. The fourth body portion is connected with the second body portion, and the third body portion and the fourth body portion are respectively located on opposite sides of the sensing module carrying portion. The light-emitting element carrier portion includes a first carrier side portion connected to the third body portion and a second carrier side portion connected to the third body portion. The first and the second carrier side portions are separated from each other.

Abstract: A wire soldered structure includes a substrate including a main body, a first conducting layer disposed on the main body, and a through hole extending through the main body and the first conducting layer; a wire including a soldered portion that is disposed on the first conducting layer and that is adjacent to the through hole; and a solder disposed in the through hole; wherein the soldered portion of the wire is soldered to the first conducting layer of the substrate via the solder.